A300. C. Y. Yu and J. G. Duh, "Stabilization of Hexagonal Cu6(Sn,Zn)5 by Doping Minor Zn into Sn-based Solder Joints", Scripta Materialia 65 (2011) 783.

A299. C. F. Tseng and J. G. Duh, "Suppressing Ni3Sn4 Formation in the Sn-Ag-Cu Solder Joints with Ni-P/Pd/Au Surface Finish", Materials Letters 65 (2011) 3216.

A298. P. W. Hsu, R. S. Chen, F. H. Kao, S. H. Wang, J. R. Yang, S. Y. Tsai and J. G. Duh, "Martensite Nucleation Site and Grain Refinement in Duplex Titanium Alloy Weldment by Active Flux with Nanoparticle Addition", Science and Technology of Welding and Joining 16 (2011) 514.

A297. Y. R. Jhan, C. Y. Lin and J. G. Duh, "Preparation and Characterization of Ruthenium Doped Li4Ti5O12 Anode Material for the Enhancement of Rate Capability and Cyclic Stability", Materials letters 65 (2011) 2502. 

A296. C. Y. Lin, Y. R. Jhan and J. G. Duh, "Improved Capacity and Rate Capability of Ru-doped and Carbon-coated Li4Ti5O12 Anode Material", Journal of Alloys Compounds 509 (2011) 6965. 

A295. Y. R. Jhan, J. G. Duh, S. Y. Tsai, “Synthesis of Confinement Structure of Sn/C-C (MWCNTs) Composite Anode Materials for Lithium Ion Battery by Carbothermal Reduction”, Diamond and Related Materials 20 (2011) 413.

A294. Y. M. Kuo and J. G. Duh, "Influence of the Nitrogen Contents on the Permeability Characteristics and Soft Magnetic Properties of FeHfN films", Applied Surface Science 257 (2011) 6387.

A293. S. D. Li, M. Liu, F. Xu, J. Lou, Z. J. Tian, J. P. Wu, Y. Hu, X. L. Cai, J. G. Duh, and N. X. Sun, “Soft Magnetism and Microwave Magnetic Properties of Fe-Co-Hf Films Deposited by Composition Gradient Sputtering”, Journal of Applied Physics 109 (2011) 07A315.

A292. Z. P. Lin, S. D. Li, M. Liu, S. Y. Tsai, J. G. Duh, M. M. Liu, F. Xu, “The Magnetic Entropy change in La0.8Ce0.2Fe11.4Si1.6Bx Compounds Prepared by Copper Mould Casting”, Journal of Magnetism and Magnetic Materials 323 (2011) 1741.

A291. C. Y. Lin and J. G. Duh, "Porous Li4Ti5O12 Anode Material Synthesized by One-step Solid State Method for Electrochemical Properties Enhancement", Journal of Alloys and Compounds 509 (2011) 3682.

A290. Y. S. Lin, J. G. Duh, and H.S. Sheu, "The Phase Transformations and Cycling Performance of Copper-Tin Alloy Anode Materials Synthesized by Sputtering", Journal of Alloys and Compounds 509 (2011) 123.

A289. S. W. Huang, Y. T. Lai, J. G. Duh, “Effects of the Hf Content on the Microstructure and Magnetic Properties of Co–Hf–Ta Thin Films”, Applied Surface Science 257 (2011) 2042.

A288. Y. Z. Tsai and J. G. Duh, “Enhanced Hardness of CrAlSiN/W2N Superlattice Coatings Deposited by DC Magnetron Sputtering”, Journal of Materials Research 25 (2010) 2325. 

A287. K. L. Lin, S. K. Kang, J. G. Duh, A. Lee, T. Bieler, L. Turbini, R. Sidhu, F. Guo, I. Anderson, “Foreword: Pb-Free Solders and Emerging Interconnect and Packaging Technologies”, Journal of Electronic Materials 39 (2010) 2503.

A286. C. M. Kao, J. W. Lee, H. W. Chen, Y. C. Chan, J. G. Duh, and S. P. Chen, "Microstructures and Mechanical Properties Evaluation of TiAlN/CrSiN Multilayered Thin Films with Different Bilayer Periods", Surface & Coatings Technology, 205 (2010) 1438. 

A285. J. W. Lee, S. T. Chang, H. W. Chen, C. H. Chien, J. G. Duh, and C. J. Wang, "Microstructure, Mechanical and Electrochemical Properties Evaluation of Pulsed DC Reactive Magnetron Sputtered Nanostructured Cr-Zr-N and Cr-Zr-Si-N Thin Films", Surface & Coatings Technology, 205 (2010) 1331. 

A284. K. J. Wang, J. G. Duh, B. Sykes, D. Schade, “Impact Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization After Aging at 150A degrees C”, Journal of Electronics Materials, 39 (2010 ) 2558.

