C1. J.G. Duh and A.A. Solomon, " Pressure Sintering of Pure Nickel Powders", 81th American Ceramic Society Annual Meeting, May, 1979, Cincinnati, Ohio, U.S.A.

C2. J.G. Duh and M.A. Dayananda, " Interdiffusion in the Fe-Ni-Cr System at 1100℃", AIME Fall Meeting, Oct., 1982, St. Louis,.

C3. J.G. Duh and M.A. Dayananda, " Two-phase Diffusion with (BCC) and (FCC) Fe-Ni-Cr Alloys at 1100℃", TMS-AIME Annual Meeting, Mar., 1983, Atlanta, U.S.A.

C4. J.G. Duh, " The SEM-EDAX Analysis of Multicomponent Diffusion Couples", 3rd Asia-Pacific Conference and Workshop on Electron Microscopy, Aug., 1984, Singapore.

C5. J.G. Duh, W.Y. Hsu and B.S. Chiou " A Study on Silica and Glass Doped Yttria Stabilized Zirconia", 87th American Ceramic Society Annual Meeting, May,  1985, Cincinnati, Ohio, U.S.A.

C6. J.G. Duh, C.J. Wang, C.M. Wan and B.S. Chiou "Morphological Development of High Temperature Oxide Scales of Fe-Mn-Al Base Alloys", 115th TMS Annual Meeting, Mar., 1986, New Orleans, U.S.A.

C7. J.G. Duh, C.J. Lin, J.W. Lee and C.M. Wan, " Influences of Alloying Elements on the High Temperature Oxidation of Fe-AI-Mn-C Alloys", 115th TMS Annual Meeting, Mar., 1986, New Orleans, U.S.A.

C8. J.G. Duh, W.Y. Hsu and B.S. Chiou " Study on Rare-Earth-Oxide Doped Yittra Tetragonal Zirconia", World Congress on High Tech Ceramics, Jun., 1986, VI CIMTEC, Milan, Italy.

C9. B.S. Chiou, W.Y. Hsu and J.G. Duh, "Sintering Behaviour of Ceria Containing ZrO2 Ceramics Obtained from Coprecipitation Process", The 3rd International Conference on the Science and Technology of Zirconia, Sep., 1986, Tokyo, Japan.

C10. J.G. Duh and J.W. Lee, " The Redistribution of Alloying Elements in the Oxide Scales of Fe-Mn-Al-Cr Alloys", 116th TMS Annual Meeting and Joint TMS/AIME Exhibit, Feb. 23-26, 1987, Denver, Colorado, U.S.A.

C11. J.G. Duh and S.T. Dai, " Sinterability and Microstructure of CeO2 Doped ZrO2 Ceramics by Partial Substitution of Y2O3", 89th Annual Meeting, The American Ceramic Society, Apr., 1987, Pittsburgh, PA, U.S.A.

C12. J.G. Duh and W.S. Chien," Microstructure Characteristics of Ni/Ziconia Bonding", 41st Pacific Coast Regional Meeting, The American Ceramic Society, Oct. 23-26, 1988, San Francisco, CA, U.S.A.

C13. J.G. Duh and Y.S. Wu, " Surface Modification in Y-TZP and Ce-TZP", Fourth International Conference on the Science and Technology of Zirconia, ZrO2 IV, The American Ceramic Society, Nov. 1-3, 1989, Anaheim, CA, U.S.A.

C14. J.G. Duh and K.C. Liu, " Microstructure Evolution in Sn/Pb Solder and Pd/Ag Thick Film Conductor Metallization", 41st Electronic Component and Technology Conference, IEEE, May 13-15, 1991, Atlanta, Georgia, U.S.A.

C15. J.G. Duh and J.U. Wan, " Developments in Highly Toughened CeO2-Y2O3-ZrO2 Ceramics Systems", 44th Pacific Coast Regional Meeting, American Ceramic Society, Oct. 31 - Nov. 2, 1991, San Diego, CA, U.S.A.

C16. J.G. Duh and J.U. Wan, " Surface Modification of Y2O3-ZrO2 and CeO2-ZrO2 by Liquid Infiltration", 94th Annual Meeting and Exposition of the American Ceramic Society, Apr. 12-16, 1992, Minneapolis, MN, U.S.A.

C17. J.G. Duh and Y.I. Chen, " Interlayer Modified TiN Coating on Carbon Steels", Austceram 92, International Ceramic Conference, Aug. 16-21, 1992, Melburne, Australia.

C18. J.G. Duh, J.C. Doong and C.T. Huang, " Mechanical Testing in Electroless Ni Modified TiN Coating", Material Research Society 1993 Spring Meeting, Apr. 12-16, 1993, San Francisco, CA, U.S.A.

C19. J.G. Duh, J.C. Doong and C.T. Huang, " Electroless Ni Interlayer Modified TiN Coating by rf Sputtering", ASME 1993 Winter Annual Meeting, Nov. 28-Dec. 3, 1993, New Orleans, U.S.A.

C20. J.G. Duh and C.D. Young, " Microstructure Evaluation in Metallized Ceramic Substrate", Scanning Microscopy 1994 Meeting, May 7-12, 1994, Toronto, Canada.

C21. C.T. Huang and J.G. Duh, " Deposition of (Ti,Al)N Films onto Tool Steel by Reactive R.F. Magnetron Sputtering", Society of Vaccum Coaters 37th Annual Technical Conference, May 8-13, 1994, Boston, U.S.A.

C22. J.G. Duh and C.J. Lin, " Mechanical Characteristics of Colored Films on Stainless Steel by Current Pulse Method", International Conference on Metallurgical Coating and Thin Films, Apr. 24-28, 1995, San Diego, CA, U.S.A.

C23. J.G. Duh, C.C. Young and Y.G. Lee, "Microstructural Evaluation of the Unleaded Cu-Sn-Ni Solder Joint in Microelectronic Packaging", Second International Symposium on Electronic Packaging Technology, Dec. 9-12, 1996, Shanghai, China.

