C161. Y.R. Jhan and J.G. Duh, "Synthesis of Composite Anode Containing Sn-P Compounds and Mixed Carbonaceous Materials by the Electroless Plating Method", 212th Meeting of The Electrochemical Society, Oct. 7-12, 2007, Washington, DC, U.S.A.

C162. C.H. Lin and J.G. Duh, “Corrosion resistance of multi-component (Ti-Al-Cr-Si-V)xNy coatings”, 212th Meeting of The Electrochemical Society, Oct. 7-12, 2007, Washington, DC, U.S.A.

C163. K.T. Liu and J.G. Duh, “Effects of grain size on the corrosion behavior of NiTi and NiTiAl film”, 212th Meeting of The Electrochemical Society, Oct. 7-12, 2007, Washington, DC, U.S.A.

C164. T. Fang and J.G. Duh, "Nano-Crystallized Tin Compounds / Natural Graphite Composite Material Prepared by the Electroless-Plating Process as Anode for Lithium-Ion Batteries", 212th Meeting of The Electrochemical Society, Oct. 7-12, 2007, Washington, DC, U.S.A.

C165. H.W. Chan ,J.Y. Jiang, P.Y. Liao and J.G. Duh, "In Situ XRD and XAS investigation of LiMn2O4 Cathode Material in Li-Ion Battery". IUPAC 3rd International Symposium on Novel Materials and Synthesis (NMS-III) & 17th International Symposium on Fine Chemistry and Functional Polymers (FCFP-XVII), Oct.r 17-21, 2007, Shanghai, China.

C166. T.Y. Shih, C.N. Peng, J.G. Duh and T.Hsu, “Local resistance measurements via four points probe (4pp) method in eutectic solder assembly after temperature cycling Test by SEM Internal probing technique”, TMS 2008 The Minerals, Metals & Materials Society, Mar. 9-13, 2008, New Orleans, Louisiana, U.S.A.

C167. J.G. Duh and C.N. Peng, “Employment of Oriental Philosophy in the Establishment of Framework for Probing Nanoscale Science and Technology”, Hume-Rothery Symposium- Nanoscale Phase, Supplemental Proceeding ( The Minerals, Metals and Materials Society), Mar. 9-13, 2008, New Orleans, Louisiana, U.S.A. .( invited talk )

C168. C.H. Lin and J.G. Duh, “Corrosion Behavior of (Ti-Al-Cr-Si-V)xNy Coatings on Mild Steels Derived from RF Magnetron Sputtering”, ICMCTF 2008, Apr. 28-May 2, 2008, San Diego, CA, U.S.A.

C169. Y.Z. Tsai and J.G. Duh, “Microstructure evolution of CrAlSiN/W2N superlattice coatings deposited by DC magnetron sputtering”, ICMCTF 2008, Apr. 28-May 2, 2008, San Diego, CA, U.S.A.

C170. C.Y. Tan and J.G. Duh, “Influence of NiTi Shape Memory Alloy as Under Bump Metallization on Thermal Mechanical Behavior of Solder Joints”, in Electronic Components and   Technology Conference, May 27-30, 2008, Florida, U.S.A.

C171. P.C. Huangand J.G. Duh, “Effects of Different Surfactant Additions and Treatments on The Characteristics of Tin Nanosolder by Chemical Reduction Method”, in Electronic Components and Technology Conference, May 27-30, 2008, Florida, U.S.A.

C172. P.Y. Liao, J.G. Duhand J.F. Lee, “Valence Change and Local Structure during Cycling of Layer-structured Cathode Materials”, 2008 International Meeting on Lithium Batteries, Jun. 22-28, 2008, Tianjin, China.

C173. Y.S. Lin, J.G. Duh, D.T. Shieh and M.H. Yang, "Influence of Sn Concentration on Cycling Performance of Sn Compounds / Graphite Composite Anode Materials", 2008 International Meeting on Lithium Batteries, Jun. 22-28, 2008, Tianjin, China.

