B124. Yin Wang, Jyh-Wei Lee and Jenq-Gong Duh, "Mechanical strengthening in self-lubricating CrAlN/VN multilayer coatings for improved high-temperature tribological characteristics", Surface & Coatings Technology, 303 (2016) 12-17.

B123.  H. M. Yang, Y. C. Chan, T. H. Hsu, H. W. Chen,  J. W. Lee, J. G. Duh and P. Y. Chen, "Synthesis and Characterization of Nacre-inspired Zirconia/Polyimide Multilayer Coatings by a Hybrid Sputtering and Pulsed Laser Deposition Technique", Thin Solid Films. 

B122.  S. I. Chuang, H. Yang, H. W. Chen and J. G. Duh, "Modification of TiO2 powder via Atmospheric Dielectric Barrier Discharge Treatment for High Performance Lithium-ion Battery Anodes", Thin Solid Films. 

B121.  C. C. Chang, H. W. Chen, J. W. Lee and J. G. Duh, "Development of Si-modified CrAlSiN Nanocomposite Coating for Anti-Wear Application in Extreme Environment", 42nd International Conference on Metallurgical Coatings and Thin Films, Apr. 20-24, 2015, San Diego, USA. 

B120. S. I. Chuang and J. G. Duh, "Exploration of Surface Hydrophilic Properties on AISI 304 Stainless Steel and Silicon Wafer Against Aging after Atmospheric Pressure Plasma Treatment", Japanese Journal of Applied Physics.

B119.  C. C. Chang, H. W. Chen, J. W. Lee, J. G. Duh, "Influence of Si Contents    on Tribological Characteristics of CrAlSiN Nanocomposite Coatings", The International Conference on Technological Advances of Thin Films & Surface Coatings, Jul. 16-18, 2014, Chongqing City, China.

B118.  W. Y. Chen, C. Y. Yu and J. G. Duh, "Retarding Ag3Sn and Cu3Sn under liquid-state reaction by adding Zn into Cu/Sn-3.5Ag/Cu-15Zn microbump", Materials Science & Technology 2013, Oct 27-31, 2013, Montreal, Quebec, Canada.

B117.  C. Y. Ho and J. G. Duh, "Optimal Ni(P) Thickness Selection in SnAgCu Lead Free Solder/Ultrathin-ENEPIG Law Impedance Surface Finish", The 15th International Conference on Electronic Materials and Packaging, Oct 6-9, 2013, Seoul, Korea.

B116.  Y. C. Chan, H. W. Chen, J. H. Chu and J. G. Duh, "Development of Multi-Functional Coatings-Nanocomposite, Multilayer", Thin Film Metallic Glass, Functional Gradient and Bio-inspired Hybrid Coating," The 9th Asian-European International Conference on Plasma Surface Engineering (AEPSE2013), August 25-30, 2013, Jeju, Korea.

B115.  W.-Y. Chen, C. Y. Yu and J. G. Duh, "Improving the Impact Reliability of the Ni-doped Solder Joint by Applying Cu-Zn Under Bump Metallization", The 14th International Conference on Electronic Packaging Technology (ICEPT 2013), Aug 11-14, 2013, Dalian, China.

B114.  Chien-Fu Tseng, Chi-Yang Yu, Hsiu-Min Lin, Cheng-Ying Ho, Yi-Shin Wu, and Jenq-Gong Duh, "Overview for Current Material Issue in Solder Joint Reliability," 5th Straits Forum on Advanced Packaging Material and Development Trends, June 16-17, 2013, Xiamen, China.

B113.  Y. C. Chan and J. G. Duh, "Architecture, Component and Process Control in Nanocomposite and Multilayer Coatings via Bio-Inspired Approach", The 2nd Cross-strait Conference on Plasma Science, Technology and Application, May 18-19, 2013, Xiamen, China.

B112.  Y. C. Chan, J. H. Chu and J. G. Duh, "Mechanical and Antimicrobial Characteristics in Zr-based Thin Film Metallic Glass at Various Processing Temperature", The 2nd Cross-strait Conference on Plasma Science, Technology and Application, May 18-19, 2013, Xiamen, China.

B111.  H. W. Chen, Y. C. Chan, J. W. Lee and J. G. Duh, "Tribological Behavior of Multilayered Ti-Si-B/Zr-based Thin Film Metallic Glass Coatings with Various Si Contents", The 2nd Cross-strait Conference on Plasma Science, Technology and Application, May 18-19, 2013, Xiamen, China.