A283. C. Y. Yu and J. G. Duh, “Microstructural Variation and Phase Evolution in the Reaction of Sn-xAg-Cu Solders and Cu-yZn Substrates During Reflow”, Journal of Electronics Materials, 39 (2010) 2627. 

A282. H. M Lin, J. G. Duh, R. Wei, C. Rincon, J. W. Lee, “The Effect of Microstructure and Composition on Mechanical Properties in Thick-layered Nanocomposite Ti-Si-C-N”, Surface & Coatings Technology, 205 (2010) 1460.

A281. C. Y. Yu, T. K. Lee, M. Tsai, K. C. Liu and J. G. Duh, "Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni Sandwich Structures", Journal of Electronics Materials 39 (2010) 2544.

A280. C. F. Tseng, K. J. Wang, and J. G. Duh, “Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Cu-Mn UBM During Aging” Journal of Electronic Materials 39 (2010) 2522. 

A279. H. W. Chen, Y. C. Chan, J. W. Lee, J. G. Duh, “Oxidation Behavior of Si-doped Nanocomposite CrAlSiN Coatings”, Surface & Coatings technology, 205 (2010) 1189.

A278. Y. M. Kuo, Shandong Li and J.G. Duh, "High-frequency Ferromagnetic Properties of Multilayered FeCoHfO/AlOx Films", Materials Research Bulletin 256 (2010) 6437

A277. C. H. Lin, Y. Z. Tsai and J. G. Duh, "Effect of Grain Size on Mechanical Properties in CrAlN/SiNx Multilayer Coatings", Thin Solid Films 518 (2010) 7312. 

A276. Y. Z. Tsai and J. G. Duh, "Tribological behavior of CrAlSiN/W2N Multilayer Coatings Deposited by DC Magnetron Sputtering", Thin Solid Films 518 (2010) 7523.

A275. C. Y. Lin, J. G. Duh, C. H. Hsu and J. M. Chen, "LiNi0.5Mn1.5O4 Cathode Material by Low-temperature Solid-state Method with Excellent Cycleability in Lithium Ion Battery", Materials letters, 64 (2010) 2328.

A274. Y. M. Kuo and J.G. Duh, "Effects of the Stacking Levels on Permeability Characteristics and Soft Magnetic Properties in FeCoHfAlO/AlOx Multilayered Films", Materials letters, 64 (2010) 2167.

A273. Y. S. Lin, J. G. Duh and M. H. Hung, "Shell-by-Shell Synthesis and Applications of Carbon-Coated SnO2 Hollow Nanospheres in Lithium-Ion Battery", Journal of Physical Chemistry C, 114 (2010) 13136. 

A272. C. K. Chung, J. G. Duh and C. R. Kao, "Direct Evidence for a Cu-enriched Region at the Boundary between Cu6Sn5 and Cu3Sn during Cu/Sn Reaction", Scripta Materialia, 63 (2010) 258.

A271. Y. S. Lin, J. G. Duh, D. T. Shieh and M. H. Yang, "Effect of pH Value on Electrochemical Property of Tin Compounds Loaded Graphite Anodes for Li-ion Battery Applications", Journal of Alloys and Compounds, 490 (2010) 393. 

A270. K. J. Wang, Y. C. Lin, J. G. Duh, C. Y. Cheng and J. J. Lee, "In Situ Investigation of the Interfacial Reaction in Sn/Cu System by Synchrotron Radiation", Journal of Materials Research, 25 (2010) 972.

A269. K. T. Liu and J. G. Duh, "Determination of the Diffusivity of Point Defects in Passive Films on NiTi and NiTiAl Alloys ", Journal of Phase Equilibria and Diffusion, 31 (2010) 223.

A268. Y. M. Kuo, C. C. Lee and J. G. Duh, "Improvement of High-frequency Characteristics of FeCoHfO/AlOx Multilayered films", Applied Surface Science, 256 (2010) 6437.

A267. C. Y. Yu, K. J. Wang and J. G. Duh, "Interfacial Reaction of Sn and Cu-xZn Substrates After Reflow and Thermal Aging", Journal of Electronics Materials, 39 (2010) 230.

A266. Z. P. Lin, S. D. Li, M. Liu, J. G. Duh, K. Peng, and X. Y. Mao, "Magnetocaloric Effect of La0.8Ce0.2Fe11.4-xMnxSi1.6 Compounds", Journal of Alloys and Compounds, 489 (2010) 1.

A265. Y. M. Kuo, C. C. Lee and J.G. Duh, "Improvement of Magnetic Characteristics and Electrical Properties of FeCoHfO/AlOx Multilayered Films", Materials Letters, 64 (2010) 759.