C174. T.Y. Lai, P.Y. Liao, C.H. Hsu and J.G. Duh, "Structural Investigation of Pure Carbon-coated LiFePO4 Cathode Material Synthesized by a Modified Solid-State Method", 2008 International Meeting on Lithium Batteries, Jun. 22-28, 2008, Tianjin, China.

C175. S.K. Tien, C.H. Lin, Y.Z. Tsai and J.G. Duh, “Oxidation Behavior, Microstructure Evolution and Thermal Stability in Nanostructure CrN/AlN Multilayer Hard Coating”, ICMCTF 2008, Apr. 28-May 2, 2008, San Diego, CA, U.S.A. ( invited talk )

C176. K.J. Wang and J.G. Duh, “Interfacial Reaction and Failure Mechanism for SnAgCu solder Bump with Ni(V)/Cu Under Bump Metallization During Aging”, ICEPT-HDP 2008 International Conference on Electronic Packaging Technology & High Density Packaging, Jul. 28-31, 2008, Shanghai, China.

C177. C.N. Peng and J.G. Duh, “Mechanical Test After Temperature Cycling on Lead-free Sn-3Ag --0.5Cu Solder Joint”, ICEPT-HDP 2008 International Conference on ElectronicPackaging Technology & High Density Packaging, Jul. 28-31, 2008, Shanghai, China.

C178. C.N. Peng and J.G. Duh, “Reaction Mechanism and Mechanical Properties of the Flip Chip Sn- 3.0Ag-0.5Cu Solder Bump with Cu/Ni-xCu/Ti Under-Bump Metallization after Various Reflows”, TMS 2009 The Minerals, Metals & Materials Society, Feb. 16-19, 2009, San Francisco, California, U.S.A.

C179. C.Y. Yu and J.G. Duh, “Interfacial Reaction of Sn/Cu-Zn During Heat Treatment”, TMS 2009 138th Annual Meeting & Exhibition, Feb. 16-19, 2009, San Francisco, CA, U.S.A.

C180. C.Y. Tan and J.G. Duh, “Characterization of the Effect of Shape Memory Alloy on Solder Joint Strength through Modeling and Testing”, TMS 2009 The Minerals, Metals & Materials Society, Feb. 16-19, 2009, San Francisco, CA, U.S.A.

C181. K. T. Liu and J.G. Duh, “Determination of the Diffusivity for Point Defects in Passivation Layer on NiTi and NiTiAl Thin Films”, TMS 2009 The Minerals, Metals & Materials Society, Feb. 16-19, 2009, San Francisco, CA, U.S.A. (Invited talk)

C182. K.X. Liu and J.G. Duh, “Magnetic Properties and High Frequency Characteristics of   FeCoZrO/ZrO2 Multilayered Thin Film”, TMS 2009 The Minerals, Metals & Materials Society, Feb. 16-19, 2009, San Francisco, CA, U.S.A.

C183. Y.C. Lin, K.J. Wang and J.G. Duh, “Detailed Phase Evolution of Phosphorous-rich Layer and Formation of Ni-Sn-P Compound in SnAgCu/Electroplated Ni-P Solder Joint”, TMS 2009 The Minerals, Metals & Materials Society, Feb. 16-19, 2009, San Francisco, CA, U.S.A. (Invited talk)

C184. Y.S. Lin, J.G. Duh and H.S. Sheu, "The Phase Transformations and Cycling Performance of Sn-Cu Alloy Anode Materials Synthesized by Sputtering", 215th ECS Meeting, May 24-29, 2009, San Francisco, CA, U.S.A.

C185. T.Y. Lai and J.G. Duh, "The relationship between the electronic conductivity and  electrochemical performance of LiFePO4/C", 215th ECS Meeting, May 24-29, 2009, San Francisco, CA, U.S.A.

C186. C.Y. Lin and J.G. Duh, "LiNi0.5Mn1.5O4 cathode material by solid-state method with stable   cycleability in lithium ion battery", 215th ECS Meeting, May 24-29, 2009, San Francisco, CA, U.S.A.

