A492. Zi-Xu Chen, Zih-You Wu, Ta-Wei Lin, Shou-Yi Chang, Jenq-Gong Duh, "Growth kinetics and microstructure evolution of network-like Cu3Sn during thermal aging in Ni/Sn–3.5Ag/Cu transient liquid-phase bonding", Materials Letters, Volume 377, October 2024, 137504

A491. Yi-Chen Li, Yin-Ku Lee, Zih-You Wu, Su-Yueh Tsai, Shou-Yi Chang, Jenq-Gong Duh,  "Effect of Ag addition on the mechanical properties of Cu/Ni/Sn/Ni/Cu microbump with a sub-10 micron bump thickness", Journal of Materials Science: Materials in Electronics 35, 1839, October 2024

A490. Che-Ya Wu, Shih-Nan Hsiao, Rui-Tung Kuo, Yu-Ching Chen, Tzu-Ying Lin, Masaru Hori, Jenq-Gong Duh, "Surface surgery on TiNb2O7 electrode via N2/Air atmospheric pressure plasma jet for high-rate lithium-ion battery anode", Applied Surface Science, Volume 655, April 2024, 159585

A489. Tan-Ling Wang, Sheng-Yu Hsu, Yuan-Tai Lai, Po-Yu Chen, Jenq-Gong Duh, "Influence of silicon content on high temperature tribology performance of TiAlCrSiN coatings", Surface and Coatings Technology, April 2024, 130816

A488. Yun-Chen Chan, Sheng-Yu Hsu, Su-Yueh Tsai, Jenq-Gong Duh, "Effect of silicon contents on mechanical properties and tribological behavior of (AlCrNbTiMoSix) N multicomponent nitride coatings fabricated by radio-frequency magnetron co-sputtering", Surface and Coatings Technology, April 2024, 130793

A487. Zih-You Wu, Yin-Ku Lee, Su-Yueh Tsai, Po-Yu Chen, Jenq-Gong Duh, "Alteration of Cu3Sn growth and retention of multi-orientation Cu6Sn5 during thermal aging in Cu-xNi-yZn/Sn3.5Ag/Cu transient liquid-phase bonding", Materials Characterization, Volume 207, January 2024, 113490

A486. Sheng-Yu Hsu, Yuan-Tai Lai, Su-Yueh Tsai, Jenq-Gong Duh, "On the correlations between mechanical properties, oxidation behaviors and high temperature wear resistance of AlCrSiTiN coatings: A combinatorial study", Surface and Coatings Technology, Volume 475, 25 December 2023, 130153

A485. Sheng-Yu Hsu, Chong-Chi Chi, Ming-Yen Lu, Shou-Yi Chang, Yuan-Tai Lai, Su-Yueh Tsai, Jenq-Gong Duh, "Hard yet tough thermodynamics-driven nanostructured (AlCrNbSixTi)N multicomponent nitride hard coating", Journal of Alloys and Compounds, Volume 947, 25 June 2023, 169645

A484. Yin-Ku Lee, Zih-You Wu, Pin-Wei Huang, Chen-Sung Chao, Su-Yueh Tsai, Shou-Yi Chang, Jenq-Gong Duh, "Grain modification and formation of tough IMC phase in submicron Sn–Ag microbumps via doping Zn and Ni in Cu substrate",Vacuum, Volume 217, November 2023, 112531

A483. Chen-Sung Chao, Zih-You Wu, Yin-Ku Lee, Pin-Wei Huang, Shou-Yi Chang, Su-Yueh Tsai, Jenq-Gong Duh, "Retaining multi-oriented and fine grain structure with Ni doping in Cu/Sn-3.0Ag-0.5Cu/Cu transient liquid phase bonding under isothermal aging treatment", Materials Chemistry and Physics: Volume 305, 1 September 2023, 127951

A482. Yun-Chen Chan, Yuan-Tai Lai, Sheng-Yu Hsu, Po-Yu Chen, Jenq-Gong Duh "Effects of Plasma-Activated Water via Different Gas Treatments on Coffee Ground Decomposition" IEEE Transactions on Plasma Science,18 July 2023

A481. Tzu-Ling Chen, Sheng-Yu Hsu, Yuan-Tai Lai, Shou-Yi Chang, Hsueh-Hsing Hung, Su-Yueh Tsai, Jenq-Gong Duh, "Influence of boron contents on mechanical properties and high-temperature tribological behavior in (AlCrNbTiB)N coatings", J. Vac. Sci. Technol,Volume 41, Issue 4, July 2023, 043101

A480. Chen-Sung Chao, Zih-You Wu, Yin-Ku Lee, Pin-Wei Huang, Shou-Yi Chang, Su-Yueh Tsai, Jenq-Gong Duh, "Enhancing mechanical properties via the dual effect of Ni addition and temperature gradient for 5 μm Cu/Sn-3.0Ag-0.5Cu/Cu transient liquid phase bonding", Materials Science and Engineering: A, Volume 870, 12 April 2023, 144863

A479. Pin-Wei Huang, Zih-You Wu, Yin-Ku Lee, Chen-Sung Chao, Su-Yueh Tsai, Shou-Yi Chang, Jenq-Gong Duh, "Microstructure and mechanical strength of Cu/Sn/Cu microbump via Ni and Zn doping into Cu substrate", Materials Chemistry and Physics, Volume 298, 1 April 2023, 127392

A478. Tsai-Ni Ku, Sheng-Yu Hsu, Yuan-Tai Lai, Shou-Yi Chang, Su-Yueh Tsai, Jenq-Gong Duh, "Nano-scale mechanical characteristics of epitaxial stabilization ZrTiN/NbN superlattice coatings", Surface and Coatings Technology, Volume 453, 25 January 2023, 129123

A477. Tzu-Ling Chen, Yuan-Tai Lai, Sheng-Yu Hsu, Shou-Yi Chang, Hsueh-Hsing Hung and Jenq-Gong Duh, "Effect of plasma treatment on ice plant germination and physicochemical surface using dielectric barrier discharge", IEEE Transactions on Plasma Science, 2022

A476. Tsai-Ni Ku, Sheng-Yu Hsu, Yuan-Tai Lai, Shou-Yi Chang and Jenq-Gong Duh, "Plasma-treated soybean dregs solution with various gas mixtures", IEEE Transactions on Plasma Science, 2022

A475. Tzu-Chia Wang, Sheng-Yu Hsu, Yuan-Tai Lai, Su-Yueh Tsai, Jenq-Gong Duh, "Microstructure and high-temperature tribological characteristics of self-lubricating TiAlSiN/VSiN multilayer nitride coatings", Materials Chemistry and Physics, Volume 295, 1 February 2023, 127149

A474. C.Chen, R. Kevorkyants, J.C.Huang, W.J.Zhao, B.J.Liu, J.G.Duh, "Tunable oxygen-vacancy mediated NiCo2O4 microspheres coupled by holey graphene framework with superior lithium-ion storage properties", Materials Chemistry and Physics, Volume 292, 1 December 2022, 126876

A473. Rui-Wen Song, Wei-Yu Chen, Yu-Ching Wang, Zih-You Wu, Su-Yueh Tsai, Jenq-Gong Duh, "Enhancing mechanical strength of full intermetallic microbump via grain refinement by Zn in thermocompression bonding", Materials Chemistry and Physics,Volume 291,2022,126781

A472. Bih-Show Lou, Yen-Yu Chen, Zih-You Wu, Yu-Chu Kuo, Jenq-Gong Duh, Jyh-Wei Lee, "(Fe,Mn)3AlCx κ-carbide formation and characterization in pack aluminization of Fe–29Mn–9Al–0.9C lightweight steel", Journal of Materials Research and Technology, Volume 20, September–October 2022, Pages 1524-1532

A471. Tzu-Chia Wang, Sheng-Yu Hsu, Yuan-Tai Lai, Jenq-Gong Duh, "Improving the Growth Rate of Lettuce Sativa Young Plants via Plasma-Activated Water Generated by Multitubular Dielectric Barrier Discharge Cold Plasma System", IEEE Transactions on Plasma Science, 2022, p1-6, doi: 10.1109/TPS.2022.3179734.

