C321. C.C.Chang and J.G.Duh, "Ultra-High Temperature Tribological Characteristics in Si Modified CrAlSiN Nanocomposite Coatings", 10th Anniversary AEPSE Conference, Sep. 20-24, 2015, Korea.

C322. C. Fleshman, W. Y. Chen, T. T. Chou, T. K. Lee, Tae Kyu Lee and J. G. Duh, National Tsing Hua University; Cisco Systems Inc, ''The Variation of Grain Structure and the Enhancement of Shear Strength in SAC305-0.1Ni/OSP Cu Solder Joint'', Materials Science and Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

C323. W. Tu, W. Y. Chen, T. Chou, J. G. Duh, ''The Microstructure Evolution in Cu/Sn-3.5Ag/ENIG(wt%) Microbumps'', 
Materials Science and Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

C324. W. Y. Chen, C. Fleshman, W. Tu and J. G. Duh, ''Mis-orientation between the Grains of Cu-Sn IMC from Cu and Cu-Zn Sides in Cu/Sn-3.5Ag/Cu-xZn Microbumps'', Materials Science and Technology2015, Oct. 4-8, 2015, Columbus, Ohio USA.

C325. T. T. Chou, W. Y. Chen, C. Fleshman, W. Tu,  C. Lee and J. G. Duh, ''Investigatig the Stability of Hexagonal-(Cu,Ni)6Sn5 Phase with Doping Ni in Pb-Free Solder Joints via First Principle Simulation'', Materials Science and 
Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

C326. Y. Wang, J. W. Lee and J. G. Duh, ''High Temperature Tribological Properties in CrAlSiN/VN Multilayer Coatings'', Materials Science and Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

C327. C. Lee, W. Y. Chen, T. T. Chou, Tae Kyu Lee and J. G. Duh, Cisco Systems Inc,
''The Investigation of Crack Initiation and Propagation in the Ni(V)/SAC/OSP Cu Solder Joints with High and Low Silver Content during Thermal Cycling Test'', Materials Science and Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

C328. J. G. Duh, ''Exploration of Nanocomposite and Nanomultilayer Coating via Hybrid Organic/Inorganic and Bio-inspired Approach'', Materials Science and Technology 2015, C. M. Li Symposium on Nanomechanical Behavior of Material, in Honor of Prof. C. M. Li's 90th Birthday, Oct. 4-8, 2015, Columbus, Ohio USA. (invited talk)

C329. S. I. Chuang, C. K. Lan, H. Yang, H. W. Chen and J. G. Duh, "Potential Alternatives for Advanced Energy Material Processing in High Performance Li-ion Batteries via Atmospheric Pressure Plasma Treatment", 9th International Conference on Reactive Plasmas, Oct 12-16, 2015, Honolulu, Hawaii.

C330. J. Lee, and J. G. Duh "Applying Composition Control to Enhance the Mechanical an Thermal Properties of Zr-Cu-Ni-Al-N Thin Film Metallic Glass", 9th International Conference on Reactive Plasmas, Oct 12-16, 2015, Honolulu, Hawaii.

C331. C. Y. Wu, C. C. Chang and J. G. Duh, ”Silicon nitride coated silicon thin film on three dimensions current collector for lithium ion battery anode“, TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan .

C332. C. C. Chang, H. W. Chen, J. W. Lee and J. G. Duh, "Development of Si-modified CrAlSiN Nanocomposite Coating for Anti-wear Application in Extreme Environment", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

C333. B. H. Chen, C. K. Lan and J. G. Duh, "The Pitch Free Proceeding of Recycled waste for Si-based lithium ion batteries via C assisted method", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

C334. Y. Wang, J. W. Lee and J. G. Duh, "High-temperature Tribological Characteristics in CrAlN/VN Multilayer Coatings", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

C335. C. K. Lan and J. G. Duh, "Stable high-rate performance of N-doped carbon overlayer-coated Li4Ti5O12 electrodes prepared by Argon/Nitrgen binary plasma jet irradiation", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

C336. H. Yang, S. I. Chuang, H. W. Chen and J. G. Duh, ''Modification of TiO2 powder via atmospheric dielectric barrier discharge treatment for high performance lithium-ion battery anodes'', TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

C337. J. Lee and J. G. Duh, "Modification of property in Zr-Cu-Ni-Al-N thin film metallic glass via composition control", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