C187. K.J. Wang, J.G. Duh and S.Y. Tsai, “Morphological and Microstructural Evolution of Sn-patch in SnAgCu Solder with Ni(V)/Cu Under Bump Metallization”, ICEPT-HDP 2009 International Conference on Electronic Packaging Technology & High Density Packaging, Aug.10-13, 2009, Beijing, China.

C188. C.Y. Yu and J.G. Duh, “Interfacial Reaction between Sn solder and Cu-xZn UBM after Reflow  and Thermal Aging”, ICEPT-HDP 2009 International Conference on Electronic Packaging Technology & High Density Packaging, Aug.10-13, 2009 , Beijing, China. (Keynote speech)

C189. C.H. Lin, Y.Z. Tsai and J.G. Duh, “Effect of grain size on mechanical properties in CrAlN/SiNx multilayer coatings”, TACT 2009 International Thin Films Conference, December 14-16, 2009, Taipei, Taiwan.

C190. Y.Z. Tsai and J.G. Duh, “Tribological behavior of CrAlSiN/W2N multilayer coatings deposited by DC magnetron sputtering”, TACT 2009 International Thin Films Conference, Dec. 14-16, 2009, Taipei, Taiwan.

C191. Y.C. Chan and J.G. Duh, “Effects of crystalline SiNx layers on the microstructures and mechanical properties of multilayered TiAlN/SiNx coatings”, TACT 2009 International Thin Films Conference, Dec. 14-16, 2009, Taipei, Taiwan.

C192. K.J. Wang and J.G. Duh, “Suppressing the Sn-patch Growth in Ti/Ni(V)/Cu Under Bump Metallization with SnAgCu Solder after Reflow and Aging”, TMS 2010 139th Annual Meeting & Exhibition, Feb. 14-18, 2010, Seattle, WA, U.S.A. (invited talk)

C193. K.J. Wang, J.M. Wang, C.F. Tseng, J.G. Duh, T.K. Lee and K.C. Liu, “Orientation Imaging Studies of Sn3.0Ag0.5Cu Solder Joint with Various Ni Doping after Aging”, TMS 2010 139th Annual Meeting & Exhibition, Feb. 14-18, 2010, Seattle, WA, U.S.A.

C194. K.J. Wang, J.G. Duh, B Sykes and D Schade, “Impact Testing of Sn3.0Ag0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization after Aging at 150 C”, TMS 2010 139th Annual Meeting & Exhibition, Feb. 14-18, 2010, Seattle, WA, U.S.A.

C195. C.Y. Yu and J.G. Duh, “Interfacial Reaction and Microstructure Variation in the Liquid Reaction of Sn-xAg-Cu Solders on Cu-yZn Substrates”, TMS 2010 139th Annual Meeting & Exhibition, Feb. 14-18, 2010, Seattle, WA, U.S.A.

C196. C.Y. Yu, J.G. Duh, T.K. Lee, M Tsai and K.C. Liu, “Effects of Minor Ni Doping on Interfacial Reaction and Microstructure Variation in the Cu/Sn-3Ag-0.5Cu-xNi/Au/Ni Sandwich Structure”, TMS 2010 139th Annual Meeting & Exhibition, Feb. 14-18, 2010, Seattle, WA, U.S.A.

 C197. C.F. Tseng, K.J. Wang and J.G. Duh, “Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Cu-Mn UBM During Aging”, TMS 2010 139th Annual Meeting & Exhibition, Feb. 14-18, 2010, Seattle, WA, U.S.A.

C198. J.M. Wang, K.J. Wang and J.G. Duh, “Interfacial Reaction between Pure Sn and Cu Substrate with Different Grain Size”, TMS 2010 139th Annual Meeting & Exhibition, Feb. 14-18, 2010, Seattle, WA, U.S.A.

 C201. H.W. Chen, Y.C. Chan, J.W. Lee and J.G. Duh, “Oxidation behavior of Si-doped nanocomposite CrAlSiN coatings”, International Conference on Metallurgical Coating and Thin Films, Apr. 26-30, 2010, San Diego, CA, U.S.A.