A470. Sheng-Yu Hsu, Yuan-Tai Lai, Shou-Yi Chang, Su-Yueh Tsai, Jenq-Gong Duh, "Combinatorial synthesis of reactively co-sputtered high entropy nitride (HfNbTiVZr)N coatings: Microstructure and mechanical properties", Surface and Coatings Technology, Volume 442, 25 July 2022, 128564

​A469. Che-Ya Wu, Tzu-Ying Lin, Jenq-Gong Duh, "Constructing cellulose nanofiber / Si composite 3D-Net structure from waste rice straw via freeze drying process for lithium-ion battery anode materials", Materials Chemistry and Physics,  Volume 285,(2022),126107

A468. Zih-You Wu, Tzu-Chia Wang, Yu-Ching Wang, Rui-Wen Song, Su-Yueh Tsai, Jenq-Gong Duh,Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu transient liquid phase bonding for advanced electronic packaging, Journal of Materials Science: Materials in Electronics, Volume 33, (2022), 3016–3023

A467. Ying-Yang Li, Che-Ya Wu, Tzu-Ying Lin, Jenq-Gong Duh, "Fabrication of Silicon/Carbon Composite Material with Silicon Waste and Carbon Nanofiber Applied in Lithium-Ion Battery", Journal of Environmental Protection, 13, (2022), 131009 

A466. Vojislav V. Mitić, Collin Fleshman, Jenq-Gong Duh, Ivana D. Ilić, Goran Lazović, "The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging", Modern Physics Letters B, 35, (2021), 2150427

A465. Tzu-Chieh Huang, Sheng-Yu Hsu, Yuan-Tai Lai, Su-Yueh Tsai, Jenq-Gong Duh, "Effect of NiTi metallic layer thickness on scratch resistance and wear behavior of high entropy alloy (CrAlNbSiV) nitride coating", Surface and Coatings Technology, 425, (2021), 127713

A464. Jie Fenga, Yun-Shan Jiang, Fu-Da Yu, Wang Ke, Lan-Fang Que, Jenq-Gong Duh, Zhen-Bo Wang, "Understanding Li roles in chemical reversibility of O2-type Li-rich layered cathode materials", Journal of Energy Chemistry, 10, (2021)

A463. Yu-Chia Lin, Sheng-Yu Hsu, Yuan-Tai Lai, Pei-Hung Kuo, Su-YuehTsai, Jenq-Gong Duh, "Effect of the N2/(Ar+N2) ratio on mechanical properties of high entropy nitride (Cr0.35Al0.25Nb0.12Si0.08V0.20)Nx films", Materials Chemistry and Physics, 272, (2021), 125195

A462. Pei-Hung Kuo, Su-Yueh Tsai, Jenq-Gong Duh, "Bio-compatible Zirconium-based thin film metallic glasses with nitrogen reinforced by micro-alloying technique", Materials Chemistry and Physics, 272,  (2021), 124965

A461. Che-Ya Wu, Pei-Hung Kuo, Jenq-Gong Duh, "Reviving of silicon waste with N-doped carbon core-shell structure prepared by vapor deposition polymerization of polypyrrole applied in lithium-ion battery",Surface and Coatings Technology 421, (2021), 127418​

A460.​ Tzu-Chieh Huang, Yuan-Tai Lai, Pei-Hung Kuo, Sheng-Yu Hsu, Jenq-Gong Duh, "Activation of soy waste solution through plasma treatment", MRS Advances, 6, (2021), 386–390​

A459. Zhe-Yuan Wu, Che-Ya Wu, Jenq-Gong Duh, "Facile synthesis of boron-doped graphene-silicon conductive network composite from recycling silicon for Lithium-ion batteries anodes materials", ​Materials Letters, 296, (2021), 129875​

A458. Ya-Ting Tsai, Che-Ya Wu, Jenq-Gong Duh, "Synthesis of Ni-rich NMC cathode material by redox-assisted deposition method for lithium ion batteries", ​Electrochimica Acta, 381, (2021), 138244

A457. Che-Ya Wu, Qi Bao, Ya-Ting Tsai, Jenq-Gong Duh, "Tuning (003) interplanar space by boric acid co-sintering to enhance Li+ storage and transfer in Li(Ni0.8Co0.1Mn0.1)O2 cathode",Journal of Alloys and Compounds,865, (2021), 158806

A456. C.Chen, J.C.Huang,  Jenq-Gong Duh​,"Self-template fabrication of multi-scaled ZnFe2O4 microspheres and their excellent lithium-ion storage properties", Journal of Alloys and Compounds, 862,( 2021), 158342

A455. Yu-Ching Wang, Collin Jordon Fleshman, Rui-Wen Song, Su-Yueh Tsai & Jenq-Gong Duh,"Diversifying grain orientation and expediting 10 μm Cu/Sn/Cu TLP bonding process with Ni doping" Journal of Materials Science: Materials in Electronics, 32, (2021),1-8

A454. Rui Wen Song, Collin Fleshman, Yu Ching Wang, Su Yueh Tsai, Jenq Gong Duh,"IMC suppression and phase stabilization of Cu/Sn-Bi/Cu microbump via Zn doping" Materials Letters, 282, ( 2021), 128735

A453. Rui Wen Song, Collin Fleshman, Z.-Y. Wu, Su Yueh Tsai, Jenq Gong Duh," Increasing mechanical strength and refining grains of Cu-core solder joints with pressurized bonding" Journal of Materials Science: Materials in Electronics, 31, (2020), 1-7

A452. Yu Chia Lin, Sheng-Yu Hsu, Rui-Wen Song, Wei-Li Lo, Yuan-Tai Lai Su-Yueh Tsai, Jenq-GongDuh,"Improving the hardness of high entropy nitride (Cr0.35Al0.25Nb0.12Si0.08V0.20)N coatings via tuning substrate temperature and bias for anti-wear applications"Surface and Coatings Technology,403 ( 2020) 126417

A451. Wei-Li Lo, Sheng-Yu Hsu, Yu-Chia Lin, Su-Yueh Tsai, Yuan-Tai Lai, Jenq-Gong Duh, "Improvement of High Entropy Alloy Nitride Coatings (AlCrNbSiTiMo)N on Mechanical and High Temperature Tribological Properties by Tuning Substrate Bias" Surface and Coatings Technology,401 ( 2020) 126247.

