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研討會論文

  • B97.  J. G. Duh, "Development of High-voltage Cathode Materials and High-rate Anode Materials in Li-ion Batteries", November 8, 2012, Nanjing University, Nanjing, China.

  • B96.  J. G. Duh, "A Route to Multi-functional Coating", International Symposium on Materials for Enabling Nanodevices, August 27-29, 2012, UCLA, California, USA.

  • B95.  Y. S. Lin, Y. R. Jhan, J. G. Duh, "Development of High-stability Spinel Li4Ti5O12 Anode Material for High-rate Lithium-ion Batteries", August 13-16, 2012, Xiamen, China.

  • B94.  P. S. Chen, H. W. Chen, J. G. Duh, J. W. Lee and J. S. C. Jang, "Mechanical and Thermal Behaviors of Nitrogen & Ta Doped Zr-based TFMGs-an alternative class of thin film metallic glass", Taiwan-Korea Workshop on Metallic Glasses, June 4th-5th, 2012 @ NTUST, Taipei, Taiwan.

  • B93.  P. S. Chen, H. W. Chen, J. G. Duh, J. W. Lee and J. S. C. Jang, "Nitrogen Doped Metallic Glass and Intensify Mechanism", E-MRS 2012 Spring Meeting, May 14-18, 2012, Strasbourg, France.

  • B92.  C. K. Lan and J. G. Duh, "Transition Metal Doping Effect in Electrochemical Performance of Anode Material Li4Ti5O12", E-MRS 2012 Spring Meeting, May 14-18, 2012, Strasbourg, France.

  • B91.  H. M. Lin and J. G. Duh, "Evolution of Morphology and Microstructure on Ameliorated Electroplated Ni-Zn and Ni-Fe Films for Under Bump Metallization Application", E-MRS 2012 Spring Meeting, May 14-18, 2012, Strasbourg, France.

  • B90.  C. F. Tseng and J. G. Duh, "The Pd Influence on Growth Behavior of Quaternary (Cu, Ni, Pd)6Sn5 Compound in Sn-3.0Ag-0.5Cu/Au/Pd/Ni-P Solder Joint .during Liquid State Reaction", E-MRS 2012 Spring Meeting, May 14-18, 2012, Strasbourg, France.

  • B89.  Y. S. Lin and J. G. Duh, "Self-assembled Synthesis of Nanoflower-like Lithium Titanate Anodes for High-Rate Secondary Lithium-ion Batteries", E-MRS 2012 Spring Meeting, May 14-18, 2012, Strasbourg, France.

  • B88.  H. C. Chuang and J. G. Duh, "Effects of Minor Pd Doping on Microstructural Evolution and Interfacial Reactions in Sn-3.0Ag-0.5Cu-xPd/Cu during Isothermal Aging", TMS 2012 141th Annual Meeting & Exhibition, March 11-15, 2012, Orlando, FL, USA.

  • B87.  C. Y. Ho and J. G. Duh, "Wetting Behavior and Interfacial Reaction between New Electrolytic Ni-Pd Surface Finish/Sn-3.0Ag-0.5Cu Solder Joints", TMS 2012 141th Annual Meeting & Exhibition, March 11-15, 2012, Orlando, FL, USA.

  • B86.  J. G. Duh, "Development of high-voltage cathode and high-stability anode material in Li-battery", 14th International Workshop of Advanced Plasma Processing and Diagnostics, January 7-8, 2012, Kyushu, Japan. (invited talk)

  • B85.  P. S. Chen, H. W. Chen, J. G. Duh, J. W. Lee and J. S. C. Jang, "Characterization of Mechanical Properties and Adhesion of Ta-Zr-Cu-Al-Ag Thin Film Metallic Glasses", TACT 2011 International Conference, November 20-23, Kenting, Taiwan.

  • B84.  H. M. Lin and J. G. Duh, "Evolution of reliability on electroplated and sputtered Ni-Zn films for under bump metallization with Sn-3.0Ag-0.5Cu solder attached during liquid reactions", TACT 2011 International Conference, November 20-23, Kenting, Taiwan.

  • B83.  Y. C. Chan, H. W. Chen, R. H. Wei, J. G. Duh and J. W. Lee, "Composition gradient in thick TiSiCN nanocomposites with plasma enhanced magnetron sputtering for mechanical strengthening", TACT 2011 International Conference, November 20-23, Kenting, Taiwan.