C202. H.M Lin, J.G. Duh, R. Wei, C. Rincon and J.W. Lee, “The effect of microstructure and composition on mechanical properties in thick-layered nanocomposite Ti-Si-C-N”, International Conference on Metallurgical Coating and Thin Films, Apr. 26-30, 2010, San Diego, CA, U.S.A.

C203. Y.C. Chan and J.G. Duh, “Effects of microstructures on corrosion properties in TiAlN/SiNx multilayers”, 217th Meeting of The Electrochemical Society, Apr. 25-30, 2010, Vancouver, Canada.

C204. Y.R. Jhan and J.G. Duh, ''Synthesis of matrix structure of Sn/C-C (NG-MWCNTs) composite anode materials for lithium ion battery by carbothermal reduction'', 217th ECS Meeting, Apr. 25-30, 2010, Vancouver, Canada.

C205. C.Y. Lin and J.G. Duh, "Improved cyclic performance of LiNi0.5Mn1.5O4 cathode material by particle size reduction", 217th ECS Meeting, Apr. 25-30, 2010, Vancouver, Canada.

C206. Y.S. Lin and J.G. Duh, “Shell-by-Shell Synthesis of Carbon-Coated SnO2 Hollow Nanospheres and Their Applications in Lithium-Ion Battery”, 217th ECS Meeting, Apr. 25-30, 2010, Vancouver, Canada.

C207. C.Y. Lin, J.G. Duh, J.M. Chen and C.H. Hsu, "Development of Porous Microstructure of LiNi0.5Mn1.5O4 Cathode Material for Novel Lithium-Ion Battery to Improve Extended Cycling and Rate Ability of HEV", 15th International Meeting on Lithium Batteries, Jun. 27-Jul. 2, 2010, Montreal, Canada.

C208. Y.C. Chan and J.G. Duh, “Texture, microstructure and tribological behavior in TiAlN/SiNx multilayers”, Thin Films 2010, Jul. 11-14, 2010, Harbin, China.

C209. Y.M. Kuo and J.G. Duh, “Effect of nitrogen contents on the high-frequency characteristics and magnetic properties of FeHfN films”, 2nd International Symposium on Advanced Magnetic Materials and Applications 2010, Jul. 12-16, 2010, Sendai, Japan.

C211. Z.S. Wang, Y.T. Lai and J.G. Duh, "Thickness dependence of the magnetic properties on FeHfN thin film by DC sputtering", 2nd International Symposium on Advanced Magnetic Materials and Applications 2010, Jul. 12-16, 2010, Sendai, Japan.

C210. C. F. Tseng, J. G. Duh and S. Y. Tsai, “Solid State Reaction of Sn3.0Ag0.5Cu Solder with Cu(Mn) Under Bump Metallization”, 11th ICEPT-HDP 2010, Aug. 16-19, 2010, Xi’an, China.

C211. F. C. Tai, H.M. Lin and J. G. Duh, “Low Alkaline Solution to Deposit Electroless Ni-Zn-P Film on Al Pad”, 11th ICEPT-HDP 2010, Aug. 16-19, 2010, Xi’an, China.

C212. Y. Z. Tsai, Y. C. Chan and J. G. Duh, “Growth orientation and anti-wear behavior of CrAlSiN/W2N multilayered protective coatings”, 11th IUMRS International Conference in Asia, Sep. 25-28, 2010, Qingdao, China. (invited talk)

C213. Y.M. Kuo and J.G. Duh, “Application of nanocrystalline Fe-Hf-N soft magnetic films to power inductors”, International Conference of Asian Union of Magnetics Societies 2010, Dec. 5-8, 2010, Jeju island, Korea. (invited talk)

C214. C.Y. Yu and J.G. Duh, “Phase Evolution and Growth at the Interface of Sn/Cu-xZn under Liquid and Solid Reaction”, TMS 2011 140th Annual Meeting & Exhibition, Feb. 27- Mar. 3, 2011, San Diego, CA, U.S.A. (invited talk)

C215. C.Y. Yu, J.G. Duh, T.K. Lee, M. Tsaiand K.C. Liu, “Correlation between Elemental Distribution and Impact Resistance for Sn-3.0Ag-0.5Cu Solder Joints with BGA Component and PCB Assembly”, TMS 2011 140th Annual Meeting & Exhibition, Feb. 27- Mar. 3, 2011, San Diego, CA, U.S.A.