A450. Collin Fleshman, Rui-Wen Song, Su-Yueh Tsai, Jenq-Gong Duh, “Phase identification and interface evolution of ENIG/Cu-core SAC305/ENIG solder joints after the thermal-electric coupling reliability test” Materials Letters,275 (2020)128104

A449. Chia-Yu Su, Che-Ya Wu, Sheng-Yu Hsu, Cheng-Yu Wu, Jenq-Gong Duh, "Improving the electrochemical performance of LiMn0.8Fe0.2PO4 cathode with nitrogen-doped carbon via dielectric barrier discharge plasma" Materials Letters, 272(2020)

A448. Li-Kai Yeh-Liu, Sheng-Yu Hsu, Po-Yu Chen, Jyh-Wei Lee,  Jenq-Gong Duh, "Improvement of CrMoN/SiNx coatings on mechanical and high temperature Tribological properties through biomimetic laminated structure design" Surface and Coatings Technology,  393 ( 2020) 

A447. W.Y.Chen,H.W.Chen, W.P.Li, J.C.Huang, H.S.Yu, J.G.Duh, S.Lana, T.Feng​, "Compositionally modulated microstructure in nano-layered Ni-P metallic glass composite coating prepared by electrodeposition" Surface and Coatings Technology, 389(2020)

A446. Collin Fleshman, Rui-wen Song, Jenq-Gong Duh," Improving shear test performance of SAC305/OSP Cu solder joints by modifying microstructure with minor Ni doping before and after aging"Materials Chemistry and Physics,245,(2020)

A445. Pei-Hung Kuo, Ping-Wen Chen and Jenq-Gong Duh, "Artificial nacre-like layer using layer coating with bioinspired mesolayer insertions", SN Applied Sciences ,2 (2020) 120

A444. Rui-Wen Song, Collin Jordon Fleshman, Hao-Chen, Su-Yueh Tsai, Jenq-Gong Duh, "Suppressing interfacial voids in Cu/In/Cu microbump with Sn and Cu addition", Materials Letters, 259(2020)

​A443. Collin Fleshman, Jenq-Gong Duh, "The Variation of Microstructure and the Improvement of Shear Strength in SAC1205-xNi/OSP Cu Solder Joints Before and After Aging", Journal of Electronic Materials,49 (2019) 196–201 

A442. Masimukku Srinivaas, Cheng-Yu Wu, Jenq-Gong Duh, Yu-Chen Hu and Jyh Ming Wu,"Multi-walled Carbon Nanotubes Decorated Tungsten Ditelluride Nanostars as Anode Material for Lithium-ion　batteries"Nanotechnology，31(2019)

A441. Hao Chen, Tzu-Ting Chou, Collin Jordan Fleshman, Jenq-Gong Duh, ''Investigating the Effect of Ag Content on Mechanical Properties of Sn-Ag-Cu Micro-BGA Joints'', Journal of  Electronic Materials，48 (2019) 

​A440. Tzu-Ting Chou, Rui-Wen Song, Hao Chen, Jenq-Gong Duh, "Low thermal budget bonding for 3D-package by collapse-free hybrid solder", Materials Chemistry and Physics (2019) 

A439. Rui-Wen Song, Tzu-Ting Chou, Collin Jordan Fleshman, Hao Chen and Jenq-Gong Duh, "The Architecture Design and Novel Material Selection for Improved Reliability of Solder Interconnections in Microelectronic Packaging", ECS Trans. ,90(2019), 35-40

A438. Chang Liu, Bing-Hong Chen, Wei-Ren Liu, Jenq-Gong Duh "Synthesis and theoretical calculations of N-doped ZnCo2O4 anode for lithium-ion anode via gradient pressure-induced processes and theoretical calculations", Journal of Alloys and Compounds, 797(2019)978-985

A437. Cheng-Yu Wu, Qi Bao, Yen Chung Lai, Xin Liu, Yu-Chu Lu, Heng Tao and Jenq-Gong Duh " In-situ thermal annealing Pt/Ti interphase layers for epitaxial growth of improved Li(Ni0.5Mn0.3Co0.2)O2 solid thin-film cathodes",Nano Energy,60(2019)784-793

A436. Chang Chen, Hsien-Wei Chen, Cheng-Yu Wu, Jacob Chih-Ching Huang, Jenq-Gong Duh, ''Heterostructural modulation of in situ growth of iron oxide/holey graphene framework nanocomposites as excellent electrodes for advanced lithium-ion batteries'', Applied Surface Science,485(2019)247-254

A435. Ren-Chin Chen, Li-Yin Hsiao, Cheng-Yu Wu, Jenq-Gong Duh,"Facile synthesizing silicon waste/carbon composites via rapid thermal process for lithium-ion battery anode",Journal of Alloys and Compounds,791(2019)19-29

​A434. Fu-Da Yu, Lan-Fang Que, Cheng-Yan Xu, Min-Jun Wang, Gang Sun, Jenq-Gong Duh, Zhen-Bo Wang, "Dual conductive surface engineering of Li-Rich oxides cathode for superior high-energy-density Li-Ion batteries ", Nano Energy, 59, (2019), 527-536

A433. Hou Heng Lin, Hao Yang, Che Ya Wu, Sheng Yu Hsu and Jenq-Gong Duh, "Atmospheric Pressure Plasma Jet Irradiation of N Doped Carbon Decorated on Li4Ti5O12 Electrode as a High Rate Anode Material for Lithium Ion Batteries", Journal of The Electrochemical Society,166(2019)5146-5152

A432. Hao Yang, Yan Wang, Han-Yi Chen and Jenq-Gong Duh,"Synthesis and in-situ investigation of olivine LiMnPO4 composites substituted with tetravalent vanadium in high-rate Li-ion batteries",ACS Applied Energy Materials, 11(2018) 6208–6216

A431. Cheng-Yu Wu, Jenq-Gong Duh,"Ionic network for aqueous-polymer binders to enhance the electrochemical performance of Li-Ion batteries",Journal of Electrochimica Acta,294(2019)22-27

A430. Pei-Hung Kuo, Joseph Lee, and Jenq-Gong Duh,"Ultra-thin metallic glass film of Zr–Cu–Ni–Al–N as diffusion barrier for Cu–Si interconnects under fully recrystallized temperature",J Mater Sci: Mater Electron 29(2018)19554–19557

A429. Hao Yang, Yan Wang, and Jenq-Gong Duh,"Developing a Diamine-Assisted Polymerization Method To Synthesize Nano-LiMnPO4 with N-Doped Carbon from Polyamides for High-Performance Li-Ion Batteries",ACS Sustainable Chem. Eng,10(2018)13302–13311

A428. Tzu-Ting Chou, Collin Jordon Fleshman, Hao Chen and Jenq-Gong Duh,"Improving thermal shock response of interfacial IMCs in Sn–Ag–Cu joints by using ultrathin-Ni/Pd/Au metallization in 3D-IC packages",Journal of Materials Science: Materials in Electronics, 30(2019)2342–2350

A427. Tzu-Ting Chou, Rui-Wen Song, Wei-Yu Chen, and Jenq-Gong Duh, "Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy ",material letter 235(2019)180-183

A426. Tzu-Ting Chou, Wei-Yu Chen, Collin Jordon Fleshman and Jenq-Gong Duh, "Refinement of the β-Sn Grains in Ni-Doped Sn-3.0Ag-0.5Cu Solder Joints with Cu-Based and Ni-Based Substrates", Journal of Electronic Materials 47(2018)2911–2919

A425. Tzu-Ting Chou, Rui-Wen Song, and Jenq-Gong Duh,"Applying SEM, EPMA and EBSD Analytic Techniques on Solder Joint for Microelectronic Package Development", Microscopy and Microanalysis 24(2018)618-619

A424. Cheng-Yu Wu, Wei-En Chang, Yu-Guang Sun, Jyh-MingWu and Jenq-GongDuh,"Three-dimensional S-MoS2@α-Fe2O3 nanoparticles composites as lithium-ion battery anodes for enhanced electrochemical performance",Material Chemistry and Physics,219(2018)311-317

A423. Guan-TingYe, Po-Yu Chen and Jenq-Gong Duh,''Investigation of electrochemical properties of bio-inspired SiOx/PI multilayered thin film anode for lithium ion batteries'',Surface Coatings and Technology,350(2018)773-778

A422. Heng Tao, M.T. Tsai, Hsien-Wei Chen, J.C. Huang and Jenq-Gong Duh,''Improving high-temperature tribological characteristics on nanocomposite CrAlSiN coating by Mo doping'',Surface Coatings and Technology,349(2018)752-756