  • B82.  J. G. Duh, Y. C. Chan and H. W. Chen, "Quest for Multi-functional Coatings", TACT 2011 International Conference, November 20-23, Kenting, Taiwan. (plenary talk)

  • B81.  J. G. Duh, "The Development and Challenge on High Working Voltage and Security of The Next Generation Lithium-ion Secondary Battery Electrode Materials", The Development Conference of New Material Trend & Fifth Session New Material Development Symposium of Cross Strait, Nanjing University of Aeronautics & Astronautics, November 11-13, Nanjing, China.

  • B80.  J.G. Duh, Y.C. Chan and H.W. Chen, "Quest for Multifunctional Coatings", Nanjing University of Aeronautics & Astronautics, November 10, Nanjing, China.

  • B79.  J.G. Duh, Y.C. Chan and H.W. Chen, "Recent Development in Multi-layer and Nanocomposite Coatings", 6th Cross Strait Symposium on Engineering Materials, November 8-15, Nanjing, China.

  • B78.  C.F. Tseng, J.G. Duh and S.Y. Tsai, "Phase Characterization and Elemental Redistribution in Solder Joints for Microelectronics Packaging by Utilizing FE-SEM and FE-EPMA", Chinese Electron Microscopy Society, October 23-29, 2011, Chengdu, China.

  • B77.  J.G. Duh, "Development of LiNi0.5Mn1.5O4 Cathode and Li4Ti5O12, Sn/C Anode Material for Lithium-ion Battery", The Energy and Nano-technology between Hsinchu and Beijing Tsing Hua Universities, Oct. 9-15, 2011, Beijing, China.

  • B76.  C.C. Hsieh, C.Y. Lin and J.G. Duh, "Improvement of the Elevated Temperature Cycling of LiNi0.5Mn1.5O4 through Carbon Coated Technique”, IUMRS-ICA 2011, September 19-22, 2011, TWTC Nangang, Taiwan.

  • B75.  Y.C. Jin, C.Y. Lin and J.G. Duh, "Crystallographic structures and cycling performance of LiNi0.5Mn1.5O4 Cathode Materials for Lithium-ion Battery", IUMRS-ICA 2011, September 19-22, 2011, TWTC Nangang, Taiwan.

  • B74.  Y.R. Jhan and J.G. Duh, "High Structure Stability of Ruthenium Doped Li4Ti5O12 and its Electrochemical Characteristic as Discharged to 0.001V", IUMRS-ICA 2011, September 19-22, 2011, TWTC Nangang, Taiwan. (invited talk)

  • B73.  C.Y. Lin, C.K. Lan and J.G. Duh, "Improved Capacity and Rate Capability of Ru-doped and Carbon-coated Li4Ti5O12 Anode Material", IUMRS-ICA 2011, September 19-22, 2011, TWTC Nangang, Taiwan.

  • B72.  Y.S. Lin and J.G. Duh, "Facile Synthesis of Mesoporous Lithium Titanate Spheres for High Rate Lithium-ion Batteries”, IUMRS-ICA 2011, September 19-22, 2011, TWTC Nangang, Taiwan.

  • B71.  H.M. Lin and J.G. Duh, "Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder and a Novel UBM Ni-xZn Films in Liquid State”, 12th ICEPT-HDP 2011, Aug. 8-11, 2011, Shanghai, China.

  • B70.  H.W. Chen, Y.C. Chan, J.G. Duh and J.W. Lee, "Tribological Behaviors of CrAlSixN Coatings Derived from RF Magnetron Sputtering", The 11th International Symposium on Sputtering & Plasma Processes, July 6-8, 2011, Kyoto, Japan.

  • B69.  Y.C. Chan, H.W. Chen, P.S. Chao, J.G. Duh and J.W. Lee, "Microstructure Control in TiAlN/SiNx Multilayers with Appropriate Thickness Ratios for Improvement of Hardness and Anti-corrosion Characteristics", The 11th International Symposium on Sputtering & Plasma Processes, July 6-8, Kyoto, Japan.

  • B68.  Y.M. Kuo, S.D. Li and J.G. Duh, "Magnetic Multilayered FeHfN/SiNx films in Power Inductors", E-MRS 2011 Spring & Bilateral Meeting, May 9-13, 2011, Nice, France.

  • B67.  Y.C. Jin, C.Y. Lin and J.G. Duh, "The Influence of Different Crystallographic Structure on the Cycling Performance of LiNi0.5Mn1.5O4 Cathode for Lithium-ion Battery", E-MRS 2011 Spring & Bilateral Meeting, May 9-13, 2011, Nice, France.