C24. J.G. Duh and C.M. Sun, " Thermal Stress Analysis in the J-Lead Solder Joint by Finite Element Method", 1997 Pan Pacific Microelectronics Symposium, Jan. 28-31, 1997, Maui, Hawaii, U.S.A.

C25. J.J. Li and J.G. Duh, " Critical Parameter Measurements in (Ti,Al)N Coated Steel", International Coference on Metallurgical Coatings and Thin Films, Apr. 21-25, 1997, San Diego, CA, U.S.A.

C26. J.G. Duh and T.F. Leu, " Development of Colored Films on Stainless Steel by Potential Pulse Method in Less Polluted Solution, ibid.

C27. J.G. Duh, "Characterization of the Materials for Functional Application”, Workshop on Metal Ceramic Materials for Functional Applications and 3rd Workshop on Metal-Ceramic Composite Structures, Austrain Rsearch Centre Seibersdorf, Jun. 4-6, 1997, Vienna, Austria.

C28. Y.Y. Wei, J.G. Duh, Y.G. Lee and B.S. Chiou, "Solder Joint of Sn-Ag- and Sn-Ag-Zn with Cu and Pt-Ag Metallization”, 1998 Proceedings Pan Pacific Microelectronics Symposium, Feb. 10-13, 1998, Kona, Hawaii, U.S.A.

C29. Y.G. Lee and J.G.Duh, "Interfacial Morphology and Elemental Profile in Unleaded Solder/Metallized Substrate”, 1998 Proceedings Pan Pacific Microelectronics Symposium, Feb. 10-13, 1998, Kona, Hawaii, U.S.A.

C30. J.G. Duh, " Materials Issue in Unleaded Solder Joints", First International Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing, Aug. 13-15, 1998, Shanghai, China. (invited)

C31. J.G. Duh, " Developments and Characteristics of Electroless-Ni Interlayer Modified Nitride Coating", Workshop on the Technology and Application of Engineering Ceramics, Mar. 10, 2000, National Cheng-Kung University, Taiwan.

C32. C.S. Huang, Y.G. Lee and J.G. Duh, " Kinetics in Sn-Ag- Zn/Cu and Sn-Ag-Zn/Pt-Ag Joints during Thermal Aging", 2000 IEMT/IMC Symposium, Apr. 19-21, 2000, Sonic City-Omiya, Tokyo, Japan.

C33. Y.G. Lee, C.S. Huang, J.G. Duh and B.S. Chiou, " Improved Method for the Thickness Measurements of Intermetallic Compound in the Sn- Ag-Zn Solder Joint", IMAPS TAIWAN Technical Symposium 2000, Apr. 26, 2000, Hsinchu, Taiwan.

C34. J.G. Duh and R.J. Tu, “Morphology Propertiesand Oxidation Behavior of Reactively Sputtered Cr-N Films”, International Conference on Metallurgical Coating and Thin Films, Apr. 10-14, 2000, San Diego, CA, U.S.A.

C35. F.B. Wu and J.G. Duh, "Evaluation of the Mechanical Properties and Tribological Behavior of the CrN Coating deposited on Mild Steel Modified with Electroless Ni Interlayer", International Conference on Metallurgical Coating and Thin Films, Apr. 10-14, 2000, San Diego, CA, U.S.A.

C36. J.G. Duh and C.C. Young, ”Microstructural Evolution in the Sn-Cu-Ni and Pb-Sn Solder Joints with Cu and Pt-Ag Metallized Al2O3 Substrates Substrates”, TMS 2001 International Metals & Materials Exhibition, Feb. 11-15, 2001, New Orleans, Louisiana, U.S.A.

C37. J.W. Lee and J.G. Duh, “Corrosion Resistance and Microstructural Evaluation of Chromized Coating Process in Dual Phase Fe-Mn-Al-C Alloy”, International Conference on Metallurgical Coating and Thin Films, Apr. 30-May 4, 2001, San Diego, CA, U.S.A.

C38. J.S. Chen, J.G. Duh and F.B. Wu, "Microhardness and Corrosion Behavior in CrN/Electroless Ni/Mild Steel Complex Coating", International Conference on Metallurgical Coating and Thin Films, Apr. 30-May 4, 2001, San Diego, CA, U.S.A.

C39. F.B. Wu, Y.I. Chen, P.J. Peng, Y.Y. Tsai and J.G. Duh, "Fabrication, Thermal Stabilityand Microhardness of Sputtered Ni-P-W Coating", International Conference on Metallurgical Coating and Thin Films, Apr. 30-May 4, 2001, San Diego, CA, U.S.A.

C40. F. B. Wu and J. G. Duh, "Scratch Behavior and In-Situ Acoustic Emission Analysis of Electroless Ni-P Modified Chromium Nitride Coating", International Conference on Metallurgical Coating and Thin Films, Apr.30-May 4, 2001, San Diego, CA, U.S.A.

C41. Y.Y. Tsai, F.B. Wu, J.G. Duh and S.Y. Tsai, "Thermal Stability and Mechanical Properties of Ni-W-P Electroless Deposits", International Conference on Metallurgical Coating and Thin Films, Apr. 30-May 4, 2001, San Diego, CA, U.S.A.

C42. C.S. Huang, B.L. Young and J.G. Duh, “The Phenomena of Electroless Ni-P Stripping and Dissolving in the Eutectic Sn-Bi Solder”, TMS 2002 International Metals & Materials Exhibition, Feb. 17-21, 2002, Seattle, Washington, U.S.A.

C43. F.B. Wu, Y.Y. Tsai and J.G. Duh, “Comparison in Characteristic of Electroless Deposited and Magnetron Sputtered Ni-P-W Coating”, TMS 2002 International Metals & Materials Exhibition, Feb. 17-21, 2002, Seattle, Washington, U.S.A.