A264. S. K. Tien, C. H. Lin, Y. Z. Tsai and J. G. Duh, "Oxidation Behavior, Microstructure Evolution and Thermal Stability in Nanostructured CrN/AlN Multilayer Hard Coatings", Journal of Alloys and Compounds, 489 (2010) 237.

A263. S. H. Tsai and J. G. Duh, “Microstructure and Corrosion Properties of Multilayered CrAlN/SiNx Coatings”, Journal of The Electrochemical Society, 157 (2010) K89.

A262. Y. C. Lin, K. J. Wang and J. G. Duh, "Detailed Phase Evolution of Phosphorous-rich Layer and Formation of Ni-Sn-P Compound in SnAgCu/Electroplated Ni-P Solder Joint", Journal of Electronics Materials, 39 (2010) 283.

A261. S.H. Tsai, J.G. Duh, “Microstructure and Mechanical Properties of CrAlN/SiNx Nanostructure Multilayered Coatings”, Thin Solid Films, 518 (2009) 1480.

A260. C. H. Lin and J. G. Duh, "Electrochemical Impedance Spectroscopy (EIS) Study on Corrosion Performance of CrAlSiN Coated Steels in 3.5 wt.% NaCl Solution", Surface & Coatings Technology, 204 (2009) 784.

A259. C. N. Peng and J. G. Duh, "Reaction Mechanism and Mechanical Properties of the Flip Chip Sn-3.0Ag-0.5Cu Solder Bump with Cu/Ni-xCu/Ti Underbump Metallization after Various Reflows", Journal of Electronics Materials, 9 (2009) 943.

A258. C. Y. Tan and J. G. Duh, "Characterization of the Effect of Shape Memory Alloy on Solder Joint Strength Through Modeling and Testing", Journal of Electronics Materials, 38 (2009) 2496.

A257. K. J. Wang and J. G. Duh "Shear and Pull Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Underbump Metallization during Aging", Journal of Electronics Materials, 38 (2009) 2534.

A256. F. C. Tai, K. J. Wang and J. G. Duh "Application of Electroless Ni–Zn–P Film for Under-Bump Metallization on Solder Joint", Scripta Materialia, 61 (2009) 748.

A255. Y. R. Jhan, J. G. Duh, M. H. Yang and D. T. Shieh, "Electroless-Plated Tin Compounds on Carbonaceous Mixture as Anode for Lithium-ion Battery", Journal of Power Sources, 193 (2009) 810.

A254. P. C. Huang and J. G. Duh, "Novel Lead-Free Sn-Cu-xBi Nanosolders by Chemical Reduction Method", Journal of Nanoscience and Nanotechnology, 9 (2009) 764.

A253. M. M. Liu, S. D. Li and J. G. Duh, "High-Frequency Ferromagnetic Properties and Magnetic Domain Structures of FeNdBO Thin Films", Journal of Nanoscience and Nanotechnology, 9 (2009) 836.

A252. K. J. Wang, Y. Z. Tsai, J. G. Duh and T. Y. Shih, "Formation Mechanism of Sn-Patch between SnAgCu Solder and Ti/Ni(V)/Cu under Bump Metallization", Journal of Materials Research, 24 (2009) 2638.

A251. P. Y. Liao, J. G. Duh and J. F. Lee, "Valance Change and Local Structure during Cycling of Layer-Structured Cathode Materials" Journal of Power Sources, 189 (2009) 9.

A250. K. H. Chung, J. H. Liao, J. G. Duh and C. N. Chan, "The Effects of Repeated Heat-Pressing on Properties of Pressable Glass-Ceramics", Journal of Oral Rehabilitation, 36 (2009) 132.

A249. S. Li, Z. Tian, J. Fang, J. G. Duh, K. X. Liu, Z. Huang, Y. Huang and Y. Du, "Zinc-Blende Ferromagnetic CrSb Film on KCl (100) Substrates", Solid State Communications, 149 (2009) 196.

A248. P.Y. Liao, J.G. Duh and H.S. Sheu "Structural and Thermal Properties of LiNi0.6-XMgxCo0.25Mn0.15O2 Cathode Materials", Journal of Power Sources, 183 (2008) 766.

A247. K.T. Liu and J.G. Duh, "Electrochemical Impedance Study of TiAlN Film Coating on a Ni-Based Alloy in 0.9% NaCl", Journal of Material Sciences, 43 (2008) 3589.

A246. T. I. Shih and J. G. Duh, "Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging", Journal of Electronics Materials, 37 (2008) 845.

A245. C.H. Lin and J.G. Duh, "Corrosion Behavior of (Ti-Al-Cr- Si-V)xNy Coatings on Mild Steels Derived from RF Magnetron Sputtering", Surface & Coatings Technology, 203 (2008) 558

A244. C. L. Kuo, S. D. Li and J. G. Duh, "Development and Optimisation of FeCoHfN Soft Magnetic Thin Films with High-Frequency Characteristics", Applied Surface Science, 254 (2008) 7417.