  • B66.  Y.S. Lin and J.G. Duh, "Facile Synthesis of Mesoporous Lithium Titanate Spheres for High Rate Lithium-ion Batteries", E-MRS 2011 Spring & Bilateral Meeting, May 9-13, 2011, Nice, France.

  • B65.  H.M. Lin and J.G. Duh, "Interfacial Reaction between Sn-3.0Ag-0.5Cu Liquid Solder and Ni-xZn Novel UBM Layers", International Conference on Metallurgical Coating and Thin Films, May 2-6, 2011, San Diego, CA, USA.

  • B64.  H.W. Chen, Y.C. Chan, J.W. Lee and J.G. Duh, "Oxidation Resistance of Nanocomposite CrAlSiN under Long-time Heat Treatment", International Conference on Metallurgical Coating and Thin Films, May 2-6, 2011, San Diego, CA, USA.

  • B63.  Y.C. Chan, H.W. Chen, R.H. Wei, J.G. Duh and J.W. Lee, "Microstructure, Scratch and Wear Behavior in Thick TiSiCN and TiAlVSiCN Nanocomposites", .International Conference on Metallurgical Coating and Thin Films, May 2-6, 2011, San Diego, CA, USA.

  • B62.  G. Hirata, S. Payán, Y.C. Chan, P.Y. Chen. J.G. Duh and J. McKittrick,"Structure and Mechanical Properties of Bioinspired Inorganic/Polymer Multi-Layer Composites", TMS 2011 140th Annual Meeting & Exhibition, February 27- March 3, 2011, San Diego, CA, USA.

  • B61.  S.W. Huang, Y. T. Lai and J.G. Duh, "High Permeability Co-Hf-Ta Thin Films", TMS 2011 140th Annual Meeting & Exhibition, February 27- March 3, 2011, San Diego, CA, USA.

  • B60.  I.T. Wang, J.G. Duh, C.Y. Cheng and J. Wang, "Interfacial Reaction and Elemental Redistribution in Sn3.0Ag0.5Cu-xPd/ENIG Solder Joints after Aging", TMS 2011 140th Annual Meeting & Exhibition, February 27- March 3, 2011, San Diego, CA, USA.

  • B59.  C.F. Tseng, T.K. Lee, G. Ramakrishna, K.C. Liu and J.G. Duh, "Probing Interf.acial Reactions in Sn-3.0Ag-0.5Cu Solder Joint Attached to ENIG and ENEPIG Surface Finishes", TMS 2011 140th Annual Meeting & Exhibition, February 27- March 3, 2011, San Diego, CA, USA.

  • B58.  K.J. Wang, C.Y. Yu and J.G. Duh, "Effect of the Cu Thickness in Ti/Ni(V)/Cu UBM on Interfacial Reaction and Mechanical Test of Sn3.0Ag0.5Cu Solder Joint", TMS 2011 140th Annual Meeting & Exhibition, February 27- March 3, 2011, San Diego, CA, USA. (invited talk)

  • B57.  C.Y. Yu, J.G. Duh, T.K. Lee, M. Tsai and K.C. Liu, "Correlation between Elemental Distribution and Impact Resistance for Sn-3.0Ag-0.5Cu Solder Joints with BGA Component and PCB Assembly", TMS 2011 140th Annual Meeting & Exhibition, February 27- March 3, 2011, San Diego, CA, USA.

  • B56.  C.Y. Yu and J.G. Duh, "Phase Evolution and Growth at the Interface of Sn/Cu-xZn under Liquid and Solid Reaction", TMS 2011 140th Annual Meeting & Exhibition, February 27- March 3, 2011, San Diego, CA, USA. (invited talk)

  • B55.  Y.M. Kuo and J.G. Duh, "Application of Nanocrystalline Fe-Hf-N Soft magnetic Films to Power Inductors", International Conference of Asian Union of Magnetics Societies 2010, December 5-8, 2010, Jeju island, Korea.

  • B54.  Y. Z. Tsai, Y. C. Chan, J. G. Duh, "Growth Orientation and Anti-wear Behavior of CrAlSiN/W2N Multilayered Protective Coatings", 11th IUMRS International Conference in Asia, September 25-28, 2010, Qingdao, China. (invited talk)

  • B53. F. C. Tai, J. G. Duh, "Low Alkaline Solution to Deposit Electroless Ni-Zn-P Film on Al Pad", 11th ICEPT-HDP 2010, Aug. 16-19, 2010, Xi’an, China. 