A421. Wan-Ting Tsou, Cheng-Yu Wu, Hao Yang, Jenq-Gong Duh,''Improving the electrochemical performance of Lithium–Sulfur batteries using an Nb-Doped TiO2 additive layer for the chemisorption of lithium polysulfides'',Journal of Electrochimica Acta,285(2018)16-22

A420. Yan Wang, Cheng-Yu Wu, Hao Yang and Jenq-Gong Duh, "Rational design of a synthetic strategy, carburizing approach and pore-forming pattern to unlock the cycle reversibility and rate capability of microagglomerated LiMn0.8Fe0.2PO4 cathode materials",Journal of Materials Chemistry A,6(2018)10395–10403

A419. Che-Ya Wu, Hao Yang, Cheng-Yu Wu, Jenq-Gong Duh, "Flower-like structure of SnS with N-doped carbon via polymer additive for lithium-ion battery and sodium-ion battery",Journal of Alloys and Compounds,750(2018)23-32

A418. Yu-Chu Lu, Hsien-Wei Chen, Chun-Chi Chang, Cheng-Yu Wu, Jenq-Gong Duh"Tribological properties of nanocomposite Cr-Mo-Si-N coatings at elevated temperature through silicon content modification", Surface and Coatings Technology, 338(2018)69-74

A417. Yan Wang, Hao Yang, Cheng-Yu Wu  and  Jenq-Gong Duh, "Facile and controllable one-pot synthesis of nickel-doped LiMn0.8Fe0.2PO4 nanosheets as high performance cathode materials for lithium-ion batteries", Journal of Materials Chemistry A, 5(2017)18674-18683

A416. Bih-Show Lou, Yi-Yuan Lin, Chuan-Ming Tseng, Yu-Chu Lu, Jenq-Gong Duh, and Jyh-Wei Lee, "Plasma electrolytic oxidation coatings on AZ31 magnesium alloys with Si3N4 nanoparticle additives", Surface Coatings and Technology,186 (2017) 279.

A415. Chi-Yu Lu, Wahyu Diyatmika, Bih-Show Lou, Yu-Chu Lu, Jenq-Gong Duh and Jyh-Wei Lee, "Influences of target poisoning on the mechanical properties of TiCrBN thin films grown by a superimposed high power impulse and medium frequency magnetron sputtering", Surface Coatings and Technology,326B(2017) 375-381

A414. Qi Bao, Joseph Lee, and Jenq Gong Duh, "Building 3D Porous, Elastic and Hydrophilic Current Collectors: Prolonging the Cycling Life of Si Based Anode for Lithium Ion Batteries", Materials Letter, 202 (2017) 28–31.

A413. Joseph Lee and Jenq Gong Duh, "Structural evolution of Zr-Cu-Ni-Al-N thin film metallic glass and its diffusion barrier performance in Cu-Si interconnect at elevated temperature", Vacuum, 142 (2017) 81-86.

A412. Wei-Yu Chen and Jenq Gong Duh, "Grain structure modification of Cu-Sn IMCs by applying Cu-Zn UBM on transient liquid-phase bonding in novel 3D-IC Technologies", Intermetallics, 85 (2017) 170-175.

A411. Yi-Chun Jin and Jenq Gong Duh, ''Kinetic Study of High Voltage Spinel Cathode Material in a Wide Temperature Range for Lithium Ion Battery'', Batteries and Energy Storage section of Journal of The Electrochemical Society, 164 (2017) A735-A740.

A410. Joseph Lee, Ming-Li Liou and Jenq-Gong Duh, "The Development of a Zr-Cu-Al-Ag-N Thin Film Metallic Glass Coating in Pursuit of Improved Mechanical, Corrosion, and Antimicrobial Property for Bio-medical Application", Surface & Coatings Technology, 310 (2017) 214-222.

​A409. Collin Fleshman, Wei-Yu Chen, Tzu-Ting Chou, Jia-Hong Huang and Jenq-Gong Duh, ”The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/OSP Cu solder joint”, Materials Chemistry and Physics, 189C (2017) 76-79.

A408. Bing-Hong Chen, Chun-Chi Chang and Jenq-Gong Duh, "Carbon Assisted Technique for Recycled Silicon/Silicon Carbide Composite in Lithium Ion Batteries", Energy Technology,5(2017) 1415–1422

A407. Wei-Ting Wong, Bing-Hong Chen, Irish Valerie B. Maggay, Chang Liu, Jenq-Gong Duh and Wei-Ren Liu, "Synthesis and Electrochemical Properties of Hierarchically Porous Zn(Co1-xMnx)2O4 Anode for Li-Ion Batteries via Cation Substitution Design", Energy Technology,5(2017)1526-1535

A406. Chun-Chi Chang and Jenq-Gong Duh, "Duplex Coating Technique to Improve the Adhesion and Tribological Properties of CrAlSiN Nanocomposite Coating", Surface & Coatings Technology 326(2017)375-381

A405. Wei-Yu Chen and Jenq-Gong Duh, “Suppression of Cu3Sn layer and formation of multi-orientation IMCs during thermal aging in Cu/Sn-3.5Ag/Cu-15Zn transient liquid-phase bonding in novel 3D-IC Technologies”, Materials Letters , 186 (2017) 279.​

A404. Yi-Chun Jin and Jenq Gong Duh, "Hierarchically-Structured Nanocrystalline Lithium Rich Layered Composites with Enhanced Rate Performances for Lithium Ion Battery", Energy Storage Materials, 6 (2017) 157-163.

A403. Hui Gee Tan and Jenq Gong Duh, "Processing Silicon Microparticles Recycled from Wafer Waste via Rapid Thermal Process for Lithium-ion Battery Anode Materials", Journal of Power Sources (ELS), 335 (2016) 146–154.

A402. Bing Hong Chen, Shang I Chaung and Jenq Gong Duh, "Double-Plasma Enhanced Carbon Shield for         Spatial/Interfacial Controlled Electrodes in Lithium Ion Batteries via Micro-Sized Silicon from Wafer Waste", Journal of Power Sources (ELS), 331 (2016) 198–207

A401. Ching Yu Yang, Yu Hsiang Lo, Chang Liu, Hsin Ming Cheng, Jenq-Gong Duh and Po-Yu Chen, "Rapid Deposition of Superhydrophilic Stalagmite-like Protrusions for Underwater Selective Superwettability", RCS Advances, 6 (2016) 89298 -89304

A400. Qi Bao, Kwan San Hui and Jenq Gong Duh, "Promoting catalytic ozonation of phenol over graphene through nitrogenation and Co3O4 compositing", Journal of Environmental Sciences, 50 (2016) 38-48.

​A399. Cheng-Yu Wu, Chun-Chi Chang and Jenq Gong Duh, “Silicon nitride coated silicon thin film on three dimensions current collector for lithium ion battery anode”Journal of Power Sources, 325 (2016) 64-70

A398. Yao-Hui Huang, Qi Bao, Jenq-Gong Duh and Chih-Tse Chang, ''Top-down Dispersion Meets Bottom-up Synthesis: Merging Ultranano Silicon and Graphene Nanosheets for Superior Hybrid Anodes in Lithium-ion Batteries'',  Journal of Materials Chemistry A, 4 (2016) 9986-9997

A397. Hao Yang and Jenq-Gong Duh, ''Aqueous sol-gel synthesized anatase TiO2 nanoplates with high-rate capabilities for Lithium-ion and Sodium-ion battery'', RSC Advances, 6 (2016) 37160-37166

A396. Chun-Kai Lan, Qi Bao, Yao-Hui Huang, Jenq-Gong Duh, ''Embedding Nano-Li4Ti5O12 in Hierarchical Porous Carbon Matrixes Derived from Water Soluble Polymers for Ultra-fast Lithium Ion Batteries Anodic Materials'', Journal of Alloys and Compounds,673 (2016) 366-348

Lan, Chun-Kai & Qi, Bao & Huang, Yao-Hui & Duh, Jenq-Gong. (2016). Embedding Nano-Li4Ti5O12 in Hierarchical Porous Carbon Matrixes Derived from Water Soluble Polymers for Ultra-fast Lithium Ion Batteries Anodic Materials. Journal of Alloys and Compounds. 673. 10.1016/j.jallcom.2016.02.264. 

