C488. J.G. Duh, "Microstructure Characterization and Intermetallic compounds formation in Sub-10micron Sn-Ag Microbumps via Doping Zn and Ni in Cu Metallization", Smart materials 2024, July. 22-July.24, 2024. Berlin, Germany (Invited talk)

C487. Y.K. LEE, "Microstructure Modification and Enhancement in Mechanical Properties Cu/Sn-Ag/Cu Microbump Joints with 5-Micron Bonding Height Via Alloying of Zn and Ni in Cu UBM", 245th ECS Meeting, May. 26-May. 30, 2024. San Francisco, California, USA (Oral)

C486. Y.C. Li, "Enhanced Mechanical Properties with Ag Addition in Electroplated Ni-Sn Solder Joints: Sub-10 Micron Bond Thickness", 245th ECS Meeting, May. 26-May. 30, 2024. San Francisco, California, USA (Oral)

C485. Shao-Hsuan Chin, "Increasing the nitrogenous substances in coffee ground solution through plasma treatment and pH value", ISPlasma2024/IC-PLANTS2024/APSPT-13, Mar. 3-Mar. 7, 2024. Nagoya, Japan (Poster)

C484. J.G. Duh, "Solder joint reliability in microbump for microelectronic packages via thin film metallization and doping by surface modification techniques", ISPlasma2024/IC-PLANTS2024/APSPT-13, Mar. 3-Mar. 7, 2024. Nagoya, Japan (Invited talk)

C483. Z.X. Chen, "Eliminating Preferred orientation and Refining Grain Size with Ni doping in Cu/Sn-3.0Ag-0.5Cu/Cu TLP Bonding under isothermal aging treatment", EPTC 2023, Dec. 5-Dec. 8, 2023. Singapore (Oral)

C482. T.W. Lin, "Microstructural and mechanical analysis of Cu/Sn/Cu microbump by doping Ni and Zn into Cu substrate", EPTC 2023, Dec. 5-Dec. 8, 2023. Singapore (Oral)

C481. Z.Y. Wu, "Low temperature bonding of Cu/Sn58Bi/Cu with 5μm microbump for high temperature applications", EPTC 2023, Dec. 5-Dec. 8, 2023. Singapore (Oral)

C480. J.G. Duh, "Enhancing Mechanical Properties of Full Intermetallic Microbump by Alloying Substrate via Thermocompression Bonding", MRST 2023, Nov. 17-Nov. 20, 2023. Hhinchu, Taiwan (Keynote)

C479. T.W. Lin, "Improving mechanical properties ofCu/Sn3.5Ag/Cu microbump via Zn and Ni addition", MRST 2023, Nov. 17-Nov. 20, 2023. Hhinchu, Taiwan (Poster)

C478. Y.K. LEE, "Microstructure modification by doping Zn and Ni in Cu substrates of Cu/Sn-3.5Ag/Cu microbumps",  MRST 2023, Nov. 17-Nov. 20, 2023. Hhinchu, Taiwan (Poster)

C477. Y.C. Li, "Enhancing Mechanical Strength of Full Intermetallic Microbumpvia Grain Refinementby Zn in Thermocompression Bonding", MRST 2023, Nov. 17-Nov. 20, 2023. Hhinchu, Taiwan (Poster)

C476. Z.X. Chen, "The Influence of Nickel Doping on Grain Size Refinement and Preferred Orientation Diversification in Cu/Sn-3.0Ag0.5Cu/Cu TLP Bonding during Isothermal Aging Treatment", MRST 2023, Nov. 17-Nov. 20, 2023. Hhinchu, Taiwan (Poster)

C475. Z.Y. Wu, "Microstructure evolution of 5μm Cu-xNi-yZn/Sn3.5Ag/Cu transient liquid-phase bondingunder long term thermal aging", MRST 2023, Nov. 17-Nov. 20, 2023. Hhinchu, Taiwan (Poster)

C474. Y.C. Chan, "Effect of silicon content on characteristics, mechanical properties and tribological behavior of (AlCrNbTiMoSix)Nmulticomponent nitride coatings fabricated byradio-frequency magnetron co-sputtering", TACT2023, Nov.12-Nov. 15, 2023. Taipei, Taiwan (Poster)

C473. ​S.H. Chin, "Influence of Si content on the oxidation resistance and thermal stability of (AlCrNbSixTi)N hard coatings", TACT2023, Nov.12-Nov. 15, 2023. Taipei, Taiwan (Poster)

C472. T.L. Wang, "Tribological Performance of Si-Doped Nanocomposite TiAlCrN Coatings", TACT2023, Nov.12-Nov. 15, 2023. Taipei, Taiwan (Poster)

C471. P.Y. Lai, "Tribological Performance of Si-Doped Nanocomposite TiAlCrN Coatings", TACT2023, Nov.12-Nov. 15, 2023. Taipei, Taiwan (Poster)

C470. C.H. Chen, "Oxidation behavior of (AlCrNbTiB)N multicomponent nitride coatingswith various boron contents", TACT2023, Nov.12-Nov. 15, 2023. Taipei, Taiwan (Poster)

C469. Z.Y. Wu, "Elemental distribution and grain orientation in reaction between Sn-3.5Ag and co-sputtering Cu-Ni film", TACT2023, Nov.12-Nov. 15, 2023. Taipei, Taiwan (Poster)