  • B52. C. F. Tseng, J. G. Duh and S. Y. Tsai, "Solid State Reaction of Sn3.0Ag0.5Cu Solder with Cu(Mn) Under Bump Metallization", 11th ICEPT-HDP 2010, Aug. 16-19, 2010, Xi’an, China.

  • B51.  Z.S. Wang, Y.T. Lai and J.G. Duh, "Thickness Dependence of the Magnetic Properties on FeHfN Thin Film by DC Sputtering", 2nd International Symposium on Advanced Magnetic Materials and Applications 2010, July 12-16, 2010, Sendai, Japan.

  • B50.  Y.M. Kuo and J.G. Duh, "Effect of Nitrogen Contents on the High-frequency Characteristics and Magnetic Properties of FeHfN Films", 2nd International Symposium on Advanced Magnetic Materials and Applications 2010, July 12-16, 2010, Sendai, Japan.

  • B49.  Y. C. Chan, J. G. Duh, "Texture, Microstructure and Tribological Behavior in TiAlN/SiNx Multilayers", 217th Meeting of The Electrochemical Society, July 11-14, 2010, Harbin, China.

  • B48.  C.Y. Lin, J.G. Duh, J.M. Chen and C.H. Hsu, "Development of Porous Microstructure of LiNi0.5Mn1.5O4 Cathode Material for Novel Lithium-Ion Battery to Improve Extended Cycling and Rate Ability of HEV", 15th International Meeting on Lithium Batteries, June 27-July 2, 2010, Montreal, Canada.

  • B47.  Y.S. Lin and J.G. Duh, "Shell-by-Shell Synthesis of Carbon-Coated SnO2 Hollow Nanospheres and Their Applications in Lithium-Ion Battery", 217th ECS Meeting, April 25-30, 2010, Vancouver, Canada.

  • B46.  C.Y. Lin and J.G. Duh, "Improved cyclic performance of LiNi0.5Mn1.5O4 cathode material by particle size reduction", 217th ECS Meeting, April 25-30, 2010, Vancouver, Canada.

  • B45.  Y.R. Jhan and J.G. Duh, ''Synthesis of Matrix Structure of Sn/C-C (NG-MWCNTs) Composite Anode Materials for Lithium Ion Battery by Carbothermal Reduction'', 217th ECS Meeting, April 25-30, 2010, Vancouver, Canada. 

  • B44.  Y.C. Chan, J.G. Duh, "Effects of Microstructures on Corrosion Properties in TiAlN/SiNx Multilayers", 217th Meeting of The Electrochemical Society, April 25-30, 2010, Vancouver, Canada

  • B43.  H.M. Lin, J.G. Duh, R. Wei, C. Rincon, J.W. Lee, "The effect of microstructure and composition on mechanical properties in thick-layered nanocomposite Ti-Si-C-N", International Conference on Metallurgical Coating and Thin Films, April 26-30, 2010, San Diego, CA, USA.

  • B42.  H.W. Chen, Y.C. Chan, J.W. Lee, J.G. Duh, "Oxidation Behavior of Si-doped Nanocomposite CrAlSiN Coatings", International Conference on Metallurgical Coating and Thin Films, April 26-30, 2010, San Diego, CA, USA.

  • B41.  Y. M. Kuo, S. D. Li, J. G. Duh and S. Y. Tsai, "High frequency characteristics and electrical properties of multilayer FeCoHfO/AlOx films", Electromagnetics Research Symposium, March 22-26, 2010, Xi'an, China. (98-EC-17-A-08-S1-003 )

  • B40.  F. C. Tai, J. G. Duh, "Interfacial Toughness Evaluation of SAC305 Solder Bump with Pendulum Impact Test", IMPACT 2009, Oct. 21-23, 2009, Taipei, Taiwan ( NSC 97-2221-E-007-021-MY3 )

  • B39.  K. J. Wang, J. G. Duh and S. Y. Tsai, "Morphological and Microstructural Evolution of Sn-patch in SnAgCu Solder with Ni(V)/Cu Under Bump Metallization", 2009 International Conference on Electronic Packaging Technology & High Density Packaging, Aug.10-13, 2009, Beijing, China. (NSC 97-2221-E-007- 021-MY3 )