C44. C.S. Huang and J.G. Duh, “Interfacial Reactions between Ni/Cu UBM and Eutectic Pb-Sn Solder in Flip Chip Technology”, TMS 2002 International Metals & Materials Exhibition, Feb. 17-21, 2002, Seattle, Washington, U.S.A.

C45. J. G. Duh and F. B. Wu, "Ir-base multi-element coating on tungsten carbide by RF magnetron sputtering process", International Conference on Metallurgical Coating and Thin Films, Apr. 22-26, 2002, San Diego, CA, U.S.A.

C46. J.W. Lee and J.G. Duh, “Mechanical Properties Evaluation of Cathodic Arc Plasma Deposited CrN Thin Film on Fe-Mn-Al-C Alloy”, 2002 International Conference on Metallurgical Coatings and Thin Films, Apr. 22-26, 2002, San Diego, CA, U.S.A.

C47. F. B. Wu, Y. Y. Tsai and J. G. Duh, "Mechanical Characterization of Ni-P-based ternary coating by RF magnetron sputtering", International Conference on Metallurgical Coating and Thin Films, Apr. 22-26 2002, San Diego, CA, U.S.A.

C48. Y.Y. Tsai, F.B. Wu, S.K. Tien and J.G. Duh, "Surface characteristics of electroless and sputtered Ni-P-W alloy coatings", International Conference on Metallurgical Coating and Thin Films, Apr.22-26, 2002, San Diego, CA, U.S.A.

C49  F.B. Wu and J.G. Duh, "Scratch Behavior and In-Situ Acoustic Emission Analysis of Electroless Ni-P Modified Chromium Nitride Coating", International Conference on Metallurgical Coating and Thin Films, Apr. 22-26, 2002, San Diego, CA, U.S.A.

C50. C.S. Huang, G.Y. Jang and J.G. Duh, “Interfacial Reactions and Compound Formation in the Edge of PbSn Flip Chip Solder Bumps on Ni/Cu Under Bump Metallization”, TMS 2003 International Metals & Materials Exhibition, Feb., 2003, San Diego, CA, U.S.A.

C51. B.L. Young, J.G. Duh and G.Y. Jang, “Compound Formation for Electroplated Ni and Electroless Ni in the Under Bump Metallurgy with Sn-58Bi Solder during Aging”, TMS 2003 International Metals & Materials Exhibition, Feb., 2003, San Diego, CA, U.S.A. (invited)

C52. C.S. Huang, Y.M. Chen and J.G. Duh, “Metallurgical Reaction between Ni/Cu UBM and Lead-Free Sn-Ag Flip Chip Solder Bump”, TMS 2003 International Metals & Materials Exhibition, Feb., 2003, San Diego, CA, U.S.A.

C53. F.B. Wu and J.G. Duh, "Surface Morphology and Roughness Evaluation of Ni-P-W Coatings", Surface Engineering: Science & Technology of Interfaces II, TMS (The Minerals, Metals & Materials Society), Mar. 2-6, 2003, San Diego, CA, U.S.A.

C54. W.Y. Chen, F.B. Wu and J.G. Duh, ”Thermal Stability of Sputtered Ni-P & Ni-P-Cr Coatings During Cycling Test & Annealing Treatment”, International Conference on Metallurgical Coatings and Thin Films, Apr. 28-May 2, 2003, San Diego, CA, U.S.A.

C55. F.B. Wu, W.Y. Chen, S.K. Tien and J.G. Duh, “Microstructure Evaluation and Strengthening Mechanism of Ni-P-W Alloy Coatings”,  International Conference on Metallurgical Coatings and Thin Films, Apr. 28-May 2, 2003, San Diego, CA, U.S.A.

C56. F.B. Wu, J.W. Lee and J.G. Duh, “Evaluation of microstructures and mechanical properties of chromized steels with different carbon contents”, International Conference on Metallurgical Coatings and Thin Films, Apr. 28-May 2, 2003, San Diego, CA, U.S.A.

C57. S.K. Tien, F.B. Wu and J.G. Duh, “Structure, Thermal Stabilityand Mechanical Properties of Electroless Ni-P-W Alloy Coatings During Cycle Test”, International Conference on Metallurgical Coatings and Thin Films, Apr. 28-May 2, 2003, San Diego, CA, U.S.A.

C58. S.T. Kao and J.G. Duh, “Effect of Cu Concentration on Morphology of Sn-Ag-Cu Solders by Mechanical Alloying”, TMS 2004 International Metals & Materials Exhibition, Mar. 14-18, 2004, Charlotte, North Carolina, U.S.A.

C59. G.Y. Jang, J.W. Lee and J.G. Duh, “The nanoindentation characteristics of Cu6Sn5, Cu3Sn and Ni3Sn4 intermetallic compound in the solder bump”, TMS 2004 International Metals & Materials Exhibition, Mar. 14-18, 2004, Charlotte, North Carolina, U.S.A.

C60. G.Y. Jang and J.G. Duh, “The Effect of Intermetallic Compound Morphology on Cu Diffusion in Sn-Ag and Sn-Pb Solder Bump on the Ni/Cu Under-Bump Metallization”, TMS 2004 International Metals & Materials Exhibition, Mar. 14-18, 2004, Charlotte, North Carolina, U.S.A. (invited)

C61. G.Y. Jang, C.S. Huang, L.Y. Hsiao, J.G. Duh and H. Takahashi, “Mechanism of Interfacial Reaction for SnPb Solder Bump with Ni/Cu UBM in Flip Chip Technology”, TMS 2004 International Metals & Materials Exhibition, Mar. 14-18, 2004, Charlotte, North Carolina, U.S.A. (invited)

C62. H.W. Chan, J.G. Duh and S.R. Sheen, “Surface Modification of Spinel Li1+xMn2O4 Cathode Material in Li-Ion Battery by Li2O-2B2O3”, TMS 2004 International Metals & Materials Exhibition, Mar. 14-18, 2004, Charlotte, North Carolina, U.S.A.