C468. P.H. Huang, "Rapid Transformation of Organic Waste to Nitrogenous Fertilizer through Plasma Activated Water Treatment",AEPSE 2023, Nov. 5-Nov. 8, 2023. Busan, Korea (Oral)

C467. S.H. Chin, "Effects of Plasma-activated water on Coffee Ground Decomposition and Nitrogenous Substances Formation", AEPSE 2023, Nov. 5-Nov. 8, 2023. Busan, Korea (Oral)

C466. J.G. Duh, "Exploring the compositional space of multicomponent nitride hard coatings through combinatorial approach", JVSS 2023, Oct. 30-Nov. 2, 2023. Nagoya, Japan (Oral)

C465. J.G. Duh, "Exploration of Atmospheric Pressure Plasma Technique in the Surface Modification on Anode Material for High-rate Lithium–ion Battery and Rapid Organic Fertilizer Manufacturing for Sustainable Farming", Global Plasma Forum, Oct. 15- Oct. 18, 2023. Aomori, Japan (Plenary)

C464. P.Y. Lai, "Mechanical characteristics in epitaxial stabilization ZrTiN/NbN superlattice coatings", ICMCTF, May. 21-May. 26, 2023. San Diego, California, USA (Oral)

C463. Y.C. Chan, "Influence of Si Content on the Mechanical Properties, Microstructure and Tribological Behaviors of (AlCrNbSiTi)N Coatings", ICMCTF, May. 21-May. 26, 2023. San Diego, California, USA (Oral)

C462. S.Y. Hsu, "Oxidation behaviors of (AlCrSiTi)N coatings on AISI 304 steel: A Combinatorial Study", ICMCTF, May. 21-May. 26, 2023. San Diego, California, USA (Oral)

C461. Z.Y. Wu, ''Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu TLP soldering by TCB process '',TMS 2022 Annual Meeting & Exhibition, Feb. 27–Mar. 3, 2022, Anaheim, California, USA

C460. Che-Ya Wu, "Freeze Drying Process Applied in Constructing 3D-Net Architecture Cellulose Nanofiber / Waste-Si Composite in Lithium-ion Battery Anode Materials", 2022, MRST

C459. Yin-Ku Lee, "Microstructure modification by doping Zn and Ni in Cu substrates of Cu/Sn-3.5Ag/Cu microbumps", 2022, MRST

C458. Yi-Cheng Li, "Enhancing Mechanical Strength of Full Intermetallic Microbump via Grain Refinementby Zn in Thermocompression Bonding", 2022, MRST

C457. Pin-Wei Huang, "Microstructural observation and quantitative analysis of Cu/Sn/Cu microbump with Ni and Zn doping into Cu substrates", 2022, MRST

C456. Chen-Sung Chao, "Diversifying Grain Orientation and Refining Grain Size of 5μm Cu/Sn/Cu TLP Bonding via Ni/SAC305/Cu System", 2022, MRST

C455. Che-Ya Wu, "Freeze Drying Process Applied in Constructing 3D-Net Architecture Cellulose Nanofiber / Waste-Si Composite in Lithium-ion Battery Anode Materials", 2022, ICGET

C454. Pin-Yuan Lai, "Tribological Performance of Si-Doped Nanocomposite TiAlCrN Coatings", 2022, TACT

C453. Chen-Chih Hao, "Mechanical and High Temperature Tribological Properties of (AlCrNbTiB)N High Entropy Alloy Nitride Coatings", 2022, TACT

C452. Ying-Yang Li, "Fabrication of Silicon/Carbon Composite with Carbon Nanofiber for Lithium Storage", 2021, MRST

C451. Yin-Ku Lee, "IMC suppression and phase stabilization of Cu/Sn-Bi/Cu microbump via Zn doping", 2021, MRST

C450. Zih-You Wu, "Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu transient liquid phase soldering in electronic package", 2021, MRST

C449. Che-Ya Wu, "Preparation of waste-Si/ N-doped Carbon Core-Shell Structure via Vapor Deposition Polymerization of Polypyrrole Applied in Li-ion Battery", 2021, MRST

C448. Chen-Sung Chao, "Retaining multi-oriented and fine grain structure in Cu/SAC305-0.1Ni/Cu microbump via isothermal aging treatment", 2021, MRST

C447. Che-Ya Wu, "Constructing Cellulose Nanofiber / Recycled Silicon Composite 3D-Net Structure from Waste Rice Straw via Freeze Drying Process for Lithium-ion Battery Anode Materials", 2021, 儲能科技創意海報

C446. Tzu-Ling Chen, "Effect of NiTi metallic layer thickness on scratch resistance and wear behavior of high entropy alloy (CrAlNbSiV) nitride coating", 2021, TACT

C445. Tan-Ling Wang, "The Influence of Metallic Layer Materials on Tribological Performance of High Entropy Alloy Cr0.35Al0.25Nb0.12Si0.08V0.20 Nitride Coating", 2021, TACT

C444. Tsai-Ni Ku, "Microstructure and high-temperature tribological characteristics of Self-lubricating TiAlSiN/VSiN Multilayer Coatings", 2021, TACT

C443. Zih-You Wu, "Phase identification and interface evolution of ENIG/Cu-core SAC305/ENIG solder joints after the thermal electrical coupling reliability test", 2020, MRST