A243. S. D. Li, J. G. Duh and C. N. Liao, "High-Frequency Ferromagnetic Inductors Covered by As-Deposited FeCoAlO Films with Stress-Induced Uniaxial Anisotropy", Thin Solid Films, 516 (2008) 7748.

A242. S. D. Li, J. G. Duh, F. Bao, K. X. Liu and C. L. Kuo, "Ferromagnetic CrSb Thicker Films Epitaxially Grown on NaCl (1 0 0) Substrates", Journal of Physics D: Applied Physics, 41 (2008) 175004.

A241. S. D. Li, D. W. Wang, and J. G. Duh, "Nd Composition Dependence of Microstructure and Magnetic Properties for Gradient Sputtered NdFeB Films", Journal of Magnetism and Magnetic Materials, 320 (2008) 2112.

A240. K. T. Liu, and J. G. Duh, "Isothermal and Non-Isothermal Crystallization Kinetics in Amorphous Ni45.6Ti49.3Al5.1 Thin Films", Journal of Non-Crystalline Solids, 354 (2008) 3159.

A239. K. T. Liu and J. G. Duh, "Grain Size Effects on the Corrosion Behavior of Ni50.5Ti49.5 and Ni45.6Ti49.3Al5.1 Films", Journal of Electroanalytical Chemistry, 618 (2008) 45.

A238. C. C. Chien, K. T. Liu, J. G. Duh, K. W. Chang and K. H Chung, "Effect of Nitride Film Coatings on Cell Compatibility", Dental Materials, 24 (2008) 986.

A237. B. S. Yau, C. W. Chu, D. Lin, W. Lee, J. G. Duh and C. H. Lin, "Tungsten Doped Chromium Nitride Coatings", Thin Solid Films, 516 (2008) 1877.

A236. K. H. Chung, L.Y. Hsiao, Y.S. Lin and J.G. Duh, "Morphology and Electrochemical Behavior of Ag-Cu Nanoparticle Doped Amalgams", Acta Biomaterialia, 4 (2008) 717.

A235. K. T. Liu and J. G. Duh, "Hardness Evolution of NiTi and NiTiAl Thin Films under Various Annealing Temperatures", Surface and Coating Technology, 202 (2008) 2737.

A234. M. M. Liu, S. D. Li and J. G. Duh, "High-Frequency Ferromagnetic Properties of FeNbBO Thin Films", Journal of Alloys and Compounds, 455 (2008) 516.

A233. S .K. Tien, C.H. Lin, Y. Z. Tsai and J.G. Duh, "Microstructural Evaluation of High Oxidation Resistant CrAlSiN Hard Coating at Elevated Temperature in Air Atmosphere", Key Engineering Materials, 373-374 (2008) 446.

A232. S. D. Li, Z. Huang, J. G. Duh and M. Yamaguchi, "Ultrahigh-Frequency Ferromagnetic Properties of FeCoHf Films Deposited by Gradient Sputtering", Applied Physics Letters, 92 (2008) 092501.

A231. Y. R. Jhan, T. Fang, S. Y. Tsai, and J. G. Duh, "Preparation of Sn-Coated Mesophase Graphite Powders by Carbothermal Reduction", Key Engineering Materials, 373-374 (2008) 738.

A230. S. D. Li, Z. R. Yuan and J. G. Duh, "High-Frequency Ferromagnetic Properties of As-Deposited FeCoZr Films with Uniaxial Magnetic Anisotropy", Journal of Physics D: Applied Physics, 41 (2008) 055004.

A229. C. Y. Kang, Y. I. Chen, C.H. Lin and J. G. Duh, "Mechanical Properties of Mo–Ru Thin Films with Ni Interlayer of Different Thickness," Applied Surface Science 253 (2007) 6191.

A228. T. Fang, L.Y. Hsiao and J.G. Duh, "Novel Composite Anode Containing Tin Compounds and Carbonaceous Materials for Li-ion Batteries", Key Engineering Materials, 351 (2007) 58.

A227. Y.W. Peng, S. Li, K.X. Liu, J.G. Duh and M. Yamaguchih, "High-Frequency Ferromagnetic Properties of FeCoZr Nanocrystalline Films", Physica Status Solidi C, 4 (2007) 4593.

A226. Y.W. Peng, F.B. Wu, S. Li, C.L. Kuo, and J.G. Duh, "Fabrication, and High Frequency Magnetic Characterization of the FeCoAl Ternary Thin Film", Physica Status Solidi A, 204 (2007) 4129.