A395. Yin Wang, Jyh-Wei Lee and Jenq-Gong Duh, "Mechanical strengthening in self-lubricating CrAlN/VN multilayer coatings for improved high-temperature tribological characteristics", Surface & Coatings Technology, 303 (2016) 12-17.

A394. Ching-Yu Yang, Shang-I Chuang, Yu-Hsiang Lo, Hsin-Ming Cheng, Jenq-Gong Duh and Po-Yu Chen, ''Stalagmite-like Self-cleaning Surfaces Prepared by Silanization of Plasma-assisted Metal-oxide Nanostructures'', Journal of Materials Chemistry A, 4 (2016) 3406

A393. Kuo-Hua Huang and Jenq-Gong Duh, ”Thermal Effect on Lifetime Evaluation of Adesiveless Copper-Polyimide“, Materials Transactions, 56 (2015) 1063

A392. Yi-Chun Jin and Jenq-Gong Duh, "Fluorination Induced the Surface Segregation of High Voltage Spinel on Lithium-Rich Layered Cathodes for Enhanced Rate Capability in Lithium Ion Batteries", ACS Applied Materials & Interfaces,
8 (2016) 3883-3891

A391. Chun-Chi Chang, Hsien-Wei Chen, Jyh-Wei Lee, Jenq-Gong Duh, "Development of Si-modified CrAlSiN Nanocomposite Coating for Anti-wear Application in Extreme Environment", Surface & Coatings Technology, 284 (2015) 273-280.

A390. Chun-Kai Lan, Chun-Chi Chang, Cheng-Yu Wu, Bing-Hong Chen and Jenq-Gong Duh, "Improvement of the Ar/N2 binary plasma-treated carbon passivation layer deposited on Li4Ti5O12 electrodes for stable high-rate lithium ion battery", RSC Advances, 5 (2015) 92554-63

A389. Bing-Hong Chen, Shang-I Chuang and Jenq-Gong Duh, “A Revival of Waste: Atmospheric Pressure Nitrogen Plasma Jet Enhanced Jumbo Silicon/Silicon Carbide Composite in Lithium Ion Batteries”, ACS Appl. Mater. Interfaces, 
51 (2015) 28166–76

A388. Hsiu-Min Lin, Cheng-Ying Ho, Wen-Lin Chen, Yi-Hsin Wu, De-Hui Wang, Jun-Ren Lin, Yu-Hui Wu, Huei-Cheng Hong, Zhi-Wei Lin, Jenq-Gong Duh: Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test. Microelectronics Reliability 55(1): 231-237 (2015)

A387. Wei-Yu Chou, Yi-Chun Jin, Jenq-Gong Duh, Cheng-Zhang Lu, Shih-Chieh Liao, “A facile approach to derive binder protective film on high voltagespinel cathode materials against high temperature degradation”, Applied Surface Science, 355 (2015) 1272–1278.

A386. Christine Jill Lee, Wei-Yu Chen, Tzu-Ting Chou, Tae-Kyu Lee, Yew-Chung Wu, Tao-Chih Chang and Jenq-Gong Duh, “The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test”, Journal of Materials Science: Materials in Electronics

A385.  Yao-Hui Huang, Chih-Tse Chang, Qi Bao, Jenq-Gong Duh and Yu-Lun Chueh, “Heading towards Novel Superior Silicon-based Lithium-ion Batteries: Ultrasmall Nanoclusters Top-down Dispersed over Synthetic Graphite Flakes as Binary Hybrid Anodes”, Journal of Materials Chemistry A, 3 (2015) 16998.

A384.  Joseph Lee, Kuo-Hua Huang, Kai-Chieh Hsu, Huan-Chien Tung, Jyh-Wei Lee and Jenq-Gong Duh, “Applying Composition Control to Improve the Mechanical and Thermal Properties of Zr-Cu-Ni-Al Thin Film Metallic Glass by Magnetron DC Sputtering”, Surface and Coatings Technology, 278 (2015) 132.

A383.  Qi Bao, Yao-Hui Huang, Chun-Kai Lan, Bing-Hong Chen and Jenq-Gong Duh, “Scalable Upcycling Silicon from Waste Slicing Sludge for High-performance Lithium-ion Battery Anodes”, Electrochimica Acta, 173 (2015) 82.

A382.  Joseph Lee, Huan-Chien Tung, and Jenq-gong Duh, “Enhancement of Mechanical and Thermal Properties in Zr-Cu-NI-Al-N Thin Film Metallic Glass by Compositional Control of Nitrogen”, Materials Letters, 159 (2015) 369.

A381.  Kuo-Hua Huang and Jenq-Gong Duh, “Fatigue Characterization for Flexible Circuit with Polyimide”, Journal of Electronic Materials, 7 (2015) 3865.

A380.  Jason Shian-Ching Jang, Pei-Hua Tsai, An-Zin Shiao, Tsung-Hsiung Li, Chih-Yu Chen, Jinn Peter Chu, Jenq-Gong Duh, Ming-Jen Chen, Shih-Hsin Chang, Wen-Chien Huang, “Enhanced Cutting Durability of Surgical Blade by Coating with Fe-based Metallic Glass Thin Film”, Intermetallics, 65 (2015) 56.

A379. Hao Yang, Chun-Kai Lan, and J. G. Duh, “The Power of Nb-substituted TiO2 in Li-ion Batteries: Morphology Transformation Induced by High Concentration Substitution”, Journal of Power Sources, 288 (2015) 401.

A378. Y. C. Chang, S. N. Hsiao, S. H. Liu, S. H. Su, K. F. Chiu, W. C. Hsieh, S. K. Chen, Y. G. Lin, H. Y. Lee, C. K. Sung and J. G. Duh, “Effect of L12 Ordering in Antiferromagnetic Ir-Mn Epitaxial Layer on Exchange Bias of FePd Films”, Journal of Applied Physics, 117 (2015) 17D154.

A377.  Yao-Hui Huang, Qi Bao, Bing-Hong Chen, and Jenq-Gong Duh, “Nano-to-Microdesign of Marimo-Like Carbon Nanotubes Supported Frameworks via In-spaced Polymerization for High Performance Silicon Lithium Ion Battery Anodes”, Small, 11 (2015) 2314.

A376. Wei-Yu Chen, Tzu-Ting Chou, Wei Tu, Hsiang-Ching Chang, Christine Jill Lee and Jenq-Gong Duh, “Retarding the Cu–Sn and Ag–Sn Intermetallic Compounds by Applying Cu–xZn Alloy on Micro-bump in Novel 3D-IC Technologies”, Journal of Materials Science: Materials in Electronics, 26 (2015) 2357.

A375. Chun-Kai Lan, Shang-I Chuang, Qi Bao, Yen-Ting Liao and Jenq-Gong Duh. “One-Step Argon/Nitrogen Binary Plasma Jet Irradiation of Li4Ti5O12 for Stable High-Rate Lithium Ion Battery Anodes”, Journal of Power Sources, 275 (2015) 660.