C442. Yu-Ching Wang, "Diversifying Grain Orientation and Expediting 10μm Cu/Sn/Cu TLP Bonding Process with Ni Doping", 2020, MRST

C441. Ying-Yang Li, "Realizing High Capacity Si/C Composite Anode for Lithium Ion Battery with Waste Silicon through Poly-Pseudorotaxane Binder Additive Approach", 2020, MRST

C440. Zhe-Yuan Wu, "Boron-doped Graphene/Silicon Composite as Anodes of Lithium-ion Batteries", 2020, MRST

C439. Ya-Ting Tsai, "Synthesis of Ni-Rich NMC Cathode Material by Redox-assisted Deposition Method for Lithium ion Batteries", 2020, MRST

C438. Che-Ya Wu, "Tuning (003) Interplanar Space by Boric acid Co-sintering to Enhance Li+ Storage and Transfer in Li(Ni0.8Co0.1Mn0.1)O2 Cathode", 2020, MRST

C437. Ying-Yang Li, "Realizing High Capacity Si/C Composite Anode for Lithium Ion Battery with Waste Silicon through Poly-Pseudorotaxane Binder Additive Approach", 2020, ICGET

C436. Zhe-Yuan Wu, "Boron-doped Graphene/Silicon Composite as Anodes of Lithium-ion Batteries", 2020, ICGET

C435. Ya-Ting Tsai, "Synthesis of Ni-Rich NMC Cathode Material by Redox-assisted Deposition Method for Lithium ion Batteries", 2020, ICGET

C434. Che-Ya Wu, "Tuning (003) Interplanar Space by Boric acid Co-sintering to Enhance Li+ Storage and Transfer in Li(Ni0.8Co0.1Mn0.1)O2 Cathode", 2020, ICGET

C433. Sheng-Yu Hsu, "Combinatorial synthesis and mechanical properties of (Hf-Nb-Ti-V-Zr)N thin film", 2020, TACT

C432. Tzu-Chieh Wang, "The High-Temperature Tribological Characteristics of (Cr0.35Al0.25Nb0.12Si0.08V0.20 )N Multi-component Nitride Coating", 2020, TACT

C431. Tzu-Chia Wang, "Improvement of High Entropy Alloy Nitride Coatings (AlCrNbSiTiMo)N on Mechanical and High Temperature Tribological Properties by Tuning Mo content", 2020, TACT

C430. J. G. Duh,"Development of Plasma Technology Apply in Semiconductor Industry Wastewater, Energy Storage Materials and Smart Agriculture ", Nov. 6. 2020 MRST, Taipei, Taiwan

C429. J. G. Duh,"Enhancing the Biocompatibility of Cardiovascular Materials and Producing the Nitrogen Fertilizers via Atmospheric Pressure Plasma"The 1st International Symposium on Applied Plasma Science and Engineering for Agro and Bio Industry, Feb. 3. 2020, Chiang Mai, Thailand

C428. Sheng-Yu Hsu, "Tribological behavior of (Ti-Zr-Hf-NbV)N thin film at elevated temperature", TACT 2019, Nov.19, Taipei, Taiwan 

C427. Yu-Chia Lin, "Investigation on the tribological characteristics of non-equimolar high entropy nitride thin film (CrAlNbSiV)N at high temperature", TACT 2019, Nov.19, Taipei, Taiwan 

C426. Wei-Li Lo, "Mechanical and high temperature tribological performance of multicomponent nitride coatings (AlCrNbSiTiMo)N", TACT 2019, Nov.19, Taipei, Taiwan 

C425. Chia-Yu Su, "Modification of LiMn0.8Fe0.2PO4/nitrogen-doped carbon via dielectric barrier discharge plasma for high performance lithium ion batteries", TACT 2019, Nov. 18, Taipei, Taiwan 

C424. J. G. Duh,"Mechanical and High Temperature Tribological Performance of High Entropy Nitride Coatings", 2019 Workshop on Structures and Properties of HEAs Program & Abstract，Oct. 25. 2019, Yanghzou, Jiangsu, China

C423. Collin Fleshman and J.G Duh, "The fractal nature analysis applied on grain formation SAC305/ OSP Cu and SAC305-0.05Ni/ OSP Cu solder joints", Advanced Ceramics and Application VIII, Sep. 22. 2019, Belgrade, Serbia

C422. J.G.Duh, "Modification and Construction of Cathode Materials for Advanced Li-ion Batteries (plenary talk)", Advanced Ceramics and Application VIII, Sep. 22. 2019, Belgrade, Serbia

C421. J.G. Duh, "Multi-functionality of Multi-component Zr-Cu-Ni-Al-N thin films for diffusion barrier, anti-bacteria and bio-compatibility", June. 12. 2019, Kanazawa, Japan

C420. Y.C. Lin and J. G. Duh, High Entropy Nitride Thin Film (CrAlNbSiV)N for Tribological Characteristics at High Temperature", ICMCTF 2019, May. 23. 2019, San Diego, California, USA

C419. W.L. Lo and J. G. Duh, Search of New (AlCrNbSiTiMo)N Coatings for Feasible Application at High Temperature", ICMCTF 2019, May. 23. 2019, San Diego, California, USA