A225. S.K. Tien, C.H. Lin, Y.Z. Tsai and J.G. Duh, "Effect of Nitrogen Flow on the Characterizations of Quaternary CrAlSiN Coatings at Elevated Temperature", Surface and Coating Technology, 202 (2007) 735.

A224. F.B. Wu, Y.M. Su, Y.Z. Tsai and J.G. Duh, "Fabrication and Characterization of the Ni-P-Al-W Multicomponent Coatings", Surface & Coatings Technology, Surface & Coatings Technology, 202 (2007) 762.

A223. P.Y. Liao, J.G. Duh, J.F. Lee, and H.S. Sheu, "Structural Investigation of Li1-xNi0.5Co0.25Mn0.25O2 by in Situ XAS and XRD Measurements", Electrochimica Acta, 53 (2007) 1850.

A222. Y.C. Lin, T.I. Shih, S.K. Tien and J.G. Duh, "Morphological and Microstructural Evolution of Phosphorous-rich Layer in SnAgCu/Ni-P UBM Solder Joint", Journal of Electronic Materials, 36 (2007) 1469.

A221. L.Y. Hsiao, G.Y. Jang, K.J. Wang and J.G. Duh, "Inhibiting the AuSn4 Formation by Controlling the Interfacial Reaction in Solder Joints", Journal of Electronic Materials, 36 (2007) 1476.

A220. S.K. Tien, J.G. Duh and J.W. Lee, "Oxidation Behavior of Sputtered CrN/AlN Multilayer Coatings during Heat Treatment", Surface & Coatings Technology, 201 (2007) 5138.

A219. Y.C. Lin, T.I. Shih, S.K. Tien and J.G. Duh, "Suppressing the Ni-Sn-P Growth in the SnAgCu and Ni-P Joint", Scripta Materialia, 56 (2007) 49.

A218. T.I. Shih, Y.C. Lin, J.G. Duh, Tom Hsu, and W.S. Wu, "Electrical Measurement of A Lead-Free Solder Assembly after Environmental Tests by SEM Internal Probing", JOM (2007) 32.

A217. P. Y. Liao, J. G. Duh, and H. S. Sheu, "In situ Synchrotron X-Ray Studies of LiNi1−x−yCoyMnxO2 Cathode Materials ", Electrochemical and Solid-State Letters, 10 (2007) A88.

A216. K.T. Liu and J.G. Duh, "Kinetics of the Crystallization in Amorphous Ni50.54Ti49.46 Thin Films", Journal of Non-Crystalline Solids, 353 (2007) 1060.

A215. K.T. Liu, J.G. Duh and K.H. Chung, "Effect of Aluminum on the Corrosion Behavior of NiTiAl Thin Films", Applied Surface Science, 253 (2007) 5268.

A214. C.H. Lin, J.G. Duh, and J.W. Yeh, "Multi-Component Nitride Coatings Derived from Ti-Al-Cr-Si-V Target in RF Magnetron Sputter", Surface & Coatings Technology, 201 (2007) 6304.

A213. C.H. Lin, J.G. Duh, and B.S. Yau, “Processing of Chromium Tungsten Nitride Hard Coatings for Glass Molding”, Surface & Coatings Technology, 201 (2006) 1316.

A212. H. W. Chan, J.G. Duh and J. F. Lee, "Valence Change by in situ XAS in Surface Modified LiMn2O4 for Li-ion Battery”, Electrochemistry Communications, 8 (2006) 1731.

A211. Y.C. Hsu and J.G. Duh, “Diffusion Behavior of Cu in Cu/Electroless Ni and Cu/Electroless Ni/Sn-37Pb Solder Joint in Flip Chip Technology”, Journal of Electronic Materials, 35 (2006) 2164.

A210. Y.Z. Tsai and J.G. Duh, "Tribological Behavior of CrN/WN Multilayer Coatings Grown by Ion-beam Assisted Deposition", Surface and Coating Technology, 201 (2006) 4266.

A209. H.W. Chan, J.G. Duh and H.S. Sheu, “In situ Synchrotron X-ray Diffraction Investigations of LiCuxMn2-xO4 Surface Coated LiMn2O4 Spinel Cathode Material during Charge with Various Rates”, Journal of the Electrochemical Society, 153 (2006) A1533.

A208. T. Fang and J. G. Duh, “Effect of Calcination Temperature on the Electrochemical Behavior of ZnO-Coated LiCoO2 cathode”, Surface & Coatings Technology, 201 (2006) 1886.

A207. L.Y. Hsiao, S.T. Kao and J.G. Duh, "Characterizing Metallurgical Reaction of Sn3.0Ag0.5Cu Composite Solder by Mechanical Alloying with Electroless Ni-P/Cu Under-bump Metallization after Various Reflow Cycles", Journal of Electronic Materials, 35 (2006) 81.