A374.  Yi-Chun Jin and Jenq-Gong Duh, "Feasible Nonaqueous Route to Synthesize High- Voltage Spinel Cathode Material for Lithium Ion Battery", RSC Advances. 5 (2015) 6919.

A373. Chun-Chi Chang, Hsien-Wei Chen, Jyh-Wei Lee and Jenq-Gong Duh, “Influence of Si contents on tribological characteristics of CrAlSiN nanocomposite coatings”, Thin Solid Films, 584 (2015) 46.

A372. Shandong Li, Qian Xue, Jenq-Gong Duh, Honglei Du, Jie Xu, Yong Wan, Qiang Li and Yueguang Lü, "Driving Ferromagnetic Resonance frequency of FeCoB/PZN-PT Multiferroic Heterostructures to Ku-band via Two-step Climbing: Composition Gradient sputtering and Magnetoelectric Coupling", Sci. Rep., 4 (2015) 7393.

A371. Jia-Hong Chu, Joseph Lee, Chun-Chi Chang, Yu-Chen Chan, Ming-Li Liou, Jyh-Wei Lee, Jason Shian-Ching Jang and Jenq-Gong Duh, “Antimicrobial Characteristics in Cu-containing Zr-based Thin Film Metallic Glass”, Surface and Coatings Technology, 259 (2014) 87.

A370. Shang-I Chung and Jenq-Gong Duh, “Exploration of Surface Hydrophilic Properties on AISI 304 Stainless Steel and Silicon Wafer Against Aging after Atmospheric Pressure Plasma Treatment”, Japanese Journal of Applied Physics, 53 (2014) 11RA01.

A369. Tae-Kyu Lee and Jenq-Gong Duh, “Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn-Ag-Cu and Sn-Ag Solder Interconnects With and Without Board-Side Ni Surface Finish”, Journal of Electronic Materials, 43 (2014) 4522.

A368. Wei-Yu Chen, Wei Tu, Hsiang-Ching Chang , Tzu-Ting Chou and Jenq-Gong Duh, “Growth Orientation of Cu-Sn IMC in Cu/Sn-3.5Ag/Cu-xZn Microbumps and Zn-doped Solder Joints”, Materials Letters 134 (2014) 184.

A367. Wen-Lin Chen, Chi-Yang Yu, Cheng-Ying Ho and Jenq-Gong Duh, “Effects of Thermal Annealing in the Post-reflow Process on Microstructure, Tin Crystallography, and Impact Reliability of Sn–Ag–Cu Solder Joints”, Materials Science and Engineering A, 613 (2014) 193.

A366. C. Y. Ho and J. G. Duh, “Quantifying the Dependence of Ni(P) Thickness in Ultrathin-ENEPIG Metallization on the Growth of the Cu-Sn Intermetallic Compounds in Soldering Reaction”, Materials Chemistry and Physics, 148 (2014) 21.

A365. C. F. Tseng, C. Y. Ho, Joseph Lee, and J. G. Duh, "Crystallographic Characterization and Growth Behavior of (Cu,Ni,Pd)6Sn5 Intermetallic Compound in Ni(P)/Pd/Au/SnAgCu/Cu Assembled Solder Joint", Journal of Alloys and Compounds, 600 (2014) 21.

A364. C. Y. Ho and J.G. Duh, “Optimal Ni(P) Thickness Design in Ultrathin-ENEPIG Metallization for Soldering: Concerning Electrical Impedance and Mechanical Bonding Strength”, Materials Science and Engineering A 611 (2014) 162.

 A363. C.Y. Ho, M.T. Tsai, J. G. Duh, and J.W. Lee, “Bump height confinement governed solder alloy hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni joint assemblies”, Journal of Alloys and Compounds, 600, (2014) 199.

A362. W. Y. Chen, C. Y. Yang, and J. G. Duh, "Improving the Shear Strength of Sn-Ag-Cu-Ni/Cu-Zn Solder Joints via Modifying the Microstructure and Phase Stability of Cu-Sn Intermetallic Compounds", Intermetallics, 54 (2014) 181.

A361. Y. C. Jin, M. I. Lu, T. H. Wang, C. R. Yang, and J. G. Duh, “Synthesis of High-Voltage Spinel Cathode Material with Tunable Particle Size and Improved Temperature Durability for Lithium Ion Battery”, Journal of Power Sources 262 (2014) 483.

A360. Y. C. Chang, S. N. Hsiao, S. H. Liu, S. K. Chen, Y. T. Liu, H. Y. Lee, A. C. Sun and J. G. Duh, “Influence of Stoichiometry and Growth Temperature on the Crystal Structure and Magnetic Properties of Epitaxial L10 Fe-Pd (001) Films“, J. Appl. Phys. 115 (2014) 17A740.

 A359. C. Y. Yu, Joseph Lee, W. L. Chen, and J. G. Duh, "Enhancement of the Impact Toughness in Sn-Ag-Cu/Cu Solder Joints via Modifying the Microstructure of Solder Alloy", Materials Letters 119 (2014) 20.

A358. H. W. Chen, K. C. Hsu, Y. C. Chan, J. G. Duh, J. W. Lee, Jason S. C. Jang, G. J. Chen, “Antimicrobial Properties of Zr–Cu–Al–Ag Thin Film Metallic Glass”, Thin Solid Films 561 (2014) 98.

A357. H. M. Lin, and J. G. Duh, “Development of Electroplated Ni–xZn Films for Under Bump Metallization Application”, Surface and Coatings Technology, 237 (2013) 445.

A356. C. Y. Yu, W. Y. Chen, and J. G. Duh, “Improving the Impact Toughness of Sn-Ag-Cu/Cu-Zn Pb-free Solder Joints under High Speed Shear Testing”, Journal of Alloys and Compounds, 586 (2014) 633.

A355. J. H. Chua, H. W. Chen, Y. C. Chan, J. G. Duh, J. W. Lee, Jason S. C. Jang,”Modification of Structure and Property in Zr-based Thin Film Metallic Glass via Processing Temperature Control”, Thin Solid Films 561 (2014) 38.

A354. Y.C. Chan, H.W. Chen, R.H. Wei, J.G. Duh, J.W. Lee, "Effects of Al and V Additions on Mechanical Response in Thick TiSiCN Nanocomposites Deposited Using a Plasma Enhanced Magnetron Sputtering", Jpn. J. Appl. Phys. 52 (2013) 11.

A353. Y. C. Chan, H. W. Chen, J. G. Duh, J. W. Lee, “Texture, Microstructure and Tribological Behavior in TiAlN/SiNx Multilayers ”, Int. J. Appl. Ceram. Technol. 11 (3) (2014) 611.

A352. Y. C. Chan, H. W. Chen, Y. Z. Tsai, J. G. Duh, J. W. Lee, “Texture, Microstructure and Anti-wear Characteristics in Isostructural CrAlSiN/W2N Multilayer Coatings”, Thin Solid Films 544 (2013) 265.

A351. L. W. Ho, J. W. Lee, H. W. Chen, Y. C. Chan, J. G. Duh "Structure and Mechanical Property Evaluation of Cr–Ti–B–N Coatings", Thin Solid Films 544 (2013) 380.

A350. C. Y. Tong, J. W. Lee, C. C. Kuo, S. H. Huang, Y. C. Chan, H. W. Chen, J. G. Duh, " Effects of Carbon Content on the Microstructure and Mechanical Property of Cathodic arc Vaporation Deposited CrCN Thin Films", Surface & Coatings Technology, 231 (2013) 482. 