  • B38.  C. N. Peng and J. G. Duh, "Deformation Characteristics of Sn-3Ag-0.5Cu/Cu/Ni-xCu/Ti Joints after MechanicalTest", 2009 International Conference on Electronic Packaging Technology & High  Density Packaging, Aug.10-13, 2009, Beijing, China. ( NSC 97-2221-E-007-021-MY3 )

  • B37.  S. D. Li, D. W. Wang, P. Y. Li and J. G. Duh, "Enhancement of High-frequency Permeability of FeCoHf Films by Surface Oxidation", 2008 2nd IEEE International Nanoelectronics Conference, March 24-27, 2008, Shanghai, China.

  • B36.  C. Y. Tan and J. G. Duh, "Influence of NiTi Shape Memory Alloy as Under Bump Metallization on Thermal Mechanical Behavior of Solder Joints", 58th Electronic Components and Technology Conference, May 27-30, 2008, Orlando. ( NSC 97-2221-E-007-021-MY3 )

  • B35.  P. C. Huang and J. G. Duh, "Effects of Different Surfactant Additions and Treatments on The Characteristics of Tin  Nanosolder by Chemical Reduction Method", 58th Electronic Components and Technology Conference, May 27-30, 2008, Orlando. ( NSC 97-2221-E-007-021-MY3 )

  • B34.  K. J. Wang and J. G. Duh, "Interfacial Reaction and Failure Mechanism for SnAgCu solder Bump with Ni(V)/Cu Under Bump Metallization During Aging", 2008 International Conference on Electronic Packaging Technology & High Density Packaging, July 28-31, 2008, Shanghai, China. ( NSC 97-2221-E-007-021-MY3 )

  • B33.  C. N. Peng and J. G. Duh, "Mechanical Test After Temperature Cycling on Lead-free Sn-3Ag-0.5Cu Solder Joint", 2008 International Conference on Electronic Packaging Technology & High Density Packaging, July 28-31, 2008, Shanghai, China. ( NSC 97-2221-E-007-021-MY3 )

  • B32.  J. G. Duh and C. N. Peng, "Employment of Oriental Philosophy in the Establishment of Framework for Probing Nanoscale Science and Technology", Hume-Rothery Symposium-Nanoscale Phase, Supplemental Proceeding: Volume I: Materials Processing and Properties, TMS (The Minerals, Metals and Materials Society), 2008. USA. (NSC 97-2221-E-007-021-MY3 )

  • B31.  L. Y. Hsiao, G. J. Chiou, J. G. Duh and S. Y. Tsai," Synthesis and Application of Novel Lead-free Solders Developed from Sn-based Nanoparticles", 7th International Conference on Electronics Packaging Technology, Aug. 26-30, 2006, Shanghai, China.

  • B30.  G. Y. Jang, J. G. Duh, S. Y. Tsai and C. R. Lee, "Role of Cu Contents in the Isothermal Metallurgical Reaction for the Flip Chip Sn-3.0Ag- (0.5 or 1.5)Cu Joints with Cu/Electroless Ni-P/Immersion Au Bonding Pad during Aging", Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, June27-30, 2006, Shanghai, China.

  • B29.  S. Y. Tsai, C. R. Lee, G. J. Chiou and J. G. Duh, "Elemental Redistribution and Diffusion Path Configuration near the Edge of Sn-95Pb Solder Bump/Ni-Cu UBM Joints after Aging in the Flip-Chip Technology", 7th IEEE CPMT Conference on High Density Microsystem Design Packaging and Failure Analysis, June 27-30, 2005, Shanghai, China. (NSC 93-2216-E007-014)

  • B28.  L. Y. Hsiao, J. G. Duh, "Intermetallic Compound Formation and Diffusion Path Evolution in the Flip Chip Sn-37Pb Solder Bump after aging", 7th IEEE CPMT .Conference on High Density Microsystem Design Packaging and Failure Analysis, June 27-30, 2005, Shanghai, China. (NSC 93-2216-E007-014)

  • B27.  J. W. Lee and J. G. Duh, 2004, "Mechanisms and Diffusional Kinetics of the Hard Chromizing Process on Carbon Steels", in "EPD Congress 2004", edited by Mark Schlesinger (TMS, ISBN#0-87339-570-0), pp.117-125 (NSC 92-2216-236-001) 