C418. Y.C. Lin and J. G. Duh, "Influence of Mo Contents on Elevated Temperature Tribological Characteristics of CrAlMoSiN Nanocomposite Coating", ICMCTF 2019, May. 22. 2019, San Diego, California, USA

C417. W.L. Lo and J. G. Duh, "Improvement of CrMoN/ SiNx Multilayered Coatings on Mechanical and High
Temperature Tribological Properties", ICMCTF 2019, May. 23. 2019, San Diego, California, USA

C416. J.G. Duh and J. G. Duh, "The Architecture Design and Novel Material Selection for Improved Reliability of Solder Interconnections in Microelectronic Packaging" (invited talk)",International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors VII, May. 19. 2019, Tokyo, Japan

C415. J. G. Duh, ''Surface modification of energy materials via atmosphere pressure plasma treatment for high performance lithium-ion batteries'', 第十三屆海峽兩岸工程材料研討會, Ping-tung, Taiwan

C414. H. Chen and J. G. Duh, "Effect of Ag on Mechanical Properties of Sn-Ag-Cu Micro-BGA Joints", TMS 2019, Mar. 12. 2019, San Antonio, Texas, USA

C413. C. Fleshman and J. G. Duh, "The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/Cu and SAC1205-0.1 Ni/Cu solder joint before and after aging",TMS 2019, Mar. 12. 2019, San Antonio, Texas, USA

C412. J.G. Duh,"Atmosphere pressure plasma treatment of anode materials for advanced lithium-ion batteries" (invited talk), APSE workshop, Jan. 27. 2019, Kuala Lumpur, Malaysia

C411. J.G. Duh,"Exploration of high voltage cathode and high energy/power anode materials for advanced LIB" , 2018中國新材料產業發展大會, Dec. 20. 2018, Nanjing, China,(invited talk)

C410. H. Tao, W.L Lo, J.W Lee and J.G Duh, " Influence of Mo contents on elevated temperature tribological characteristics of CrAlMoSiN nanocomposite coating", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan

C409. L.K Yeh-Liu, Y.C Lin, J.W Lee and J.G Duh, "Improvement of CrMoN/SiNx Coating on Mechanical and High Temperature Tribological Properties by Biomimetic", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan

C408. T.T Chou and J.G Duh, "Achieving collapse-free solder joints during reflow process via low melting point mixed solder bonding for 3D-IC application", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan

C407. Collin Fleshman and J.G Duh, "The variation of microstructure and the enhancement of shear strength in SAC1205-xNi/OSP Cu solder joint before and after aging", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan

C406. R.W Song and Jenq-Gong Duh, "Inhibition of Large Primary Ag3Sn in Cu/Sn-3.5 Ag/Ni-Au MicroBump by Pd Addition", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan

C405. H. Chen,T.T. Chou, Collin Fleshman, R.W Song and J.G Duh,"Effect of Ag on Mechanical Properties of Sn-Ag-Cu Flip Chip Solder Joints", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan

C404. R.C Chen, L.Y Hsiao, C.Y Wu and J.G Duh,"Enhanced Electrochemical Performance of Silicon Waste  via Rapid Thermal Process for Lithium-ion Battery Anode", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan(poster)

C403. C.Y Wu and J.G Duh,"A New Ionic Network of Aqueous Polymer Binder for Enhancing the Electrochemical Performance in Li-ion batteries", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan

C402. G.T Ye, P.Y Chen, S.Y Hsu and J.G Duh,"Improving the Cycle Stability of SiOx Anode Material by the Bio-inspired Design of SiOx-PI multilayer structure", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan

C401. H.H Lin, H. Yang, C.Y Wu, S.Y Hsu and J.G Duh, "Atmospheric Pressure Plasma Jet Irradiation of N Doped Carbon Decorated on Li4Ti5O12 Electrode as a High Rate Anode Material for Lithium Ion Batteries", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan(poster)

C400. C.Y Wu, H. Yang, C.Y Wu, J.G. Duh ,"Structure Modification of SnS with N-doped Carbon by Polymer Additive Applied in Lithium ion battery, 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan(poster)

C399. J.G. Duh,"Application of multi component alloys thin films for diffusion barrier in microelectronic", 第十二屆中國表面工程大會, Nov. 10, 2018, Kunming, China.(plenary talk)

C398. R.W. Song and J.G. Duh,"Inhibiting the Large Primary Ag3Sn in Cu/Sn-Ag/ENIG Solder Joints with Additional Pd Depositery", MS&T 2018, Oct.14, 2018, Columbus, USA.

C397. T.T. Chou and J.G. Duh,"Improving ball shear strength of lead free solder joint via Ni-doped solder and Ni-based UBM", MS&T 2018, Oct.14, 2018, Columbus, USA.