C216. K.J. Wang, C.Y. Yu and J.G. Duh, “Effect of the Cu Thickness in Ti/Ni(V)/Cu UBM on Interfacial Reaction and Mechanical Test of Sn3.0Ag0.5Cu Solder Joint”, TMS 2011 140th Annual Meeting & Exhibition, Feb. 27- Mar. 3, 2011, San Diego, CA, U.S.A. (invited talk)

C217. C.F. Tseng, T.K. Lee, G. Ramakrishna, K.C. Liu and J.G. Duh, “Probing Interfacial Reactions in Sn-3.0Ag-0.5Cu Solder Joint Attached to ENIG and ENEPIG Surface Finishes”, TMS 2011 140th Annual Meeting & Exhibition, Feb. 27- Mar. 3, 2011, San Diego, CA, U.S.A.

C218. I.T. Wang, J.G. Duh, C.Y. Cheng and J. Wang, ”Interfacial Reaction and Elemental Redistribution in Sn3.0Ag0.5Cu-xPd/ENIG Solder Joints after Aging”, TMS 2011 140th Annual Meeting & Exhibition, Feb. 27- Mar. 3, 2011, San Diego, CA, U.S.A.

C219. S.W. Huang, Y. T. Laiand J.G. Duh, “High Permeability Co-Hf-Ta Thin Films”, TMS 2011 140th Annual Meeting & Exhibition, Feb. 27- Mar. 3, 2011, San Diego, CA, U.S.A.

C220. G. Hirata, S. Payán, Y.C. Chan, P.Y. Chen. J.G. Duhand J. McKittrick, “Structure and Mechanical Properties of Bioinspired Inorganic/Polymer Multi-Layer Composites”, TMS 2011 140th Annual Meeting & Exhibition, Feb. 27- Mar. 3, 2011, San Diego, CA, U.S.A.

C221. Y.C. Chan, H.W. Chen, R.H. Wei, J.G. Duh and J.W. Lee, “Microstructure, scratch and wear behavior in thick TiSiCN and TiAlVSiCN nanocomposites”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2011, San Diego, CA, U.S.A.

C222. H.W. Chen, Y.C. Chan, J.W. Lee and J.G. Duh, “Oxidation resistance of nanocomposite CrAlSiN under long-time heat treatment”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2011, San Diego, CA, U.S.A.

C223. H.M. Lin and J.G. Duh, “Interfacial reaction between Sn-3.0Ag-0.5Cu liquid solder and Ni-xZn novel UBM layers”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2011, San Diego, CA, U.S.A.

C224. Y.S. Lin and J.G. Duh, “Facile Synthesis of Mesoporous Lithium Titanate Spheres for High Rate Lithium-ion Batteries”, E-MRS 2011 Spring & Bilateral Meeting, May 9-13, 2011, Nice, France.

C225. Y.C. Jin, C.Y. Lin and J.G. Duh, “The influence of different crystallographic structure on the cycling performance of LiNi0.5Mn1.5O4 cathode for lithium ion battery”, E-MRS 2011 Spring & Bilateral Meeting, May 9-13, 2011, Nice, France.

C226. Y.M. Kuo, S.D. Li and J.G. Duh, “Magnetic Multilayered FeHfN/SiNx films in Power Inductors”, E-MRS 2011 Spring & Bilateral Meeting, May 9-13, 2011, Nice, France.