C338. J. G. Duh, ''A Revival of Waste:Atmospheric Pressure Nitrogen Plasma Jet Enhanced Jumbo Silicon/Silicon Carbide Composite in Lithium Ion Batteries'', APSPT-9th/SPSM-28th, Dec 12-15, 2015, Nagasaki University, Bunkyo-Campus, Japan. (plenary talk)

C339. T. C. Yang, Y. H. Huang and J. G. Duh , "Novel Lamellar MCMB Supported Sulfur Cones with Carbon Overlayer Coating as Shuttle-effect Barrier for Lithium Sulfur Batteries Cathode", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

C340. S. I. Chuang, H. Yang, H. W. Chen and J. G. Duh, ''Modification of TiO2 powder via atmospheric dielectric barrier discharge treatment for high performance lithium-ion battery anodes'', ISPlasma2016/IC-PLANTS2016, Mar 6-10, 2016, Nagoya University, Nagoya Japan.

C341. Y. Wang, J. W. Lee and J. G. Duh, ''Microstructure Control in Self-lubricating CrAlN/VN Multilayer Coatings for Improved Mechanical Response and High-temperature Tribological Characteristics'', ICMCTF 2016, Apr 25-29,
San Diego, U.S.A.

C342. B. H. Chen, S. I. Chuang and J. G. Duh, "The multiple surface modifications via plasma jet and carbon evaporation to revive the recycled waste from solar industry for Si-based anode materials in lithium ion batteries", Energy Future Conference 2016, Jul. 4-6 2016, University of New South Wales, Sydney, Australia.

C343. J. Lee and J. G. Duh, "The Development of a Zr-Cu-Al-Ag-N TFMG Coating in Pursuit of Improved Mechanical, Thermal, and Antimicrobial Property for Bio-medical Application", 15th International Conference on Plasma Surface Engineering, Sep. 12-16 2016, Garmisch-Partenkirchen, Germany.

C344. J. G. Duh, "Surface modification of energy materials (Si, Li4Ti5O12, graphene and TiO2) via atmosphere pressure plasma treatment for high performance lithium-ion batteries", 7th International Conference on Surface Engineering, Oct. 22-25, 2016, Chengdu, China. (Invited talk)

C345. C. K. Lan and J. G. Duh, "Improvement of Li4Ti5O12 anode materials via atmosphere pressure irradiation and carbon passivation layer approach for stable high rate lithium-ion batteries", 12th Cross-strait Seminar on thin film Science and Technology, Oct. 22-25, 2016, Chengdu, China.

C346. T. T. Chou and J. G. Duh, "The Role of Ultrathin-Ni(P) layer of ENEPIG Metallization in ENEPIG/SAC305/OSP Cu Solder Joints under Thermocycling Test for Automotive Electronics", Materials Science and Technology 2016, Oct. 23-27, 2016, Salt Lake City, USA.

C347. R. W. Song and J. G. Duh, "Characterization of Bi-33In Low Temperature Solder with Cu UBM", Materials Science and Technology 2016, Oct. 23-27, 2016, Salt Lake City, USA.

C348. C. Fleshman and J. G. Duh, "The Variation of Grain Structure and the Enhancement of Shear Strength in SAC305-0.1Ni/Cu Solder Joint before and after Aging", The Minerals, Metals & Materials Society 2017, Feb. 26 - Mar. 2, 2017, San Diego, California, USA.

C349. Rui-Wen Song and Jenq-Gong Duh, "Controlling Interfacial IMC Phase via Modifying Bi Composition in Low Temperature Bi-33In/Cu Solder Joint", The Minerals, Metals & Materials Society 2017, Feb. 26 - Mar. 2, 2017, San Diego, California, USA.

C350. T.T. Chou, C.Y. Ho, W.Y. Chen and J.G. Duh, "Thermocycling Stress Induced Slip Band Sliding in Ultra-thin ENEPIG Joints", The Minerals, Metals & Materials Society 2017, Feb. 26 - Mar. 2, 2017, San Diego, California, USA.

C351. Y.J. CHEN, Metal Industries R&D Centre (MIRDC) and J.G. DUH, The Development of Ultrathin Zr-Cu-Ni-Al-N Thin Film Metallic Glass as a Diffusion Barrier for Cu-Si Interconnect, ICMCTF 2017, Aprl. 24 - 28, 2017, San Diego, California, USA.

C352. Y.C. Lu and J.G. Duh, The Mechanical and Tribological Properties of Nanocomposite CrMoSixN Coatings, ICMCTF 2017, Aprl. 24 - 28, 2017, San Diego, California, USA.