C63. J.W. Lee, P.T. Chen, H.K. Chen and J.G. Duh, “Electrochemical Atomic Force Microscopic Studies on the Localized Corrosion in Sputtered Chromium Nitride Thin Film”, TMS 2004 International Metals & Materials Exhibition, Mar. 14-18, 2004, Charlotte, North Carolina, U.S.A.

C64. J.W. Lee and J.G. Duh, “Mechanism and Diffusion Kinetics of the Hard Chromizing Process on Carbon Steels”, TMS 2004 International Metals & Materials Exhibition, Mar. 14-18, 2004, Charlotte, North Carolina, U.S.A.

C65. J.W. Lee and J.G. Duh, “Microstructure and Hot Corrosion Behaviors of Aluminized Austenitic Fe-Mn-Al and Inconel 718 Alloy ”, International Conference on Metallurgical Coating and Thin Films, Apr. 19-23, 2004, San Diego, CA, U.S.A.

C66. H.W. Chan and J.G. Duh, “Electrochemical Performance of LBO-coated Spinel Lithium Manganese Oxide As Cathode Material for Li-ion Battery”, International Conference on Metallurgical Coating and Thin Films, Apr. 19-23, 2004, San Diego, CA, U.S.A.

C67. W.Y. Chen, S.K. Tien, F.B. Wu and J.G. Duh, “Thermal Stability and Microstructure Characterization of Sputtered Ni-P and Ni-P-Cr Coatings”, International Conference on Metallurgical Coating and Thin Films, Apr. 19-23, 2004, San Diego, CA, U.S.A.

C68. J.H. Lin and J.G. Duh, “Microhardness of Sputtered Ternary Ni-P-W Coating with extra-high Phosphorous Content from Improved Deposition Rate-derived Electroplated NiP Targets”, International Conference on Metallurgical Coating and Thin Films, Apr. 19-23, 2004, San Diego, CA, U.S.A.

C69. F.B. Wu, S.K. Tien, K.T. Liu and J.G. Duh, “ Mechanical Properties of Functional Gradient Nitride Coating with Nickel Phosphorous Interlayer”, International Conference on Metallurgical Coatings and Thin Films, Apr. 9-23.2004, San Diego, CA, U.S.A.

C70. F.B. Wu and J.G. Duh, “Mechanical Properties of the Sputtered Nickel-Phosphorous-Based Hard Coatings under Thermal Annealing Process”, International Conference on Metallurgical Coatings and Thin Films, Apr. 9-23, 2004, San Diego, CA, U.S.A.

C71. J.W. Lee, J.G. Duh and Y.C. Chen, “Nano Mechanical Evaluation of Chromium Nitride Films by nanoindentation and Nanowear Techniques”, International Conference on Metallurgical Coating and Thin Films, Apr. 19-23, 2004, San Diego, CA, U.S.A.

C72. S.K. Tien, F.B. Wu and J.G. Duh, “Thermal Reliability of Electroless Ni-P-W Coating during The Aging Treatment”, International Conference on Metallurgical Coating and Thin Films, Apr. 19-23, 2004, San Diego, CA, U.S.A.

C73. Y.I. Chen, S.K. Tien and J.G. Duh, “The Influence of Thermal Treatment on The Microstructure and Hardness in Electroless Ni-P-W Deposit”, International Conference on Metallurgical Coating and Thin Films, Apr. 19-23, 2004, San Diego, CA, U.S.A.

C74. J.W. Lee, P.T. Chen, H.K. Chen and J.G. Duh, “The Effect of Electroless Nickel Interlayer on the Corrosion Behaviors of CrN Coated Alloy Evaluated by Electrochemical Atomic Force Microscope”, International Conference on Metallurgical Coating and Thin Films, Apr. 19-23, 2004, San Diego, CA, U.S.A.

C75. T. Fang, J. G. Duh, “LiCoO2 cathode material coated with nano-crystallized ZnO for Li-ion batteries”, International Conference on Metallurgical Coating and Thin Films, Apr. 19-23, 2004, San Diego, CA, U.S.A.

C76. L.Y. Hsiao and J.G. Duh, “Characterizing Metallurgical Reaction of SnPb Solder with Ni/Cu Under-bump Metallization by Electron Microscopy”, International Conference on Metallurgical Coating and Thin Films, Apr. 19-23, 2004, San Diego, CA, U.S.A.

C77. F.B. Wu, S.K. Tien, G.T. Liu and J.G. Duh, “Mechanical Properties of Functional Gradient Nitride Coating with Nickel Phosphorous Interlayer”, International Conference on Metallurgical Coating and Thin Films, Apr. 19-23, 2004, San Diego, CA, U.S.A.

C78. K.H. Chung, G.T. Liu, J.G. Duh and J.H. Wang, “Biocompatibility of a Titanium-aluminum Nitride Film Coating on a Dental Alloy”, International Conference on Metallurgical Coating and Thin Films, Apr. 19-23, 2004, San  Diego, CA, U.S.A.

C79. G.T. Liu, J.G. Duh, K.H. Chung and J.H. Wang, “Mechanical Characteristics and Corrosion Behavior of the (Ti,Al)N Coating on Dental Alloys”, International Conference on Metallurgical Coating and Thin Films, Apr. 19-23, 2004, San Diego, CA, U.S.A.

C80. P.Y. Liao and J.G. Duh, “Synthesis and Characterization of  LiNixCoyMn1-x-yO2 as a Cathode Material for Lithium Ion Batteries”, The 3rd China International Conference on High Performance Ceramics, May 9-12 2004, Shenzhen, P.R. China.

C81. H.W. Chan, J.G. Duh and S.R. Sheen, “Surface Treatment of the Lithium Boron Oxide Coated LiMn2O4 Cathode Material in Li-ion Battery”, The 3rd China International Conference on High Performance Ceramics, May 9-12 2004, Shenzhen, P.R. China.