A206. Y.I. Chen, K.T. Liu, F. B. Wu and J.G. Duh, "Mo-Ru Coatings on Tungsten Carbide by Direct Current Magnetron Sputtering", Thin Solid Films, 515 (2006) 2207.

A205. S.K. Tien and J.G. Duh, "Comparison of Microstructure and Phase Transformation for Nanolayered CrN/AlN and TiN/AlN Coatings at Elevated Temperatures in Air Environment", Thin Solid Films, 25 (2006) 1097.

A204. T. Fang, L.Y. Hsiao, J. G. Duh and S.R. Sheen, “A Novel Composite Anode Consist of Multiphase Sn Compounds and MCMB for Lithium Ion Batteries”, Journal of Power Sources, 160 (2006) 536.

A203. L.Y. Hsiao and J.G. Duh, "Revealing the Nucleation and Growth Mechanism of Novel Solder Developed from Sn-3.5Ag-0.5Cu Nanoparticles by Chemical Reduction Method", Journal of Electronic Materials, 35 (2006) 1755.

A202. T.I. Shih, Y.C. Lin, J.G. Duh, and Tom Hsu, "Electrical Characteristics for Sn-Ag-Cu Solder Bump with Ti/Ni/Cu Under-Bump-Metallization after Temperature Cycling Tests", Journal of Electronic Materials, 35 (2006) 1773.

A201. G.Y. Jang, and J.G. Duh, "Elemental Redistribution and Interfacial Reaction Mechanism for the Flip Chip Sn-3.0Ag-(0.5 or 1.5) Cu Solder Bump with Al/Ni(V)/Cu Under-Bump Metallization during Aging", Journal of Electronic Materials. 35 (2006) 2061.

A200. Y.C. Lin, and J.G. Duh, "Optimal Phosphorous Content Selection for the Soldering Reaction of Ni-P UBM with Sn-Ag-Cu Solder", Journal of Electronic Materials, 35 (2006) 1665.

A199. G.Y. Jang, J.G. Duh, H. Takahashi, S.W. Lu, and J.C. Chen, “The Influence of Cu Content on Compound Formation Near Chip Side for the Flip Chip Sn-3.0Ag-(0.5 or 1.5)Cu Solder Bump during Aging”, Journal of Electronic Materials, 35 (2006) 2061.

A198. F.B. Wu, S.K. Tien, J.W. Lee, and J.G. Duh, “Comparison in Microstructure and Mechanical Properties of Nanocomposite CrWN and Nanolayered CrN/WN Coatings”, Surface and Coatings Technology, 200 (2006) 3194.

A197. S.K. Tien, F.B. Wu and J.G. Duh, “The Effect of Tungsten Addition on the Thermal Stability and Microstructure in the Electroless Ni-P-W Composite Coating”, Key Engineering Materials, 313 (2006) 83.

A196. L.Y. Hsiao, and J.G. Duh, "Intermetallic Compound Formation and Diffusion Path Evolution in Eutectic Tin-Lead Flip Chip Solder Bumps after Aging", Soldering & Surface Mount Technology, 18 (2006) 18.

A195. H.Y. Lee, and J.G. Duh, "Influence of Ni Concentration and Ni3Sn4 Nanoparticles on Morphology of Sn-Ag-Ni Solders by Mechanical Alloying", Journal of Electronic Materials, 35 (2006) 494.

A194. H.W. Chan, J.G. Duh, and S.R. Sheen, “Microstructure and Electrochemical Properties of LBO-Coated Li-excess Li1+xMn2O4 Cathode Material at Elevated Temperature for Li-ion Battery”, Electrochimica Acta, 51 (2006) 3645.

A193. S.T. Kao, Y.C. Lin, and J.G. Duh, “Controlling Intermetallic Compound Growth in SnAgCu/Ni-P Solder Joints by Nano-Sized Cu6Sn5 Addition”, Journal of Electronic Materials, 35 (2006) 486.

A192. C.K. Chung, T.Y. Lin, J.G. Duh and M.Q. Tsai, "Global and Local Residual Stress in Silicon Carbide Films Produced by Plasma-Enhanced Chemical Vapor Deposition," Surface and Coating Technology, 200 (2006) 4825.

A191. L.Y. Hsiao, T. Fang and J. G. Duh, “Electrochemical Properties of Nanosize Ni-Sn-P Coated on MCMB Anode for Lithium Secondary Batteries,” Electrochemical and Solid-State Letters, 9 (2006) A232.

A190. Y.C. Lin, and J.G. Duh, "Phase Transformation of Phosphorous-Rich Layer in SnAgCu/Ni-P Solder Joint", Scripta Materialia 54 (2006) 661.