C396. H. Tao, Y.T. Lai, W.L. Lo and J.G. Duh,"Improving the Hydrophilic Characteristic of Anti-fogging Glass by Atmospheric Pressure Plasma Surface Modification",TACT 2018, Oct. 12-13,2018,Taipei,Taiwan(poster)

C395. C.T. Ye, P.Y. Chen, S.Y. Hsu and J.G. Duh,"Investigation of Mechanical Properties of Bio-inspired SiOx/PI Multilayered Thin Film",TACT 2018, Oct. 12-13,2018,Taipei,Taiwan(poster)

C394. C.Y. Wu, and J.G. Duh,"Preparation and Characterization of Li(Ni0.5Mn0.3Co0.2)O2 Thin Film as Cathode Electrodes for Lithium Batteries",TACT 2018, Oct. 12-13,2018,Taipei,Taiwan(poster)

C393. L.K. Yeh-Liu, Y.T.Lai, Y.C. Lin and J.G. Duh,"Plasma Treated Water Synthesized by Multi-Tubular Dielectric Barrier Discharge System for Agricultural Applications",TACT 2018, Oct. 12-13,2018,Taipei,Taiwan(poster)

C392. J.G. Duh,"Development of Li(Ni0.5Mn0.3Co0.2)O2 and LiMn0.8Fe0.2PO4 Thin Film Electrodes for Next Generation Li-ion Batteries", PSE 2018, Sept.17-21, 2018, Garmisch-Partenkirchen, Germany.(poster)

C391. J.G. Duh,"Exploration of novel anode and cathode materials for advanced Lithium ion battery", FMS 2018, Aug. 17, 2018, Xiamen, China.(invited talk)

C390. J.G. Duh,"Applying SEM, EPMA and EBSD Analytic Techniques on Solder Joint for Microelectronic Package Development", Microscopy and Microanalysis 2018, Aug. 7, 2018, Baltimore,MD, USA.

C389. H.H. Lin and J.G. Duh,"One-step C and N co-doped on Li4Ti5O12 electrode by atmospheric pressure plasma treatment",IMLB 2018, Jun.17-22,2018,Kyoto,Japan(poster)

C388. C.Y. Wu and J.G. Duh,Flower-like structure of SnS with N-doped carbon via polymer additive for lithium-ion battery and sodium-ion battery"",IMLB 2018, Jun.17-22,2018,Kyoto,Japan(poster)

C387. C.Y. Wu and J.G. Duh,"Polymer composites of micro-structured Li2Ni2TeO6 as separator for
all solid-state lithium battery",IMLB 2018, Jun.17-22,2018,Kyoto,Japan(poster)

C386. R.C. Chen, C.Y. Wu and J.G. Duh,"Facile synthesis of micro-sized silicon/carbon composites via
rapid thermal process for lithium-ion battery anode",IMLB 2018, Jun.17-22,2018,Kyoto,Japan(poster)

C385. J.G. Duh,"Pursuit of multilayer thin films for multiple function via crystalline/amorphous, organic/inorganic hybrid and bio-inspired approach", LFM 2018, May. 15, 2018, Taipei,Taiwan.(keynote speech)

C384. J.G. Duh,"Exploitation of Surface Modification and Architecture Control for Multi-Functional Coatings via Nano-Composite, Multilayer, Hybrid Organic/Inorganic, and Bio-Inspired Approach", ICMCTF 2018, Apr. 25, 2018,San Diego, California, USA.(invited talk)

C383. J.G. Duh,"Exploration of Zr-Cu Based Thin Film Metallic Glass for Mechanical Strength, Thermal Stability, Bio-antimicrobial Ability and Diffusion Barrier", ICMSNT 2018, Mar. 30, 2018, Chengdu, China.(keynote speaker)

C382. L.K. Yeh-Liu, H.W.Chen and J.G. Duh,"Improvement on Mechanical and High Temperature Tribological Properties of CrMoN/SiNx by multilayered Architecture ", TACT 2017,Oct. 15-18, 2017,Hualien, Taiwan.(poster)

C381. H. Tao, H.W.Chen and J.G. Duh,"The Improvement on High-Temperature Tribological Properties of CrAlSiN Nanocomposite Coating by Mo Doping", TACT 2017,Oct. 15-18, 2017,Hualien, Taiwan.(poster)

C380. G.T. Ye, H.W.Chen and J.G. Duh,"Investigation of Electrochemical Properties of Bio-inspired SiOx/PI Multilayered Thin Film Anode for Lithium Ion Batteries", TACT 2017,Oct. 15-18, 2017,Hualien, Taiwan.(poster)

C379. H. Tao, H.W.Chen and J.G. Duh,"Newly-developed CrAlMoSiN Nanocomposite Coating for Enhanced High-temperature Tribological Properties", AEPSE 2017,Sept. 11-15, 2017,jeju island, Korea.

C378. L.K. Yeh-Liu, H.W.Chen and J.G. Duh,"Improvement of CrMoN/SiNx Coatings on Mechanical and High Temperature Tribological Properties by Multilayered Architecture Design", AEPSE 2017,Sept. 11-15, 2017,jeju island, Korea.