C82. T. Fang, J.G. Duh and S.Y. Tsai, “The Microstructural Evolution of Mn3O4 Hausmannite During Autoxidation”, The 3rd China International Conference on High Performance Ceramics, May 9-12 2004, Shenzhen, P.R. China.

C83. T. Fang and J.G. Duh, “Synthesis of Well-crystallized Manganese Oxide from Precipitation: Effect of Introducing Carbonate Anions”, The 3rd China International Conference on High Performance Ceramics, May 9-12 2004, Shenzhen, P.R. China.

C84. J.H. Wang, T. Fang and J.G. Duh, “LiCoO2 Cathode Material Coated with Nano-crystallized ZnO by Sol-gel Method”, The 3rd China International Conference on High Performance Ceramics, May 9-12 2004, Shenzhen, P.R. China.

C85. P.Y. Liao, J.G. Duh and S.R. Sheen, "Effect of Mn Content on the Microstructure and Electrochemical Performance of LiNi0.75-xCo0.25MnxO2 Cathode Materials", 206th Meeting of The Electrochemical Society (ECS), Oct. 3-8, 2004, Honolulu, Hawaii, U.S.A.

C86. T. Fang, J.G. Duh and S. R. Sheen, “Improving the Electrochemical Performance of LiCoO2 Cathode by Nano-Crystalline ZnO Coating”, 206th Meeting of the Electrochemical Society (ECS), Oct. 3-8, 2004, Honolulu, Hawaii, U.S.A.

C87. L.Y. Hsiao and J.G. Duh, “Synthesis and Characterization of the Lead-Free Solders with Sn-3.5Ag-xCu (x = 0.2, 0.5, 1.0) Alloy Nanoparticles by Chemical Reduction Method”, 206th Meeting of the Electrochemical Society (ECS), Oct. 3-8, 2004, Honolulu, Hawaii, U.S.A.

C88. F.B. Wu, S.K. Tien, J.W Lee and J.G. Duh, “Comparison in Microstructure and Mechanical Properties of the Nano-composite CrWN and Nanolayered CrN/WN Coatings”, Asia CVD-III, Nov.12-14, 2004, Taipei, Taiwan.

C89. G.Y. Jang, J.G. Duh, H. Takahashi, S.W. Lu and J.C. Chen, “The Influence of Cu Content on Compound Formation Near Chip Side for the Flip Chip Sn-3.0Ag-(0.5 or 1.5)Cu Solder Bump During Aging”, TMS 2005 International Metals & Materials Exhibition, Feb. 13-17, 2005, San Francisco, CA, U.S.A.

C90. H.Y. Lee and J.G. Duh, “The Influence of Ni3Sn4 Nanoparticles and Ni Concentration on Morphology of Sn-Ag-Ni Solders by Mechanical Alloying”, TMS 2005 International Metals & Materials Exhibition, Feb. 13-17, 2005, San Francisco, CA, U.S.A.

C91. S.T. Kao, Y.C. Lin and J.G. Duh, “Controlling Intermetallic Compound Growth in SnAgCu/Ni-P Solder Joints by Nano-Sized Cu6Sn5 Addition”, TMS 2005 International Metals & Materials Exhibition, Feb. 13-17, 2005, San Francisco, CA, U.S.A.

C92. G.Y. Jang, J.G. Duh, H. Takahashi and D. Su, “Solid State Reaction in the Au-Cu Wire Connection with Al-Cu Pad During Aging”, TMS 2005 International Metals & Materials Exhibition, Feb. 13-17, 2005, San Francisco, CA, U.S.A.

C93. L.Y. Hsiao, S.T. Kao, H.Y. Lee and J.G. Duh, “Synthesis of Ni3Sn4 and Cu6Sn5 Nanoparticles in Deriving Lead-Free Composite Solders”, TMS 2005 International Metals & Materials Exhibition, Feb. 13-17, 2005, San Francisco, CA, U.S.A.

C94. H.K. Chen, S.H. Li and J.G. Duh, “Novel Characterizing Technique in Phase Distribution with Sample Preparation for Application in Solder Joint, Wire Bonding Chip and Li-Ion Battery Assembly”, TMS 2005 International Metals & Materials Exhibition, Feb. 13-17, 2005, San Francisco, CA, U.S.A.

C95. J.W. Lee, S.K. Tien, C.H. Lin and J.G. Duh, “The Effects of Substrate Bias, Substrate Temperature and Pulse Frequency to the Microstructures of CrN Coatings Deposited by Pulsed DC Magnetron Sputtering”, TMS 2005 International Metals & Materials Exhibition, Feb. 13-17, 2005, San Francisco, CA, U.S.A.

C96. F.B. Wu, J.W. Lee and J.G. Duh, “Microstructure and Mechanical Properties Evaluation of Chromium Nitride/Tungsten Nitride Superlattice Coatings”, TMS 2005 International Metals & Materials Exhibition, Feb. 13-17, 2005, San Francisco, CA, U.S.A.

C97. C.Y. Li, J.G. Duh and S.Y. Tsai, “Phase Equilibria in the Sn-Rich Corner of the Sn-Cu-Ni Ternary Alloy System”, TMS 2005 International Metals & Materials Exhibition, Feb. 13-17, 2005, San Francisco, CA, U.S.A.

C98. Y.C. Lin and J.G. Duh, “Wettability of Electroplating Ni-P in Under Bump Metallurgy with Sn-Ag-Cu Solder”, TMS 2005 International Metals & Materials Exhibition, Feb. 13-17, 2005, San Francisco, CA, U.S.A.

C99. L.Y. Hsiao, S.T. Kao and J.G. Duh, “Characterizing Metallurgical Reaction of Sn3.0Ag0.5Cu Composite Solder by Mechanical Alloying with Electroless Ni-P/Cu Under-Bump Metallization after Various Reflow Cycles”, TMS 2005 International Metals & Materials Exhibition, Feb. 13-17, 2005, San Francisco, CA, U.S.A.