  • B26.  J. W. Lee, P. T. Chen, H. K. Chen, C. Z. Li and J. G. Duh, "Electrochemical atomic force microscopic studies on the localized corrosion of sputtered chromium nitride thin film in sodium chloride aqueous solution", in "Multiphase Phenomena and CFD Modeling and Simulation in Materials Processes", edited by L. Nastac and B. Li (TMS, ISBN#0-87339-565-4, 2004), pp. 169-178 (NSC 92-2216-236-001)

  • B25.  J. W. Lee and J. G. Duh, "Oxidation Behaviors of Fe-Mn-Al Alloys with Electroless Nickel and Aluminizing Coatings", Surface Engineering in Materials Science II, edited by S. Seal, N.B. Dahotre, J. Moore, A. Agarwal and S. Suryanarayana (TMS, ISBN# 0-87339-537-9, 2003), pp.175-182.   

  • B24.  J. W. Lee, J. H. Yeh and J. G. Duh, "Interfacial Reactions and Microstructural Evolution in Sn-37Pb/Electroless Ni/Cu/Al2O3 Joint during Annealing", Proceeding of 2003 IBSC conference, Feb. 17-21, 2003, San Diego,California, USA. (NSC-89- 2216-E-007-041) 

  • B23.  J. W. Lee and J. G. Duh, "Mechanical Properties And Microstructural Evaluation Of Chromium Containing Hard Coatings on Fe-Mn-Al Alloy", Surface Engineering: Science and Technology II, edited by A. Kumar, Y.W. Chung, J.J. Moore, G.L. Doll, K. Yatsui and D.S. Misra (TMS, ISBN# 0-87339-521-2, 2002), pp.283-292. 

  • B22.  J. W. Lee and J. G. Duh, "Mechanical Properties and Microstructural Evaluation of Chromium Containing Hard Coatings on Fe-Mn-Al Alloy", Surface Engineering: Science & Technology of Interfaces II, 2002, pp.283-292, edited by A. Kumar, Y.W. Chung, J.J. Moore, G.L. Doll, K. Yasui and D.S. Misra, TMS (The Minerals, Metals & Materials Society)

  • B21.  F. B. Wu, Y. Y. Tsai and J. G. Duh, "Comparison in Characteristics of Electroless Deposited and Magnetron Sputtered Ni-P-W Coatings", Surface Engineering: Science & Technology of Interfaces II, 2002, pp.315-323, edited by A. Kumar, Y.W. Chung, .J.J. Moore, G.L. Doll, K. Yasui and D.S. Misra, TMS (The Minerals, Metals &Materials Society) 

  • B20.  J. G. Duh and B. L.Young, "Metallurgical Reaction between Electroless Ni Metallized Al2O3 Substrate and Unlead 42Sn-58Bi Solders during Annealing", 2001 ICEP, International Conference on Electronics Packaging, pp.88-91, April 18-20, 2001, Tokyo Ryutsu Center, Tokyo, Japan. 

  • B19.  J. H. Yeh, C. S.Huang and J. G.Duh "Metallurgical Reaction for Electroless Ni with Sn-37Pb Solder during Annealing", IMAPS Taiwan Technical Symposium 2001, pp.160-169, April 27, 2001, Hsinchu, Taiwan. 

  • B18.  B. L. Young, C. S. Huang and J. G. Duh "Wettability of Electroless-Nickel Metallization and Lead Free Solder", Taiwan Printed Circuit Association (TPCA) 2000 Forum Proceedings, pp. 514-524, Nov. 23-25, 2000, Taipei, Taiwan. 

  • B17.  T. Y. Lin, C. K. Chung, K. Y. Weng and J. G. Duh "Fabrication of Low stress a-SixC1-x:H Films for the Application of MEMS", Nano-Structured and Amorphous Materials Symposium, April 27-28, 2000, ChineseCulture University, Taipei, Taiwan. 

  • B16.  Y. G. Lee, C. S. Huang, J. G. Duh and B. S. Chiou, " Improved Method for the Thickness Measurements of Intermetallic Compound in the Sn-Ag-Zn Solder Joint", IMAPS TAIWAN Technical Symposium 2000, pp.22-26, April 26, 2000, Hsinchu, Taiwan. 

  • B15.  C. S. Huang, Y. G. Lee and J. G. Duh, " Kinetics in Sn-Ag- Zn/Cu and Sn-Ag-Zn/Pt-Ag Joints During Thermal Aging", 2000 IEMT/IMC Symposium, pp. 98-103, April 19-21, 2000,Sonic City-Omiya, Tokyo, Japan. 