C353. C.Y. Wu, J.G. Duh, A New Ionic Network for Aqueous Polymer Binder for Enhancing the Electrochemical Performance of Li-Ion Batteries, 68th ISE,Oct. 27- Nov. 1, 2017, Rhode Island, USA.

C354.  H. Yang, J.G. Duh, The electrochemical studies of new substituted olivine LiMn1-xVOxPO4 as a cathode material in LIBs, 68th ISE,Oct. 27- Nov. 1, 2017, Rhode Island, USA.

C355. H. Tao, H.W.Chen and J.G. Duh,"Newly-developed CrAlMoSiN Nanocomposite Coating for Enhanced High-temperature Tribological Properties", AEPSE 2017,Sept. 11-15, 2017,jeju island, Korea.

C356. L.K. Yeh-Liu, H.W.Chen and J.G. Duh,"Improvement of CrMoN/SiNx Coatings on Mechanical and High Temperature Tribological Properties by Multilayered Architecture Design", AEPSE 2017,Sept. 11-15, 2017,jeju island, Korea.

C357. J.G. Duh,"Exploration of Zr-Cu Based Thin Film Metallic Glass for Mechanical Strength, Thermal Stability, Bio-antimicrobial Ability and Diffusion Barrier", ICMSNT 2018, Mar. 30, 2018, Chengdu, China.(keynote speaker)

C358. J.G. Duh,"Exploitation of Surface Modification and Architecture Control for Multi-Functional Coatings via Nano-Composite, Multilayer, Hybrid Organic/Inorganic, and Bio-Inspired Approach", ICMCTF 2018, Apr. 25, 2018,San Diego, California, USA.(invited talk)

C359 J.G. Duh,"Pursuit of multilayer thin films for multiple function via crystalline/amorphous, organic/inorganic hybrid and bio-inspired approach", LFM 2018, May. 15, 2018, Taipei,Taiwan.(keynote speech)

C360 J.G. Duh,"The Joy of Scanning Electron Microscopy", Microscopy and Microanalysis 2018, Aug.7, 2018, Baltimore,MD, USA.

C361. J.G. Duh,"Exploration of novel anode and cathode materials for advanced Lithium ion battery", FMS 2018, Aug.17, 2018, Xiamen, China.(invited talk)

C362. R.W. Song and J.G. Duh,"Inhibiting the Large Primary Ag3Sn in Cu/Sn-Ag/ENIG Solder Joints with Additional Pd Depositery", MS&T 2018, Oct.14, 2018, Columbus, USA.

C363. T.T. Chou and J.G. Duh,"Improving ball shear strength of lead free solder joint via Ni-doped solder and Ni-based UBM", MS&T 2018, Oct.14, 2018, Columbus, USA

C364. J.G. Duh,"Application of multi component alloys thin films for diffusion barrier in microelectronic", 第十二屆中國表面工程大會, Nov. 10, 2018, Kunming, China.(plenary talk).

C365 J.G. Duh,"Exploration of high voltage cathode and high energy/power anode materials for advanced LIB" (invited talk), 2018中國新材料產業發展大會, Dec. 20. 2018, Nanjing, China,(invited talk)

C366. J.G. Duh,"Atmosphere pressure plasma treatment of anode materials for advanced lithium-ion batteries" (invited talk), APSE workshop, Jan. 27. 2019, Kuala Lumpur, Malaysia

C367. C. Fleshman and J. G. Duh, "The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/Cu and SAC1205-0.1 Ni/Cu solder joint before and after aging",TMS 2019, Mar. 12. 2019, San Antonio, Texas, USA

C368. H. Chen and J. G. Duh, "Effect of Ag on Mechanical Properties of Sn-Ag-Cu Micro-BGA Joints", TMS 2019, Mar. 12. 2019, San Antonio, Texas, USA

C369. J.G. Duh, "The Architecture Design and Novel Material Selection for Improved Reliability of Solder Interconnections in Microelectronic Packaging" (invited talk)",International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors VII, May. 19. 2019, Tokyo, Japan

C370. W.L. Lo, "Improvement of CrMoN/ SiNx Multilayered Coatings on Mechanical and High
Temperature Tribological Properties", ICMCTF 2019, May. 23. 2019, San Diego, California, USA

C371, Y.C. Lin, "Influence of Mo Contents on Elevated Temperature Tribological Characteristics of CrAlMoSiN Nanocomposite Coating", ICMCTF 2019, May. 22. 2019, San Diego, California, USA