C377. Y.T. Liao, H.W.Chen, J.Lee and J.G. Duh,"Enhancing the Biocompatibility of PET and ETFE via Atmospheric Dielectric Barrier Discharge Surface Modifaction", AEPSE 2017,Sept. 11-15, 2017,jeju island, Korea.(poster)

C376. G.T. Ye, H.W.Chen and J.G. Duh,"Investigation of Electrochemical Properties of Bio-inspired SiOx/PI Multilayered Thin Film Anode for Lithium Ion Batteries", AEPSE 2017,Sept. 11-15, 2017,jeju island, Korea.(poster)

C375. Y.C. Lu and J.G. Duh ,"Exploration of High Temperature Tribological Characteristics of CrMoSiN Nanocomposite via Silicon doping", AEPSE 2017,Sept. 11-15, 2017,jeju island, Korea.(poster)

C374. J.Lee and J.G. Duh, "Taguchi Design of Experiment Method and Its Application on Process Optimization of Zr-Cu-Ni-Al-N TFMG Coating in Pursuit of Enhanced Mechanical properties", AEPSE 2017,Sept. 11-15, 2017,jeju island, Korea.(poster)

C373. W.T.Tsou, C.Y. Wu and J.G. Duh, Enhanced Electrochemical Properties of Nb-TiO2/Sulfur Dual Layered Structure Applied to Lithium-Sulfur Batteries, 68th ISE,Oct. 27- Nov. 1, 2017, Rhode Island, USA(poster)

​​C372. H. Yang, J.G. Duh, The electrochemical studies of new substituted olivine LiMn1-xVOxPO4 as a cathode material in LIBs, 68th ISE,Oct. 27- Nov. 1, 2017, Rhode Island, USA

​​C371. C.Y. Wu, J.G. Duh, A New Ionic Network for Aqueous Polymer Binder for Enhancing the Electrochemical Performance of Li-Ion Batteries, 68th ISE,Oct. 27- Nov. 1, 2017, Rhode Island, USA

C370. Y.J. Chen, Metal Industries R&D Centre (MIRDC) and J.G. DUH, The Development of Ultrathin Zr-Cu-Ni-Al-N Thin Film Metallic Glass as a Diffusion Barrier for Cu-Si Interconnect, ICMCTF 2017, Aprl. 24 - 28, 2017, San Diego, California, USA.

C369. Y.C. Lu and J.G. Duh, The Mechanical and Tribological Properties of Nanocomposite CrMoSixN Coatings, ICMCTF 2017, Aprl. 24 - 28, 2017, San Diego, California, USA.

C368. Tzu-Ting Chou, Cheng-Ying Ho, Wei-Yu Chen and Jenq-Gong Duh, "Thermocycling Stress Induced Slip Band Sliding in Ultra-thin ENEPIG Joints", The Minerals, Metals & Materials Society 2017, Feb. 26 - Mar. 2, 2017, San Diego, California, USA.

C367. C. Fleshman and J. G. Duh, "The Variation of Grain Structure and the Enhancement of Shear Strength in SAC305-0.1Ni/Cu Solder Joint before and after Aging", The Minerals, Metals & Materials Society 2017, Feb. 26 - Mar. 2, 2017, San Diego, California, USA.

C366. Rui-Wen Song and Jenq-Gong Duh, "Controlling Interfacial IMC Phase via Modifying Bi Composition in Low Temperature Bi-33In/Cu Solder Joint", The Minerals, Metals & Materials Society 2017, Feb. 26 - Mar. 2, 2017, San Diego, California, USA.

C365. Y. C. Lu, C. C. Chang and J. G. Duh ''Investigating tribological properties of nanocomposite  CrMoSixN coatings at elevated temperature'', 2016 MRST, Nov. 19-20, 2016, ITRI, Hisnchu, Taiwan.(poster)

C364. R. W. Song, W. Y. Chen and J. G. Duh, "Grain structure modification of Cu-Sn IMCs by applying Cu-Zn UBM on transient liquid-phase bonding in novel 3D-IC Technologies", 2016 MRST, Nov. 19-20, 2016, ITRI, Hisnchu, Taiwan.(poster)

C363. C. Fleshman, W. Y. Chen, T. T. Chou and J. G. Duh, "The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/OSP Cu solder joint", 2016 MRST, Nov. 19-20, 2016, ITRI, Hisnchu, Taiwan.(poster)

C362. H. Yang and J. G. Duh, "Fabricating TiO2 nanoplates with uniform mesopores for high-rate Sodium-ion battery", 2016 MRST, Nov. 19-20, 2016, ITRI, Hisnchu, Taiwan.(poster)

C361. J. Lee and J. G. Duh ''The development of ultrathin Zr-Cu-Ni-Al-N thin film metallic glass as a diffusion barrier in Cu-Si interconnect'', Nov. 19-20 2016, ITRI, Taiwan.(poster)

J. G. Duh, "回首四十年材料路", Nov. 19-20 2016, ITRI, Taiwan. (Invited talk)

C360. Y. C. Lu, C. C. Chang and J. G. Duh ''Investigating tribological properties of nanocomposite  CrMoSixN coatings at elevated temperature'', TACT2016, Nov. 11-12 2016, National Pingtung University of Science and Technology, Taiwan.(poster)

C359. J. Lee and J. G. Duh ''The development of ultrathin Zr-Cu-Ni-Al-N thin film metallic glass as a diffusion barrier in Cu-Si interconnect'', TACT2016, Nov. 11-12 2016, National Pingtung University of Science and Technology, Taiwan.(poster)

C358. R. W. Song and J. G. Duh, "Characterization of Bi-33In Low Temperature Solder with Cu UBM", Materials Science and Technology 2016, Oct. 23-27, 2016, Salt Lake City, USA.