A189. C.Y. Li, G.J. Chiou, and J.G. Duh, “Phase Distribution and Phase Analysis in Cu6Sn5, Ni3Sn4 and Sn-Rich Corner in Ternary Sn-Cu-Ni Isotherm at 240°C”, Journal of Electronic Materials, 35 (2006) 343.

A188. H.K. Chen, S.H. Li, and J.G. Duh, "Characterization Technique in Phase Distribution during Sample Preparation for Application to Solder Joints and Wire-Bonding Chips", J. Electronic Materials, 35 (2006) 333.

A187. G.Y. Jang, J.G. Duh, H. Takahashi, and D. Su, “Solid State Reaction in an Au Wire Connection with an Al-Cu Pad during Aging”, Journal of Electronic Materials, 35 (2006) 323.

A186. S.K. Tien and J.G. Duh, "Effect of Heat Treatment on the Mechanical Properties and Microstructure of CrN/AlN Multilayer Coatings", Thin Solid Films, 494 (2006) 173.

A185. F.B. Wu and J.G. Duh, "Phase Transformation and Related Hardness of Ternary Ni-P-Al Alloy Coatings under Heat Treatments", Thin Solid Films, 494 (2006) 151.

A184. Y.C. Lin, J.G. Duh and B.S. Chiou, "Wettability of Electroplating Ni-P in under Bump Metallurgy with Sn-Ag-Cu Solder", Journal of Electronic Materials, 35 (2006) 7.

A183. S.T. Kao, and J.G. Duh, “Interfacial Reactions and Compound Formation of Sn-Ag-Cu Solders by Mechanical Alloying on Electroless Ni-P/Cu under Bump Metallization”, Journal of Electronic Materials, 34 (2005) 1129.

A182. P.Y. Liao, J.G. Duh, and S.R. Sheen, "Effect of Mn Content on the Microstructure and Electrochemical Performance of LiNi0.75-XCo0.25MnxO2 Cathode Materials", Journal of the Electrochemical Society, 152 (2005) A1695.

A181. H.K. Chen, S. H. Li, J. G. Duh, "Structure and Soft Magnetic Properties of Fe-Co-Ni-Based Multi-Component Thin Film", J. Electronic Materials, 34 (2005) 1480.

A180. G.T. Liu, J.G. Duh, K.H. Chung and J.H. Wang, “Mechanical Characteristics and Corrosion Behavior of (Ti, Al)N Coating on Dental Alloys”, Surface & Coatings Technology, 200 (2005) 2100.

A179. F.B. Wu, S.K. Tien and J.G. Duh, "Manufacture, Microstructure and Mechanical Properties of CrWN and CrN/WN Nanolayered Coatings", Surface Coatings and Technology, 200 (2005) 1514.

A178. H.W. Chan, J.G. Duh, S.R. Sheen, S.Y. Tsai and C.R. Lee, "New Surface Modification Material for LiMn2O4 Cathode Material in Li-ion Battery", Surface Coatings and Technology, 200 (2005) 1330.

A177. Y.Z. Tsai and J.G. Duh, "Thermal Stability and Microstructure Characterization of CrN/WN Multilayer Coatings Fabricated by Ion-beam Assisted Deposition", Surface Coatings and Technology, 200 (2005) 1683.

A176. C.Y. Li and J.G. Duh, “Magnetic Properties of Fe70-xCo30-yNx+y Thin Films”, Applied Surface Science, 244 (2005) 477.

A175. H.W. Chan, J.G. Duh and S.R. Sheen, “Surface Treatment of the Lithium Boron Oxide Coated LiMn2O4 Cathode Material in Li-ion Battery”, Key Engineering Materials, 280-283 (2005) 671.

A174. G.Y. Jang and J.G. Duh, “The Effect of Intermetallic Compound Morphology on Cu Diffusion in Sn-Ag and Sn-Pb Solder Bump on the Ni/Cu Under-Bump Metallization”, Journal of Electronic Materials, 34 (2005) 677.

A173. F.B. Wu, J.W. Lee, and J.G. Duh, “Microstructure Evaluation and Mechanical Properties of Nano Layered Chromium Nitride/Tungsten Nitride Coating,” Journal of Electronic Materials, 34 (2005) 1533.

A172. T. Fang, J.G. Duh and S.R. Sheen, "Improving the Electrochemical Performance of LiCoO2 Cathode by Nanocrystalline ZnO Coating", Journal of the Electrochemical Society, 152 (2005) A1701.

A171. L.Y. Hsiao and J.G. Duh, "Synthesis and Characterization of Lead-Free Solders with Sn-3.5Ag-xCu (X=0.2, 0.5, 1.0) Alloy Nanoparticles by the Chemical Reduction Method", Journal of the Electrochemical Society, 152 (2005) J105.