C372. J.G. Duh, "Multi-functionality of Multi-component Zr-Cu-Ni-Al-N thin films for diffusion barrier, anti-bacteria and bio-compatibility", June. 12. 2019, Kanazawa, Japan

C373. J.G.Duh, "Modification and Construction of Cathode Materials for Advanced Li-ion Batteries (plenary talk)", Advanced Ceramics and Application VIII, Sep. 22. 2019, Belgrade, Serbia

C374. J. G. Duh,"Mechanical and High Temperature Tribological Performance of High Entropy Nitride Coatings", 2019 Workshop on Structures and Properties of HEAs Program & Abstract，Oct. 25. 2019, Yanghzou, Jiangsu, China

C375. J. G. Duh,"Enhancing the Biocompatibility of Cardiovascular Materials and Producing the Nitrogen Fertilizers via Atmospheric Pressure Plasma"The 1st International Symposium on Applied Plasma Science and Engineering for Agro and Bio Industry, Feb. 3. 2020, Chiang Mai, Thailand

C376. J. G. Duh,"Development of Plasma Technology Apply in Semiconductor Industry Wastewater, Energy Storage Materials and Smart Agriculture ", 2020 MRST, Nov. 6. 2020, Taipei, Taiwan

C377. Z.Y. Wu, ''Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu TLP soldering by TCB process '',TMS 2022 Annual Meeting & Exhibition, Feb. 27–Mar. 3, 2022, Anaheim, California, USA

C378. Y.C. Chan, "Influence of Si Content on the Mechanical Properties, Microstructure and Tribological Behaviors of (AlCrNbSiTi)N Coatings", ICMCTF, May. 21-May. 26, 2023. San Diego, California, USA

C379. S.Y. Hsu, "Oxidation behaviors of (AlCrSiTi)N coatings on AISI 304 steel: A Combinatorial Study", ICMCTF, May. 21-May. 26, 2023. San Diego, California, USA

C380. P.Y. Lai, "Mechanical characteristics in epitaxial stabilization ZrTiN/NbN superlattice coatings", ICMCTF, May. 21-May. 26, 2023. San Diego, California, USA

C381. J.G.Duh, "Exploration of Atmospheric Pressure Plasma Technique in the Surface Modification on Anode Material for High-rate Lithium–ion Battery and Rapid Organic Fertilizer Manufacturing for Sustainable Farming", Global Plasma Forum, Oct. 15- Oct. 18, 2023. Aomori, Japan (Plenary)

C382. J.G.Duh, "Exploring the compositional space of multicomponent nitride hard coatings through combinatorial approach", JVSS 2023, Oct. 30-Nov. 2, 2023. Nagoya, Japan

C383. S.H.Chin, "Effects of Plasma-activated water on Coffee Ground Decomposition and Nitrogenous Substances Formation", AEPSE 2023, Nov. 5-Nov. 8, 2023. Busan, Korea

C384. P.H. Huang, "Rapid Transformation of Organic Waste to Nitrogenous Fertilizer through Plasma Activated Water Treatment",AEPSE 2023, Nov. 5-Nov. 8, 2023. Busan, Korea

C385. J.G.Duh, "Enhancing Mechanical Properties of Full Intermetallic Microbump by Alloying Substrate via Thermocompression Bonding", MRST 2023, Nov. 17-Nov. 20, 2023. Hhinchu, Taiwan (Keynote)

C386. Z.Y. Wu, "Low temperature bonding of Cu/Sn58Bi/Cu with 5μm microbump for high temperature applications", EPTC 2023, Dec. 5-Dec. 8, 2023. Singapore (Oral)

C387. T.W. Lin, "Microstructural and mechanical analysis of Cu/Sn/Cu microbump by doping Ni and Zn into Cu substrate", EPTC 2023, Dec. 5-Dec. 8, 2023. Singapore (Oral)

C388. Z.X. Chen, "Eliminating Preferred orientation and Refining Grain Size with Ni doping in Cu/Sn-3.0Ag-0.5Cu/Cu TLP Bonding under isothermal aging treatment", EPTC 2023, Dec. 5-Dec. 8, 2023. Singapore (Oral)

C389. J.G. Duh, "Solder joint reliability in microbump for microelectronic packages via thin film metallization and doping by surface modification techniques", ISPlasma2024/IC-PLANTS2024/APSPT-13, Mar. 3-Mar. 7, 2024. Nagoya, Japan (Invited talk)