C357. T. T. Chou and J. G. Duh, "The Role of Ultrathin-Ni(P) layer of ENEPIG Metallization in ENEPIG/SAC305/OSP Cu Solder Joints under Thermocycling Test for Automotive Electronics", Materials Science and Technology 2016, Oct. 23-27, 2016, Salt Lake City, USA.

C356. C. K. Lan and J. G. Duh, "Improvement of Li4Ti5O12 anode materials via atmosphere pressure irradiation and carbon passivation layer approach for stable high rate lithium-ion batteries", 12th Cross-strait Seminar on thin film Science and Technology, Oct. 22-25, 2016, Chengdu, China.

C355. J. G. Duh, "Surface modification of energy materials (Si, Li4Ti5O12, graphene and TiO2) via atmosphere pressure plasma treatment for high performance lithium-ion batteries", 7th International Conference on Surface Engineering, Oct. 22-25, 2016, Chengdu, China. (Prof. Duh Invited talk)

C354. H. Yang and J. G. Duh, "Constructing Titania nanoplates with uniform particle arrays for Lithium-ion and Sodium-ion battery", Advanced Energy Materials, Sep. 12-14, 2016, University of Surrey, Guildford, England. (poster)

C353. C. Y. Wu, W. E. Chang, Y. G. Sun, J. M. Wu and J. G. Duh, "Creating MoS2 @ α-Fe2O3 nanoclusters with three dimensional binary composite as lithium ion battery anodes for enhanced electrochemical performance", Advanced Energy Materials, Sep. 12-14, 2016, University of Surrey, Guildford, England. (poster)

C352. J. Lee and J. G. Duh, "The Development of a Zr-Cu-Al-Ag-N TFMG Coating in Pursuit of Improved Mechanical, Thermal, and Antimicrobial Property for Bio-medical Application", 15th International Conference on Plasma Surface Engineering, Sep. 12-16, 2016, Garmisch-Partenkirchen, Germany.

C351. B. H. Chen, S. I. Chuang and J. G. Duh, "The multiple surface modifications via plasma jet and carbon evaporation to revive the recycled waste from solar industry for Si-based anode materials in lithium ion batteries", Energy Future Conference 2016, Jul. 4-6 2016, University of New South Wales, Sydney, Australia

C350. Y. Wang, J. W. Lee and J. G. Duh, ''Microstructure Control in Self-lubricating CrAlN/VN Multilayer Coatings for Improved Mechanical Response and High-temperature Tribological Characteristics'', ICMCTF 2016, Apr 25-29,
San Diego, U.S.A.

C349. S. I. Chuang, H. Yang, H. W. Chen and J. G. Duh, ''Modification of TiO2 powder via atmospheric dielectric barrier discharge treatment for high performance lithium-ion battery anodes'', ISPlasma2016/IC-PLANTS2016, Mar 6-10, 2016,Nagoya University, Nagoya Japan.

C348. T. C. Yang, Y. H. Huang and J. G. Duh , "Novel Lamellar MCMB Supported Sulfur Cones with Carbon Overlayer Coating as Shuttle-effect Barrier for Lithium Sulfur Batteries Cathode", TACT 2015 International Thin Films Conference, 
Nov 15-18, 2015, Tainan, Taiwan.

C347. J. G. Duh, ''A Revival of Waste:Atmospheric Pressure Nitrogen Plasma Jet Enhanced Jumbo Silicon/Silicon Carbide Composite in Lithium Ion Batteries'', APSPT-9th/SPSM-28th, Dec 12-15, 2015, Nagasaki University, Bunkyo-Campus, Japan. (plenary talk)

C346. H. Yang and J. G. Duh, ''Constructing Titania nanoplates with uniform particle arrays for high-rate capabilities of Lithium-ion and Sodium-ion battery'', Material Research Society Fall Meeting and Exhibit, Nov 24- Dec 4, 2015, Massachusetts, Boston, USA. (Poster)

C345. C. Y. Wu, C. C. Chang and J. G. Duh, ''Enhanced Cycling Efficiency and Rate Capability of Silicon nitride coated Silicon on Copper Cones for Thin Film Lithium-Ion Battery'', Material Research Society Fall Meeting and Exhibit, Nov 24- Dec 4, 2015, Massachusetts, Boston, USA. (Poster)

C344. T. H. Gee, Y. H. Huang and J. G. Duh, "Well Dispersive Nano-Si/Carbon matrix via In-spaced Carbonization as High Performance Lithium Ion Battery Anodes", Material Research Society Fall Meeting and Exhibit, Nov 24- Dec 4, 2015, Massachusetts, Boston, USA. (Poster)

C343. W. Tu, W. Y. Chen, T. T. Chou and J. G. Duh, "The microstructure evolution in Cu/Sn-3.5Ag/ENIG (wt %) microbumps", 中國材料科學學會年會, Nov 20-22, 2015, Kaohsiung, Taiwan.(Poster)

C342. C. C. Chang, H. W.  Chen, J. W. Lee, J. G. Duh, "Development of Si-modified CrAlSiN Nanocomposite Coating for Anti-wear Application in Extreme Environment", 中國材料科學學會年會, Nov 20-22, 2015, Kaohsiung, Taiwan.(Poster)

C341. C. Lee, W. Y. Chen, T. T. Chou, T. K. Lee, and J. G. Duh,”The investigation of interfacial and crystallographic observation in the Ni(V)/ SAC/OSP Cu solder joints with high and low silver content during thermal cycling”, 中國材料科學學會年會, Nov 20-22, 2015, Kaohsiung, Taiwan.(Poster)