C100. F.B. Wu, C.Y. Lee and J.G. Duh, “Microstructure and Magnetic Properties of FeCoNiPAl Multicomponent Coatings”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2005, San Diego, CA, U.S.A.

C101. J.G. Duh, K.L. Lin and S.K. Tien, “The Effect of Heat Treatment on the Mechanical Properties and Microstructure of CrN/AlN Multilayer Coatings”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2005, San Diego, CA, U.S.A.

C102. S.K. Tien, J.G. Duh and C.W. Lee, “Oxidation Behavior of Polycrystalline CrN/AlN Multilayer Coatings Fabricated by Pulsed Dc Magnetron Sputtering”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2005, San Diego, CA, U.S.A.

C103. Y.C. Lin and J.G. Duh, “Effect of Sodium Lauryl Sulfate on Electrodeposition of Ni-P layer as a Under Bump Metallization”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2005, San Diego, CA, U.S.A.

C104. Y.Z. Tsai and J.G. Duh, “Thermal Stability and Microstructure Characterization of CrN/WN Multilayer Coatings Fabricated by Ion-Beam Assisted Deposition”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2005, San Diego, CA, U.S.A.

C105. P.Y. Liao, J.G. Duh and S.R. Sheen, “Characterization of Surface Characteristics and Interfacial Structure in Lithium Nickel Oxides”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2005, San Diego, CA, U.S.A.

C106. H.K. Chen, S.H. Lee and J.G. Duh, “The Influence of Composition and Annealing Temperature on Magnetic Domain Structure of Fe-Co-Ni-based Multi-component Thin Film”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2005, San Diego, CA, U.S.A.

C107. F.B. Wu, S.K. Tien and J.G. Duh, “Manufacture, Microstructure and Mechanical Properties of CrWN and CrN/WN Nanolayered Coatings”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2005, San Diego, CA, U.S.A.

C108. F.B. Wu and J.G. Duh, “Phase Transformation and Related Hardness of Ternary Ni-P-Al Alloy Coatings Under Heat Treatments”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2005, San Diego, CA, U.S.A.

C109. L.Y. Hsiao and J.G. Duh, “Electron Microscopy Evaluation of Interfacial Reaction in Lead-Free Solder and Sn-Pb Solder with Ni/Cu Under-Bump Metallization”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2005, San Diego, CA, U.S.A.

C110. K.T. Liu, J.G. Duh and K.H. Chung, “Coating of Ni-based Dental Alloys with TiN and TiAlN and Its Effect on Attachment and Spreading of Cells”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2005, San Diego, CA, U.S.A.

C111. K.T. Liu, J.G. Duh, K.H. Chung and J.H. Wang, “Electrochemical Impedance Spectroscopy Studies of TiAlN and TiN Films on Ni-Based Alloys Under Biological Media”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2005, San Diego, CA, U.S.A.

C112. T. Fang, J.G. Duh and S.R. Sheen, “Influence of calcination temperature on the electrochemical performance of ZnO-coated LiCoO2 cathode”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2005, San Diego, CA, U.S.A.

C113. H.W. Chan, J.G. Duh, S.R. Sheen, S.Y. Tsai and C.R. Lee, “New Surface Modification Material for LiMn2O4 Cathode Material in Li-ion Battery”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2005, San Diego, CA, U.S.A.

C114. C.H. Lin and J.G. Duh, “Processing of Chromium Tungsten Nitride Hard Coatings for Glass Molding”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2005, San Diego, CA, U.S.A.

C115. S.Y. Tsai, C.R. Lee, G.J. Chiou and J.G. Duh, "Elemental Redistribution and Diffusion Path Configuration near the Edge of Sn-95Pb Solder Bump/Ni-Cu UBM Joints after Aging in the Flip-Chip Technology", the Seventh IEEE CPMT Conference on High Density Microsystem Design Packaging and Failure Analysis, Jun. 27-30, 2005, Shanghai, China.

C116. L.Y. Hsiao and J.G. Duh, "Intermetallic Compound Formation and Diffusion Path Evolution in the Flip Chip Sn-37Pb Solder Bump after Aging", the Seventh IEEE CPMT Conference on High Density Microsystem Design Packaging and Failure Analysis, Jun. 27-30, 2005, Shanghai, China.

C117. L.Y. Hsiao, T. Fang and J.G.Duh, ”Electrochemical Properties of Nanosize Ni-Sn-P Coated on MCMB Anode for Lithium Secondary Batteries”, International Conference on Solid State Ionics, Jul. 17-22, 2005, Baden-Baden, Germany.

C118. T. Fang, L.Y. Hsiao, S.R. Sheen and J.G.Duh, ”Performance Improvement of Graphite Deposited with Multiphase Tin Compounds as Anode for Li-ion Batteries”, International Conference on Solid State Ionics, Jul. 17-22, 2005, Baden-Baden, Germany.

C119. S.K. Tien, J.G. Duh and J.W. Lee, "Oxidation Behavior of Sputtered CrN/AlN Multilayer Coatings during Heat Treatment", AEPSE conference, Sep. 12-16, 2005, Qing-Dao, China. (invited)

C120. G.Y. Jang, J.G. Duh, S.W. Lu and J.C. Chen, “Phase Evolution and Diffusion Path in the Flip Chip Sn-3.0Ag-(0.5 or 1.5)Cu Solder Bump during Aging”, Materials Science & Technology 2005 conference and Exhibition, Sep. 25-28, 2005, Pittsburgh, PA, U.S.A. (invited)

C121. H.W. Chan, J.G. Duh and H.S. Sheu, "Investigation of Copper–Manganese Oxide Spinel Cathode Material at Elevated Current Rate by In Situ Synchrotron X-ray for Li-ion Batteries", 208th Meeting of The Electrochemical Society, Oct. 16-21, 2005, Los Angeles, CA, U.S.A.