B110.  J. H. Chu, H. W. Chen, Y. C. Chan, M. L. Liou, J. W. Lee, Jason S. C. Jang and J. G. Duh, "Mechanical and Antimicrobial Characteristics in Zr-based Thin Film Metallic Glass at Various Processing Temperature", International Conference on Metallurgical Coating and Thin Films, April 29- May 3, 2013, San Diego, CA, USA.

B109.  Y. H. Wu and J. G. Duh, "Fabrication of Nano-twinned Ni Films as Novel under Bump Metallization on Electronic Packaging via Sputter Coating", ICMCTF 2013 40th International Conference on Metallurgical Coatings and Thin Films, April 29- May 03, 2013, San Diego, CA, USA.

B108.  H. M. Lin, C. Y. Ho, W. L. Chen, Y. H. Wu, D. H. Wang, T. X. Yong, J. R. Lin, Z. W. Lin and J. G. Duh, "Interfacial Reaction and Mechanical Evaluation in Pd-Containing Solder Joints via Drop and High Speed Impact Test", TMS 2013 142th Annual Meeting & Exhibition, March 03-07, 2013, San Antonio, Texas, USA.

B107.  C. Y. Ho and J. G. Duh, ” Phase Transformation and Long-term Stabilization of New ENEPIG Surface Finish with Ultra-thin Ni(P) Deposit Solder Joints in Low Impedance Microelectronic Packaging”, TMS 2013 142th Annual Meeting & Exhibition, March 03-07, 2013, San Antonio, Texas, USA.

B106.  Y. C. Jin and J. G. Duh, "Nanostructured LiNi0.5Mn1.5O4 Cathode Material with Improved Rate Capability for Lithium Ion Battery", TMS 2013 142th Annual Meeting & Exhibition, March 03-07, 2013, San Antonio, Texas, USA.

B105.  W.L Chen and J.G. Duh, "The Relationship between ENEPIG Solder Joints and High Speed Impact Reliability ", TMS 2013 142th Annual Meeting & Exhibition, March 03-07, 2013, San Antonio, Texas, USA.

B104.  C. F. Tseng and J. G. Duh, "Correlation between Microstructure Evolution and Mechanical Strength in Sn-3.0Ag-0.5Cu/ENEPIG Solder Joint", TMS 2013 142th Annual Meeting & Exhibition, March 03-07, 2013, San Antonio, Texas, USA.

B103.  Y. H. Wu and J. G. Duh, ”Retardation of (Cu,Ni)6Sn5 Spalling in Sn-Ag-Cu/Ni Solder Joints via Controlling the Grain Structure of Ni Metallization Layer”, TMS 2013 142th Annual Meeting & Exhibition, March 03-07, 2013, San Antonio, Texas, USA.

B102.  Y. C. Chan, H. W. Chen, P. Y. Chen and J. G. Duh, "Exploration of Novel Bio-inspired Materials via Hybrid Multilayer and Gradient Nanocomposite Coatings", The Sixth International Workshop on Plasma Application & Hybrid Functionally Materials, March 8-11, 2013, Kuala Lumpur, Malaysia. (invited talk)

B101.  Y. C. Chan, H. W. Chen, C. H. Chu and J. G. Duh, "From Nanocomposite Nitride to Novel Thin Film Metallic Glass", 5th International Symposium on Advanced Plasma Science and its Applications for Nitrides and Nanomaterials, January 28-February 1, 2013, Nagoya, Japan. (invited talk)

B100.  J. G. Duh, "Material Issues in Microelectronic Package Reliability", Doctoral Forum of Advanced Functional Materials and Cross-Strait Doctoral Forum 2012, December 14-16, 2012, Xiamen, China. (plenary talk)

B99.  C. Y. Ho and J. G. Duh, "Feasibility and Reliability of ENEPIG Surface Finish with Ultrathin Ni(P) Deposit in Microelectronic Packaging", Doctoral Forum of Advanced Functional Materials and Cross-Strait Doctoral Forum 2012, December 14-16, 2012, Xiamen, China.

B98.  J. G. Duh, “Exploration of Thin Film Metallic Glass for Next Generation Application”, MRS-T 2012 Annual Meeting, November 23-25, 2012, NFU, Yunlin, Taiwan. (invited talk)