C340. C. Liu, S. I. Chuang, W. T. Wong and J. G. Duh "Nitrogen-doping of ZnCo2O4 Anode via Atomospheric Pressure Plasma Treatment for Enhanced Electrochemical Performances", TACT 2015 International Thin Films Connference, Nov 15-18, 2015, Tainan, Taiwan. (Poster)

C339. T. H. Gee, W. Y. Chou and J. G. Duh, "Enhanced Rate Capability of Spinel LiNi0.5Mn1.5O4 Cathodes with Carbon Overlayer Coating", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan. (Poster)

C338. P. W. Chen, H. W. Chen, P. Y. Chen and Jenq-Gong Duh, "Characteristics of Hybrid Titanium Dioxide /Polyimide Multilayered Thin Films", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan. (Poster)

C337. J. Lee and Jenq-Gong Duh, "Modification of property in Zr-Cu-Ni-Al-N thin film metallic glass via composition control", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

C336. H. Yang, S. I. Chuang, H. W. Chen and J. G. Duh, ''Modification of TiO2 powder via atmospheric dielectric barrier discharge treatment for high performance lithium-ion battery anodes'', TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

C335. C. K. Lan and Jenq-Gong Duh, "Stable high-rate performance of N-doped carbon overlayer-coated Li4Ti5O12 electrodes prepared by Argon/Nitrgen binary plasma jet irradiation", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

C334. Y. Wang, J. W. Lee and Jenq-Gong Duh, "High-temperature Tribological Characteristics in CrAlN/VN Multilayer Coatings", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

C333. B. H. Chen, C. K. Lan and J. G. Duh, "The Pitch Free Proceeding of Recycled waste for Si-based lithium ion batteries via C assisted method", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

C332. C. C. Chang, H. W. Chen, J. W. Lee and J. G. Duh, "Development of Si-modified CrAlSiN Nanocomposite Coating for Anti-wear Application in Extreme Environment", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

C331. C. Y. Wu, C. C. Chang and J. G. Duh, ”Silicon nitride coated silicon thin film on three dimensions current collector for lithium ion battery anode“, TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan .

C330. J. Lee, and J. G. Duh "Applying Composition Control to Enhance the Mechanical an Thermal Properties of Zr-Cu-Ni-Al-N Thin Film Metallic Glass", 9th International Conference on Reactive Plasmas, Oct 12-16, 2015, Honolulu, Hawaii.

C329. S. I. Chuang, C. K. Lan, H. Yang, H. W. Chen and J. G. Duh, "Potential Alternatives for Advanced Energy Material Processing in High Performance Li-ion Batteries via Atmospheric Pressure Plasma Treatment", 9th International Conference on Reactive Plasmas, Oct 12-16, 2015, Honolulu, Hawaii.

C328. J. G. Duh, ''Exploration of Nanocomposite and Nanomultilayer Coating via Hybrid Organic/Inorganic and Bio-inspired Approach'', Materials Science and Technology 2015, C. M. Li Symposium on Nanomechanical Behavior of Material, in Honor of Prof. C. M. Li's 90th Birthday, Oct. 4-8, 2015, Columbus, Ohio USA. (invited talk)

C327. C. Lee, W. Y. Chen, T. T. Chou, Tae Kyu Lee and J. G. Duh, Cisco Systems Inc,''The Investigation of Crack Initiation and Propagation in the Ni(V)/SAC/OSP Cu Solder Joints with High and Low Silver Content during Thermal Cycling Test'', Materials Science and Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

C326. Y. Wang, J. W. Lee and J. G. Duh, ''High Temperature Tribological Properties in CrAlSiN/VN Multilayer Coatings'', Materials Science and Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

C325. T. T. Chou, W. Y. Chen, C. Fleshman, W. Tu,  C. Lee and J. G. Duh, ''Investigatig the Stability of Hexagonal-(Cu,Ni)6Sn5 Phase with Doping Ni in Pb-Free Solder Joints via First Principle Simulation'', Materials Science and Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

C324. W. Y. Chen, C. Fleshman, W. Tu and J. G. Duh, ''Mis-orientation between the Grains of Cu-Sn IMC from Cu and Cu-Zn Sides in Cu/Sn-3.5Ag/Cu-xZn Microbumps'', Materials Science and Technology2015, Oct. 4-8, 2015, Columbus, Ohio USA.

C323. W. Tu, W. Y. Chen, T. Chou, J. G. Duh, ''The Microstructure Evolution in Cu/Sn-3.5Ag/ENIG(wt%) Microbumps'', Materials Science and Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

C322. C. Fleshman, W. Y. Chen, T. T. Chou, T. K. Lee, Tae Kyu Lee and J. G. Duh, National Tsing Hua University; Cisco Systems Inc, ''The Variation of Grain Structure and the Enhancement of Shear Strength in SAC305-0.1Ni/OSP Cu Solder Joint'', Materials Science and Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

C321. C.C.Chang and J.G.Duh, "Ultra-High Temperature Tribological Characteristics in Si Modified CrAlSiN Nanocomposite Coatings", 10th Anniversary AEPSE Conference, Sep. 20-24, 2015, Korea.