C227. Y.C. Chan, H.W. Chen, P.S. Chao, J.G. Duh and J.W. Lee, “Microstructure control in TiAlN/SiNx multilayers with appropriate thickness ratios for improvement of hardness and anti-corrosion characteristics”, The 11th International Symposium on Sputtering & Plasma Processes, July 6-8, Kyoto, Japan.

C228. H.W. Chen, Y.C. Chan, J.G. Duh, J.W. Lee, “Tribological Behaviors of CrAlSixN Coatings Derived from RF Magnetron Sputtering”, The 11th International Symposium on Sputtering & Plasma Processes, July 6-8, 2011, Kyoto, Japan.

C229. H.M. Lin and J.G. Duh, “Interfacial reaction between Sn-3.0Ag-0.5Cu solder and a novel UBM Ni-xZn films in liquid state”, 12th ICEPT-HDP 2011, Aug. 8-11, 2011, Shanghai, China.

C230. Y.S. Lin and J.G. Duh, “Facile synthesis of mesoporous lithium titanate spheres for high rate lithium-ion batteries”, IUMRS-ICA 2011, September 19-22, 2011, TWTC Nangang, Taiwan.

C231. C.Y. Lin, C.K. Lan and J.G. Duh, “Improved capacity and rate capability of Ru-doped and carbon-coated Li4Ti5O12 anode material”, IUMRS-ICA 2011, September 19-22, 2011, TWTC Nangang, Taiwan.

C232. Y.R. Jhan and J.G. Duh, “High structure stability of ruthenium doped Li4Ti5O12 and its electrochemical characteristic as discharged to 0.001V”, IUMRS-ICA 2011, September 19-22, 2011, TWTC Nangang, Taiwan.(invited talk)

C233. Y.C. Jin, C.Y. Lin and J.G. Duh, “Crystallographic structures and cycling performance of LiNi0.5Mn1.5O4 cathode materials for lithium ion battery”, IUMRS-ICA 2011, September 19-22, 2011, TWTC Nangang, Taiwan.

C234. C.C. Hsieh, C.Y. Lin and J.G. Duh, “Improvement of the elevated temperature cycling of LiNi0.5Mn1.5O4 through carbon coated technique”, IUMRS-ICA 2011, September 19-22, 2011, TWTC Nangang, Taiwan.

C235. J.G. Duh, “Development of LiNi0.5Mn1.5O4 cathode and Li4Ti5O12, Sn/C anode material for lithium ion battery”, The energy and nano-technology between Hsinchu and Beijing Tsing Hua Universities, Oct. 9-15, 2011, Beijing, China.

C236. C.F. Tseng, J.G. Duhand S.Y. Tsai, “Phase Characterization and Elemental Redistribution in Solder Joints for Microelectronics Packaging by Utilizing FE-SEM and FE-EPMA“, Chinese Electron Microscopy Society, October 23-29, 2011, Chengdu, China.

C237. J.G. Duh, Y.C. Chan and H.W. Chen, “Recent Development in Multi-layer and Nanocomposite Coatings”, 6th Cross Strait Symposium on Engineering Materials, November 8-15, Nanjing, China.

C238. J.G. Duh, Y.C. Chan and H.W. Chen, “Quest for Multifunctional Coatings”, Nanjing University of Aeronautics & Astronautics, Nov. 10, Nanjing, China.

C239. J.G. Duh, “The Development and Challenge on High Working Voltage and Security of the Next Generation Lithium Ion Secondary Battery Electrode Materials”, The development conference of new material trend & fifth session new material development Symposium of Cross Strait, Nanjing University of Aeronautics & Astronautics, Nov.11-13, Nanjing, China.

C240. J.G. Duh, Y.C. Chan and H.W. Chen, “Quest for Multi-functional Coatings”, TACT 2011 International Conference, Nov. 20-23, Kenting, Taiwan. (plenary talk)

C241. Y.C. Chan, H.W. Chen, R.H. Wei, J.G. Duh and J.W. Lee, “Composition Gradient in Thick TiSiCN Nanocomposites with Plasma Enhanced Magnetron Sputtering for Mechanical Strengthening”, TACT 2011 International Conference, Nov. 20-23, Kenting, Taiwan.