A349. S. F. Chen, Y. C. Kuo, C. J. Wang, S. H. Huang, J. W. Lee, Y. C. Chan, H. W. Chen, J. G. Duh, T. E. Hsieh, "The effect of Cr/Zr Chemical Composition Ratios on the Mechanical Properties of CrN/ZrN Multilayered Coatings Deposited by Cathodic arc Deposition System", Surface & Coatings Technology, 231 (2013) 247.

A348. P. S. Chen, H. W. Chen, J. G. Duh, J. W. Lee, J.S.C. Jang, "Characterization of Mechanical Properties and Adhesion of Ta–Zr–Cu–Al–Ag Thin Film Metallic Glasses", Surface & Coatings Technology, 231 (2013) 332.

A347. S. D. Li, M. Liu, J. Lou, X. Xing, J. Qiu, J. H. Lin, Z. Y. Cai, F. Hu, N. X. Sun, and J. G. Duh, "Tunable Microwave Frequency Performance of Nanocomposite Co2MnSi/PZN-PT Magnetoelectric Coupling Structure", Journal of Nanoscience and Nanotechnology, 13 (2013) 1182.

A346. S. D. Li, M. Liu, J. Lou, X. Xing, J. P. Wu, Y. Hu, X. L. Cai, F. Xu, N. X. Sun, and J. G. Duh, "Microwave Frequency Performance and High Magnetic Anisotropy of Nanocrystalline Fe70Co30-B Films Prepared by Composition Gradient Sputtering", Journal of Nanoscience and Nanotechnology, 13 (2013) 1091.

A345. C. F. Tseng and J. G. Duh, "Correlation between Microstructure Evolution and Mechanical Strength in the Sn-3.0Ag-0.5Cu/ENEPIG Solder Joint", Materials Science and Engineering A 580 (2013) 169.

A344. Y. H. Wu, C. Y. Yu, C. Y. Ho and J. G. Duh, “Retardation of (Cu,Ni)6Sn5 Spalling in Sn-Ag-Cu/Ni Solder Joints via Controlling the Grain Structure of Ni Metallization Layer”, Materials Letters 105 (2013) 40.

A343. C. F. Tseng, C. J. Lee, and J. G. Duh, “Roles of Cu in Pb-free Solders Jointed with Electroless Ni(P) Plating”, Materials Science and Engineering A 574 (2013) 60.

A342. S. D. Li, H. Du, Q. Xue, S. Xie, M. Liu, W. Shao, J. Xu, T. Nan, N. X. Sun, and J. G. Duh, "Stress Competition and Vortex Magnetic Anisotropy in FeCoAlO High-frequency Soft Magnetic Films with Gradient Al-O Contents", Journal of Applied Physics 113 (2013) 17A332.

A341. S. D. Li, M. Liu, W. Shao, J. Xu, S. Chen, Z. Zhou, T. Nan, N. X. Sun, and J. G. Duh, "Large E-field Tunability of Microwave Ferromagnetic Properties in Fe50Co50-Hf/lead Zinc Niobate–lead Titanate Multiferroic Laminates", Journal of Applied Physics 113 (2013) 17C727.

A340. C. Y. Chuang, Y. C. Liao, J. W. Lee, C. L. Li, J. P. Chu, and J. G. Duh, "Electrochemical Characterization of Zr-based Thin Film Metallic Glass in Hydrochloric Aqueous Solution", Thin Solid Film 529 (2013) 338.

A339. T. K. Lee, B. Zhou, T. R. Bieker, C. F. Tseng, and J. G. Duh, "The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance", Journal of Electronics Materials 42 (2013) 215.

A338. C. Y. Ho, J. G. Duh, C. W. Lin, C. J. Lin, Y. H. Wu, H. C. Hong, and T. H. Wang, "Microstructural Variation and High-speed Impact Responses of Sn–3.0Ag–0.5Cu/ENEPIG Solder Joints with Ultra-thin Ni–P Deposit", Journal of Materials Science 48 (2013) 2724.

A337. W. Q. Shao, C. Y. Yu, W. C. Lv, J. G. Duh, and S. O. Chen, "Study of the Zn Occupancy Leading to the Stability Improvement for Cu6Sn5 Using a First-principles Approach", Materials Letters, 93 (2013) 300.

A336. Y. C. Jin, and J. G. Duh, "Nanostructured LiNi0.5Mn1.5O4 Cathode Material Synthesized by Polymer-assisted Co-precipitation Method with Improved Rate Capability", Materials Letters 93 (2013) 77.

A335. C. Y. Ho, and J. G. Duh, "Wetting Kinetics and Wettability Enhancement of Pd Added Electrolytic Ni Surface with Molten Sn–3.0Ag–0.5Cu Solder", Materials Letters 92 (2013) 278.

A334. C. F. Tseng, and J. G.Duh, "The Influence of Pd on Growth Behavior of a Quaternary (Cu,Ni,Pd)6Sn5 Compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P Solder Joint during a Liquid State Reaction", Journal of Materials Science 48 (2013) 857.

A333. Y. C. Chan, H. W. Chen, P. S. Chao, J. G. Duh, and J. W. Lee, “Microstructure Control in TiAlN/SiNx Multilayers with Appropriate Thickness Ratios for Improvement of Hardness and Anti-corrosion Characteristics”, Vacuum 87 (2013) 195.

A332. J. W. Lee, C. C. Hong, H. W. Chen, L. W. Ho, J. G. Duh, and Y. C. Chan, “The Influence of Boron Contents on the Microstructure and Mechanical Properties of Cr–B–N Thin Films”, Vacuum 87 (2013) 191.

A331. I. T. Wang, J. G. Duh, C. Y. Cheng, and J. Wang, “Materials Science and Engineering B”, Thin Solid Films 177 (2012) 278.

A330. P. S. Chen, H. W. Chen, J. G. Duh, J. W. Lee, and J. S. C. Jang, “Mechanical and Thermal Behaviors of Nitrogen-doped Zr-Cu-Al-Ag-Ta––An Alternative Class of Thin Film Metallic Glass”, Applied Physics Letters 101 (2012) 181902.

A329. Y. S. Lin, J. G. Duh, M. C. Tsai, and C. Y. Lee, "Self-assembled Synthesis of Monodispersed Mesoporous Li4Ti5O12 Beads and their Applications in Secondary Lithium-ion Batteries", Electrochimica Acta 83 (2012) 47.

A328. S. D. Li, M. Liu, J. Lou, S. Beguhn, J. P Wu, J. Qiu, J. H. Lin, Z. Cai, Y. Hu, F. Xu, J. G. Duh, and N. X. Sun "E-field Tuning Microwave Frequency Performance of Co2FeSi/lead Zinc Niobate-lead Titanate Magnetoelectric Coupling Composites", Journal of Applied Physics 111 (2012) 07C705.

A327. S. D. Li, L. L. Wang, J. Xu , Z. Wang, M. Liu, J. Lou, S. Beguhn, T. X. Nan, F. Xu, N. X. Sun, and J. G. Duh, "Microwave Frequency Performance and High Magnetic Anisotropy of Fe70Co30-B Films Prepared by a Modified Composition Gradient Sputtering", IEEE TRANSACTIONS ON MAGNETICS 48 (2012) 11.

A326. S. D. Li, Z.P. Lin, Z. Wang, J. Xu, L.L. Wang, J. H. Lin, Y. Hu, F. Xu, T. X. Nan, N. X. Sun , and J. G. Duh, "Large Field-Induced Magnetocaloric Effect in Ni43Mn46-xVxSn11 Heusler Alloys", IEEE TRANSACTIONS ON MAGNETICS 48 (2012) 11.

A325. C. Y. Yu, and J. G. Duh, "Growth Mechanisms of Interfacial Intermetallic Compounds in Sn/Cu–Zn Solder Joints during Aging", Journal of Materials Science 47 (2012) 6467.