  • B14.  J. G. Duh, " Developments and Characteristics of Electroless-Ni Interlayer Modified Nitride Coating", Workshop on the Technology and Application of Engineering Ceramics, March 10, 2000, National Cheng-Kung University, Tainan, Taiwan. 

  • B13.  Y. G. Lee and J. G.Duh, "Interfacial Morphology and Elemental Profile in Unleaded Solder/Metallized Substrate", ibid, pp. 501-506. 

  • B12.  Y. Y. Wei, J. G. Duh, Y. G. Lee and B. S. Chiou,"Solder Joint of Sn-Ag and Sn-Ag-Zn with Cu and Pt-Ag Metallization", 1998 Proceedings Pan Pacific Microelectronics Symposium, Feb. 10-13, 1998, Kona, Hawaii. 

  • B11.  J. G. Duh, "Characterization of the Materials for Functional Application", Workshop on Metal Ceramic Materials for Functional Applications and 3rd Workshop on Metal-Ceramic Composite Structures, pp.79-99, Austrian Research Centre Seibersdorf, Jun. 4-6, 1997, Vienna, Austria. 

  • B10.  J. G. Duh and C. M. Sun, "Thermal Stress Analysis in the J-Lead Solder Joint by Finite Element Method", 1997 Proceeding of Pan Pacific Microelectronics Symposium, Surface Mount Technology Association, Edina, Minnesota, U.S.A., pp.49-54, Jan.28-31, 1997, Maui, Hawaii. 

  • B9.  J. G. Duh, C. C. Young and Y. G. Lee,"Microstructure Evaluation of the Unleaded Cu-Sn-Ni Solder Joint in Microelectronic Package", edited by K. Bi, X. Zong, S. Liu and F. Liu, Proceedings of the Second International Symposium on Electronic Packaging Technology, The Commercial Press Shanghai Plant, pp.330-335, Dec. 9-12, 1996, Shanghai, China. 

  • B8.  C. T. Huang and J. G. Duh, " Deposition of  (Ti,Al)N Films onto Tool Steel by Reactive R.F. Magnetron Sputtering ", edited by D.M. Mattox, Society of Vacuum Coaters 37th Annual Technical Conference Proceedings, May 8-13, 1994, Boston, U.S.A. 

  • B7.  J. G. Duh and C. D. Young, "Microstructural Evaluation in Metallized Ceramic Substrate ", Scanning Microscopy 1994 Meeting, May 7-12, 1994, Downtown Hotel, Toronto, Canada. 

  • B6.  J. G. Duh, J. C. Doong and C. T. Huang, "Electroless Ni Interlayer Modified TiN Coating by RF Sputtering", Ceramic Coating, edited by K. Kokini, 1993, ASME Winter Annual Meeting, Nov. 28 - Dec. 3, New Orleans, U.S.A. 

  • B5.  J. G. Duh, J. C. Doong and C. T. Huang, "Mechanical Testing in Electroless Ni Modified TiN Coating", Thin Films: Stresses and Mechanical Properties IV, Vol. 308, MRS Symposium Proceeding Series, 1993, Pittsburgh, PA (1993). 

  • B4.  J. G. Duh and Y. I. Chen, "Interlayer Modified TiN Coating on Carbon Steels", Proceedings of the International Ceramic Conference Australia 1992, pp. 798-803, 1992, Melburne, Australia. 

  • B3.  J. G. Duh and K. C. Liu, "Microstructural Evolution in Sn/Pb Solder and Pd/Ag Thick Film Conductor Metallization", 41st Electronic Components and Technology Conference, pp. 653-657, 1991, Atlanta, U.S.A.

  • B2.  S. K. Chen, J. G. Duh, H. C. Ku and L. H. Lin, "Magnetic Properties and Microstructure of Melt Spun Alloys Nd2+xFel4B (x=0, 0.15 and 0.30)", 1990 Annual Conference of the Chinese Society for Materials Science, pp. 548-550, 1990, Hsinchu, Taiwan.

  • B1.  K. C. Liu, J. J. Li and J. G. Duh, "SEM and EPMA Evaluation of Temperature Cycling Effects on Metallization Between Sn/Pb Solder and Pd/Ag Thick Film Conductor", 11th R.O.C. Symposium on Electron Microscopy, pp. 80-81, 1990, Hsinchu, Taiwan.

Since 1990

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