C242. H.M. Lin and J.G. Duh, “Evolution of Reliability on Electroplated and Sputtered Ni-Zn Films for under Bump Metallization with Sn-3.0Ag-0.5Cu Solder attached during Liquid Reactions”, TACT 2011 International Conference, Nov. 20-23, Kenting, Taiwan.

C243. P.S. Chen, H.W. Chen, J.G. Duh, J.W. Lee and J.S.C. Jang, “Characterization of Mechanical Properties and Adhesion of Ta-Zr-Cu-Al-Ag Thin Film Metallic Glasses”, TACT 2011 International Conference, Nov. 20-23, Kenting, Taiwan.

C244. J. G. Duh, "Development of High-voltage Cathode and High-stability Anode Material in Li-battery", 14th International Workshop of Advanced Plasma Processing and Diagnostics, January 7-8, 2012, Kyushu, Japan. (invited talk)

C245. C. Y. Ho and J. G. Duh, “Wetting Behavior and Interfacial Reaction between New Electrolytic Ni-Pd Surface Finish/Sn-3.0Ag-0.5Cu Solder Joints”, TMS 2012 141th Annual Meeting & Exhibition, Mar. 11-15, 2012, Orlando, FL, U.S.A.

C246. H. C. Chuang and J. G. Duh, “Effects of Minor Pd Doping on Microstructural Evolution and Interfacial Reactions in Sn-3.0Ag-0.5Cu-xPd/Cu during Isothermal Aging”, TMS 2012 141th Annual Meeting & Exhibition, Mar. 11-15, 2012, Orlando, FL, U.S.A.

C247. C. F. Tseng, I. D. Wang, T. K. Lee, K. C. Liu, C. Y. Cheng, J. Wang and J. G. Duh, “The Impacts of Palladium Addition on Phase Formation, Microstructure Evolution and Mechanical Reliability in Sn-Ag-Cu/ENEPIG and Sn-Ag-Cu-Pd/ENIG Solder Joint”, TMS 2012 141th Annual Meeting & Exhibition, Mar. 11-15, 2012, Orlando, FL, U.S.A. (invited talk)

C248. J. G. Duh, “Ruthenium Doped Li4Ti5O12 Anode Material for the Enhancement of Rate Capability and Cyclic stability”, ACS Meeting Presentations for 243rd ACS National Meeting and Exposition, Mar. 25 - 29, 2012, San Diego, CA, U.S.A. (invited talk)

C249. Y. S. Lin and J.G. Duh, “Self-assembled Synthesis of Nanoflower-like Lithium Titanate Anodes for High-Rate Secondary Lithium-ion Batteries”, E-MRS 2012 Spring Meeting, May 14-18, 2012, Strasbourg, France.

C250. C. F. Tseng, J. G. Duh, “The Pd Influence on Growth Behavior of Quaternary (Cu, Ni, Pd)6Sn5 Compound in Sn-3.0Ag-0.5Cu/Au/Pd/Ni-P Solder Joint during Liquid State Reaction”, E-MRS 2012 Spring Meeting, May 14-18, 2012, Strasbourg, France.

C251. H. M. Lin and J.G. Duh, “Evolution of Morphology and Microstructure on Ameliorated Electroplated Ni-Zn and Ni-Fe Films for Under Bump Metallization Application”, E-MRS 2012 Spring Meeting, May 14-18, 2012, Strasbourg, France.

C252. C. K. Lan and J.G. Duh, “Transition Metal Doping Effect in Electrochemical Performance of Anode Material Li4Ti5O12”, E-MRS 2012 Spring Meeting, May 14-18, 2012, Strasbourg, France.

C253. P. S. Chen, H. W. Chen, J. G. Duh, J. W. Lee and J. S. C. Jang, “CNitrogen Doped Metallic Glass and Intensify Mechanism”, E-MRS 2012 Spring Meeting, May 14-18, 2012, Strasbourg, France.