A324. Y. S. Lin, M. C. Tsai, and J. G. Duh, “Self-assembled Synthesis of Nanoflower-like Li4Ti5O12 for Ultrahigh Rate Lithium-ion Batteries”, JOURNAL OF POWER SOURCES 214 (2012) 314.

A323. S. W. Fu, C. Y. Yu, T. K. Lee, K. C. Liu, and J. G. Duh, "Impact Crack Propagation through the Dual-phased  (Cu,Ni)6Sn5 Layer in Sn–Ag–Cu/Ni Solder Joints", Materials Letters 80 (2012) 103.

A322. C. Y. Yu, W. Y. Chen, and J.G. Duh, "Suppressing the Growth of Cu-Sn Intermetallic Compounds in Ni/Sn-Ag-Cu/Cu-Zn Solder Joints during Thermal Aging", Intermetallics 26 (2012) 11.

A321. W. Y. Chen, C. Y. Yu and J.G. Duh, "Suppressing the Growth of Interfacial Cu–Sn Intermetallic Compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn Solder Joint during Thermal Aging", Journal of Materials Science 47 (2012) 4012.

A320. Y. R. Jhan and J. G. Duh, "Electrochemical Performance and Low Discharge Cut-off Voltage Behavior of Ruthenium Doped Li4Ti5O12 with Improved Energy Density", Electrochimica Acta 63 (2012) 9.

A319. P. C. Chen, M. C. Tsai, H. C. Chen, I. N. Lin, H. S. Sheu, Y. S. Lin, J. G. Duh, H. T. Chiu and C. Y. Lee, “Self-carbonized Lamellar Nanomicro Hierarchical Structure CTiO2 and its Li-ion Intercalation Performance”, Journal of Materials Chemistry 22 (2012) 5349.

A318. Z. S. Wang, Yuan-Tai Lai and J.G. Duh, "The Effect of Oxygen Flow Rates on Magnetic Property and High Frequency Characteristic of Fe-Hf-O films", Physica Status Solidi A, 209 (2012) 773.

A317. Y. M. Kuo and J.G. Duh, "Application of Nanocrystalline FeHfN Soft Magnetic Films to Power Inductors", Journal of Magnetism and Magnetic Materials 324 (2012) 1084.

A316. Y. R. Jhan and J. G. Duh, "Synthesis of Entanglement Structure in Nanosized Li4Ti5O12/Multi-walled Carbon Nanotube Composite Anode Material for Li-ion Batteries by Ball-Milling-assisted Solid-state Reaction", Journal of Power Sources 198 (2012) 294.

A315. Y. D. Tsai, C. Y. Yu, C. C. Hu, and J. G. Duh, "Pulse Electroplating of Sn-Bi Alloys on Micropatterned Electrodes for Lead-Free Solder Bumping", Journal of the Electrochemical Society 159 (2012) D108.

A314. S. D. Li, M Liu, J. Lou, S. Beguhn, J. P. Wu, J. Qiu, J. H. Lin, Z. Y. Cai, Y. Hu, F. Xu, J. G. Duh, and N. X. Sun, "E-field Tuning Microwave Frequency Performance of Co2FeSi/PZN-PT Magnetoelectric Coupling Composites", J. APPL. PHYS.111, 07C705 (2012).

A313. Z. S. Wang, Y. T. Lai, and J. G. Duh, "Thickness Dependence of the Magnetic Properties on FeHfN Thin Film by DC Sputtering", J. Phys.: Conf. Ser. 266 (2011) 012078.

A312. Y. S. Lin and J. G. Duh, ”Facile Synthesis of Mesoporous Lithium Titanate Spheres for High Rate Lithium-ion Batteries”, Journal of Power Sources 196 (2011) 10698.

A311. S. D. Li, F. Xu, M. Liu, Y Hu, J. P. Wu, X. L. Cai, J. Qiu, J. H. Lin, and J. G. Duh, "Effect of the Thickness of Cr Interlayer on the High-frequency Characteristics of FeCoTa/Cr/FeCoTa Multilayers", ADV. MATER. RES., 287-290 (2011) 1356.

A310. Z. P. Lin, S. D. Li, M. Liu, S. Y. Tsai, J. G. Duh, M. M. Liu, and F. Xu, "The Magnetic Entropy Change in La0.8Ce0.2Fe11.4Si1.6Bx Compounds Prepared by Copper Mold Casting", Journal of Magnetism and Magnetic Materials 323 (13) (2011) 1741.

A309. S. D. Li, M. Liu, J. Lou, X. Xing, Z. J. Su, Z. Y. Zhou, F. Xu, J. G. Duh, and N. X. Sun, "High In-plane Magnetic Anisotropy and Microwave Frequency Performance of Soft Magnetic (Fe50Co50)(1-x)(Al2O3)(x) Films Prepared by Modified Composition Gradient Sputtering", IEEE TRANS. on MAGN, 47(10) (2011) 3935.

A308. S. D. Li, M Liu, F Xu, Z. J. Tian, J. P. Wu, Y Hu, X. L. Cai, J. G. Duh, and N. X. Sun, "Soft Magnetism and Microwave Magnetic Properties of Fe-Co-Hf Films Deposited by Composition Gradient Sputtering", J. APPL. PHYS.,109(7) (2011) 07A315.

A307. Z. P. Lin, S. D. Li, M. M. Liu, J. G. Duh, K. Peng, and X. Y. Mao, "Magnetocaloric Effect of La0.8Ce0.2Fe11.4−xMnxSi1.6 Compounds", J. Alloys Compd. 489 (1) (2010) 1.

A306. Hyelim Choi, Tae-Kyu Lee, Yunsung Kim, Hoon Kwon, Chien-Fu Tseng, Jenq-Gong Duh, Heeman Choe, "Improved Strength of Boron-doped Sn-1.0Ag-0.5Cu Solder Joints under Aging Conditions", Intermetallics 20 (2012) 155.

A305. H. M Lin, J. G. Duh, "Interfacial Reaction between Sn-3.0Ag-0.5Cu Liquid Solder and Ni-xZn Novel UBM Layers", Surface & Coatings Technology 206 (2011) 1941.

A304. H. W. Chen, Y. C. Chan, J. W. Lee and J. G. Duh, "Oxidation Resistance of Nanocomposite CrAlSiN under Long-time Heat Treatment", Surface & Coatings Technology 206 (2011) 1571.

A303. Sung-Hsiu Huang, Siao-Fan Chen, Yu-Chu Kuo, Chaur-Jeng Wang, Jyh-Wei Lee, Yu-Chen Chan, Hsien-Wei Chen, Jenq-Gong Duh, Tsung-Eong Hsieh, "Mechanical and Tribological Properties Evaluation of Cathodic arc Deposited CrN/ZrN Multilayer Coatings", Surface and Coatings Technology 206 (2011) 1744.

A302. Chih-Hong Cheng, Jyh-Wei Lee, Li-Wei Ho, Hsien-Wei Chen, Yu-Chen Chan, Jenq-Gong Duh, "Microstructure and Mechanical Property Evaluation of Pulsed DC Magnetron Sputtered Cr–B and Cr–B–N Films", Surface and Coatings Technology 206 (2011) 1711.

A301. Meng-Ko Wu, Jyh-Wei Lee, Hsien-Wei Chen, Yu-Chen Chan, Jenq-Gong Duh, 2011, "The Influence of Bilayer Period and Thickness Ratio on the Mechanical and Tribological Properties of CrSiN/TiAlN Multilayer Coatings", Surface and Coatings Technology 206 (2011) 1886.