C122. P.Y. Liao, J.G. Duh and H.S. Sheu, "Structural Changes of LiNi0.6Co0.25Mn0.15O2 Cathode Materials during Cycling", 208th Meeting of The Electrochemical Society, Oct. 16-21, 2005, Los Angeles, CA, U.S.A.

C123. G.Y. Jang, L.Y. Hsiao, S.Y. Tsai, J.G. Duh and Mysore A. Dayananda, "Diffusion Path and Interdiffusion Structure in the Flip-Chip Eutectic Sn-Pb Solder Bump with Ni/Cu UBM during Reflow and after Aging", TMS 2006 International Metals & Materials Exhibition, Mar. 12-16, 2006, San Antonio, Texas, U.S.A.

C124. L.Y. Hsiao and J.G. Duh, "Revealing the Nucleation and Growth Mechanism of Novel Solder Developed from Sn-3.5Ag-0.5Cu Nanoparticles by Chemical Reduction Method", TMS 2006 International Metals & Materials Exhibition, Mar. 12-16, 2006, San Antonio, Texas, U.S.A.

C125. H.Y. Lee, L.Y. Hsiao, J.G. Duh, S.Y. Tsai and C.R. Lee, "Effects of Ni Particles and Nano-sized Ni3Sn4 Powders Addition on the Interfacial Reactions between Sn-Ag-Ni Solders and Cu Substrate", TMS 2006 International Metals & Materials Exhibition, Mar. 12-16, 2006, San Antonio, Texas, U.S.A.

C126. G.Y. Jang and J.G. Duh, "Elemental Redistribution and Interfacial Reaction Mechanism for the Flip Chip Sn-3.0Ag-(0.5 or 1.5)Cu Solder Bump with Al/Ni(V)/Cu Under-Bump Metallization during Aging", TMS 2006 International Metals & Materials Exhibition, Mar. 12-16, 2006, San Antonio, Texas, U.S.A.

C127. T.I. Shih and J.G. Duh, "Decapsulation Method for Flip Chip with Ceramics in Microelectronic Package", TMS 2006 International Metals & Materials Exhibition, Mar. 12-16, 2006, San Antonio, Texas, U.S.A.

C128. T.I. Shih, Y.C. Lin, J.G. Duh and Tom Hsu, "Electrical Characteristics for Sn-Ag-Cu Solder Bump with Ti/Ni/Cu Under-Bump-Metallization after Temperature Cycling Tests", TMS 2006 International Metals & Materials Exhibition, Mar. 12-16, 2006, San Antonio, Texas, U.S.A.

C129. G.J. Chiou and J.G. Duh, "Effect of Nano-Sized Cu6Sn5 Doping on Microstructure and Strength for the Sn-Ag-Cu Solder Joint with Au/Ni-P/Al UBM", TMS 2006 International Metals & Materials Exhibition, Mar. 12-16, 2006, San Antonio, Texas, U.S.A.

C130. Y.C. Lin and J.G. Duh, "Optimal Phosphorous Content Selection for the Soldering Reaction of Ni-P UBM with Sn-Ag-Cu Solder", TMS 2006 International Metals & Materials Exhibition, Mar. 12-16, 2006, San Antonio, Texas, U.S.A.

C131. K.T. Liu and J.G. Duh, "In-situ Atomic Force Microscopy Study of the Corrosion Behavior of NiTi Thin Film", 2006 International Society of  Electrochemistry (ISE), Apr. 17-20, 2006, Singapore.

C132.T. Fang, J.G. Duh, "Electrochemical Properties of Electroless-deposited Nano-SnP/Graphite Composite Anode for Lithium Secondary Batteries", 2006 International Society of Electrochemistry (ISE), Apr. 17-20, 2006, Singapore.

C133. L. Y. Hsiao and J.G. Duh, "Nano-SnAgCu Composite Material as a Newly-developed Anode for Lithium-ion Batteries", 2006 International Society of Electrochemistry (ISE), Apr. 17-20 , 2006 Singapore.

C134. S.K. Tien and J.G. Duh, "Comparison of Microstructure and Phase Transformation for Nanolayered CrN/AlN and TiN/AlN Coatings at Elevated Temperatures in Air Environment", International Conference on Metallurgical Coating and Thin Films, May 1-5, 2006, San Diego, CA, U.S.A.

C135. K.T. Liu, J.G. Duh and K.H. Chung, "Effect of Aluminum on the Corrosion Behavior of NiTiAl Thin Films", International Conference on Metallurgical Coating and Thin Films, May 1-5, 2006, San Diego, CA, U.S.A.

C136. F.B. Wu, K.T. Liu, C.H. Lin and J.G. Duh, "Fabrication, Phase Transformation and Characterization of the Ni-P-Al-Cu Gradient Coating", 2006 International Conference on Metallurgical Coating and Thin Films, May 1-5, 2006, San Diego, CA, U.S.A.

C137. H. Chan, J. Duh and S. Sheen, “Valence Change by XAS for Surface Modified LiMn2O4 in Li-ion Battery", 2006 International Meeting on Lithium Batteries, Jun. 18-23, 2006, Biarritz, France.

C138. P.Y. Liao and J.G. Duh, “In-situ Synchrotron X-ray Studies of LiNi1-x-yCoyMnxO2 Cathode Materials”, 2006 International Meeting on Lithium Batteries, Jun. 18-23, 2006, Biarritz, France.

C139. G.Y. Jang, J.G. Duh, S.Y. Tsai and C.R. Lee, "Role of Cu Contents in the Isothermal Metallurgical Reaction for the Flip Chip Sn-3.0Ag-(0.5 or 1.5)Cu Joints with Cu/Electroless Ni-P/Immersion Au Bonding Pad during Aging", 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Jun. 27-30, 2006, Shanghai, China. (Invited)

C140. Y.C. Lin, T.I. Shih, S.K. Tien and J.G. Duh, "Morphological and Microstructural Evolution of Phosphorous-rich layer in SnAgCu/Ni-P UBM Solder Joint", TMS 2007 The Minerals, Metals & Materials Society, Feb.  25- Mar. 1, 2007, Orlando, FL, U.S.A.