A170. C.Y. Li, and J.G. Duh, "Phase Equilibria in the Sn-Rich Corner of the Sn-Cu-Ni Ternary Alloy System at 240°C", Journal of Materials Research, 20 (2005) 3118.

A169. P.Y. Liao and J.G. Duh, “Synthesis and Characterization of LiNixCoyMn1-X-YO2 as a Cathode Material for Lithium Ion Batteries”, Key Engineering Materials, 280-283 (2005) 677.

A168. J.H. Wang, T. Fang and J.G. Duh, “Licoo2 Cathode Material Coated with Nano-Crystallized ZnO by Sol-Gel Method”, Key Engineering Materials, 280-283 (2005) 665.

A167. T. Fang and J.G. Duh, “Synthesis of Well-Crystallized Manganese Oxide from Precipitation: Effect of Introducing Carbonate Anions”, Key Engineering Materials, 280-283 (2005) 687.

A166. T. Fang, J.G. Duh and S.Y. Tsai, “The Microstructural Evolution of Mn3O4 Hausmannite during Autoxidation”, Key Engineering Materials, 280-283 (2005) 693.

A165. P.Y. Liao, J.G. Duh, and S.R. Sheen, “Microstructure and Electrochemical Performance of LiNi0.6Co0.4-XMnxO2 cathode Materials”, Journal of Power Sources, 143 (2005) 212.

A164. J.W. Lee and J.G. Duh, "Nanomechanical Properties Evaluation of Chromium Nitride Films by Nanoindentation and Nanowear Techniques", Surface and Coatings Technology, 188 (2004) 655.

A163. S.T. Kao and J.G. Duh, "Effect of Cu Concentration on Morphology of Sn-Ag-Cu Solders by Mechanical Alloying", Journal of Electronic Materials, 33 (2004) 1445.

A162. F.B. Wu, S. K. Tien, W.Y. Chen, and J.G. Duh, “Microstructure Evaluation and Strengthening Mechanism of Ni-P-W Alloy Coatings”, Surface and Coating Technology, 177 (2004) 312.

A161. C.S. Huang, G.Y. Jang, and J.G. Duh, “Soldering-induced Cu Diffusion and Intermetallic Compound Formation between Ni/Cu under Bump Metallization and SnPb Flip-Chip Solder Bumps”, Journal of Electronic Materials, 33 (2004) 283.

A160. C.H. Lin and J.G. Duh, “Microhardness of Sputtered Ternary Ni-P-W Coating with Extra-High Phosphorous Content from Improved Deposition Rate-Derived Electroplated Nip Targets”, Surface & Coatings Technology, 188-189 (2004) 495.

A159. K.H. Chung, G.T. Liu, J.G. Duh and J.H. Wang, “Biocompatibility of a Titanium-Aluminum Nitride Film Coating on a Dental Alloy”, Thin Solid Films, 188-89 (2004) 745.

A158. G.Y. Jang, J.W. Lee and J.G. Duh, “The Nanoindentation Characteristics of Cu6Sn5, Cu3Sn and Ni3Sn4 Intermetallic Compound in the Solder Bump”, J. Electronic Materials, 33 (2004) 1103.

A157. G.Y. Jang, C.S. Huang, L.Y. Hsiao, J.G. Duh and Hideyuki Takahashi, “Mechanism of Interfacial Reaction for Sn-Pb Solder Bump with Ni/Cu UBM in Flip Chip Technology”, J. Electronic Materials, 33 (2004) 1118.

A156. W.Y. Chen, S.K. Tien, and J.G. Duh, “Thermal Stability and Microstructure Characterization of Sputtered Ni-P and Ni-P-Cr Coatings”, Surface & Coatings Technology, 188-89 (2004) 489.

A155. S.K. Tien, J.G. Duh and Y.I Chen, “The Influence of Thermal Treatment on the Microstructure and Hardness in Electroless Ni-P-W Deposit”, Thin Solid Films, 469-70 (2004) 333.

A154. S.K. Tien and J.G. Duh, “Thermal Reliability of Electroless Ni-P-W Coating during the Aging Treatment”, Thin Solid Films, 469-70 (2004) 268.

A153. H.W. Chan, J.G. Duh and S.R. Sheen, “Electrochemical Performance of LBO-Coated Spinel Lithium Manganese Oxide as Cathode Material for Li-ion Battery”, Surface & Coatings Technology, 188-189 (2004) 116.

A152. T. Fang, J.G. Duh and S.R. Sheen, “LCoO2 Cathode Material Coated with Nano-Crystallized ZnO for Li-ion Batteries”, Thin Solid Films, 469-70 (2004) 361.

A151. L.Y. Hsiao and J.G. Duh, “Characterizing Metallurgical Reaction of SnPb Solder with Ni/Cu Under-Bump Metallization by Electron Microscopy”, Thin Solid Films, 469-70 (2004) 366.