C141. T.I. Shih, Y.C. Lin, J.G. Duh, Tom Hsu and W.S. Wu, "Electrical Measurement of a Lead-Free Solder Assembly after Environmental Tests by SEM Internal Probing", TMS 2007 The Minerals, Metals & Materials Society, Feb. 25- Mar. 1, 2007, Orlando, FL, U.S.A.

C142. G.Y. Jang, L.Y. Hsiao and J.G. Duh, "Inhibiting the AuSn4 Formation by Controlling the Interfacial Reaction in Solder Joints", TMS 2007 The Minerals, Metals & Materials Society, Feb. 25- Mar. 1, 2007, Orlando, FL, U.S.A.

C143. K.J. Wang, P.J. Huang, J.G. Duh and M.A. Dayananda, “Elemental diffusion behavior for the Sn-37Pb and Sn-3.0Ag-0.5Cu joints with Cu and Ni Substrates during Aging”, TMS 2007 The Minerals, Metals & Materials Society, Feb. 25- Mach 1, 2007, Orlando, FL, U.S.A.

C144. Y.C. Lin, K.J. Wang and J.G. Duh, "Phase Evolution in the Phosphorous-rich Layer Formation for SnAgCu/Ni-P Joint", EMPA 2006, 8th International Conference on Electronic Materials and Packaging, Dec. 11-14,2006, Hong-Kong, China.

C145. C.H. Lin and J.G. Duh, “Oxidation Behavior of Multi-component (Ti-Al-Cr-Si-V)xNy Nitride Coatings at Elevated Temperature”, ICMCTF 2007, Apr. 23-27, 2007, San Diego, CA, U.S.A.

C146. Y.Z. Tsai, C.H. Lin and J.G. Duh, “Characterization of WNx Coatings Under Different Substrate Bias Voltage Prepared by DC Magnetron Sputtering”, ICMCTF 2007, Apr. 23-27, 2007, San Diego, CA, U.S.A.

C147. K.T. Liu and J.G. Duh, “Hardness Consideration of NiTi and NiTiAl Thin Film for Various Annealing”, ICMCTF 2007, Apr. 23-27, 2007, San Diego, CA, U.S.A.

C148. C.Y. Kang and J.G. Duh, “The influence of Aluminum Addition on the Thermal Stability and Microstructure in the Ternary NiPAl Coatings”, ICMCTF 2007, Apr. 23-27, 2007, San Diego, CA, U.S.A.

C149. S.K. Tien, C.H. Lin, Y.Z. Tsai and J.G. Duh, “Effect of Nitrogen Flow on the Characterizations of Quaternary CrAlSiN Coatings at Elevated Temperature”, ICMCTF 2007, Apr. 23-27, 2007, San Diego, CA, U.S.A.

C150. S.K. Tien, C.H. Lin, Y.Z. Tsai and J.G. Duh, “Microstructural Evaluation of High Oxidation Resistant CrAlSiN Hard Coating at Elevated Temperature in Air Atmosphere”, Fifth ICSE 2007, Jul. 7-10, 2007, Dalian, China.

C151. T. Fang and J.G. Duh, “Nano-crystalline Tin Compounds and Graphite Composite Anode Synthesized by Electroless-plating Method”, 2006 International Meeting on Lithium Batteries, Jun. 18–23, 2006, Biarritz, France.

C152. L.Y. Hsiao and J.G. Duh, “Nano-SiC-Ni-P-/MGP Composites as High Capacity Anode Materials by Electroless Coating Method”, 2006 International Meeting on Lithium Batteries, Jun. 18–23, 2006, Biarritz, France.

C153. Y.W. Peng, F.B. Wu, S. Li, C.L. Kuo and J.G. Duh, "Fabricationand High Frequency Magnetic Characterization of the FeCoAl Ternary Thin Film", First ISAMMA 2007, May 28- Jun. 1, 2007, Shilla Hotel, Jeju, Korea.

C154. C.L. Kuo, S. Li and J.G. Duh, "FeCoHfN Soft Magnetic Thin Films with High Frequency Characteristics", First ISAMMA 2007, May 28- Jun. 1, 2007, Jeju, Korea.

C155. Y.W. Peng, S.Li, K.X. Liu, J.G. Duh and M. Yamaguchih, "High-frequency Ferromagnetic Properties of FeCoZr Nanocrystalline Films", First ISAMMA 2007, May 28- Jun. 1, 2007, Jeju, Korea.

C156. S.Li, C.M. Tai, Y.W. Peng, S.Y. Tsai, J.G. Duh, C.N. Liao and Y. Du ,"High-frequency Magnetic Inductor with an As-deposited FeCoAlO Thin Film Core", First ISAMMA 2007, May 28- Jun. 1, 2007, Jeju, Korea.

C157. P.C. Huang and J.G. Duh, "Novel Lead-free Sn-Cu-xBi Nanosolders by Chemical Reduction Method", International Conference on Nanoscience & Technology, Jun. 4-6, Beijing, China.

C158. Y. R. Jhan, T. Fang, S. Y. Tsai and J. G. Duh, “Preparation of Sn-coated Mesophase Graphite Powders by Carbothermal Reduction”, 5th International Conference on Surface Engineering (ICSE2007), Jul. 7-10, 2007, Dalian, China.

C159. P.Y. Liao and J.G. Duh, "Structure and Thermal Stability of Mg-doped Li(NiCoMn)O2 Cathode Materials”, 212th Meeting of The Electrochemical Society, Oct. 7-12, 2007, Washington, DC, U.S.A.

C160. Y.S. Lin, J.G. Duh and H.C. Lu, "Effect of pH Value on Electrochemical Property of Tin / Graphite Composite Anode Materials by Electroless Plating Method", 212th Meeting of The Electrochemical Society, Oct. 7-12, 2007, Washington, DC, U.S.A.