C254. P. S. Chen, H. W. Chen, J. G. Duh, J. W. Lee and J. S. C. Jang, “Mechanical and Thermal Behaviors of Nitrogen & Ta Doped Zr-based TFMGs-an alternative class of thin film metallic glass”, Taiwan-Korea Workshop on Metallic Glasses, Jun. 4-5, 2012, NTUST, Taipei, Taiwan.

C255. Y. S. Lin, Y. R. Jhan and J.G. Duh, "Development of High-stability Spinel Li4Ti5O12 Anode Material for High-rate Lithium-ion Batteries", Aug.13-16, 2012, Xiamen, China.

C256. J. G. Duh, "A Route to Multi-functional Coating", International Symposium on Materials for Enabling Nanodevices, Aug. 27-29, 2012, UCLA, California, U.S.A.

C257. J. G. Duh, "Exploitation of Hybrid Coating with Multiple Functionalities", National Surface Engineering Conference, Oct. 26-28, 2012, Ningbo, China. (plenary talk)

C258. J. G. Duh, "Development of High-voltage Cathode Materials and High-rate Anode Materials in Li-ion Batteries", Nov. 8, 2012, Nanjing University, Nanjing, China.

C259. J. G. Duh, “Exploration of Thin Film Metallic Glass for Next Generation Application”, MRS-T 2012 Annual Meeting, Nov. 23-25, 2012, NFU, Yunlin, Taiwan. (invited talk)

C260. C. Y. Ho and J.G. Duh, "Feasibility and Reliability of ENEPIG Surface Finish with Ultrathin Ni(P) Deposit in Microelectronic packaging", Doctoral Forum of Advanced Functional Materials and Cross-Strait Doctoral Forum 2012, Dec. 14-16, 2012, Xiamen, China.

 C261. J. G. Duh, "Material Issues in Microelectronic Package Reliability",  Doctoral Forum of Advanced Functional Materials and Cross-Strait Doctoral Forum 2012, December 14-16, 2012, Xiamen, China. (plenary talk)

C262. Y. C. Chan, H. W. Chen, C. H. Chu and J.G. Duh, "From Nanocomposite Nitride to Novel Thin Film Metallic Glass", 5th International Symposium on Advanced Plasma Science and its Applications for Nitrides and Nanomaterials, January 28-Feb. 1, 2013, Nagoya, Japan. (invited talk)

C263. Y. C. Chan, H. W. Chen, P. Y. Chen and J.G. Duh, "Exploration of Novel Bio-inspired Materials via Hybrid Multilayer and Gradient Nanocomposite Coatings", The Sixth International Workshop on Plasma Application & Hybrid Functionally Materials, Mar. 8-11, 2013, Kuala Lumpur, Malaysia. (invited talk)

C264. Y. H. Wu and J. G. Duh, ”Retardation of (Cu,Ni)6Sn5 spalling in Sn-Ag-Cu/Ni Solder Joints via Controlling the Grain Structure of Ni Metallization Layer”, TMS 2013 142th Annual Meeting & Exhibition, Mar. 3-7, 2013, San Antonio, Texas, U.S.A.

C265. C. F. Tseng and J. G. Duh, "Correlation between Microstructure Evolution and Mechanical Strength in Sn-3.0Ag-0.5Cu/ENEPIG Solder Joint", TMS 2013 142th Annual Meeting & Exhibition, Mar. 3-7, 2013, San Antonio, Texas, U.S.A.

C266. W.L Chen and J.G. Duh "The Relationship Between ENEPIG Solder Joints and High Speed Impact Reliability ",TMS 2013 142th Annual Meeting & Exhibition, Mar. 03-07, 2013, San Antonio, Texas, USA.

C267. Yi-Chun Jin and Jenq-Gong Duh, "Nanostructured LiNi0.5Mn1.5O4 Cathode Material with Improved Rate Capability for Lithium Ion Battery" TMS 2013 142th Annual Meeting & Exhibition, Mar. 3-7, 2013, San Antonio, Texas, U.S.A.

C268. C. Y. Ho and J. G. Duh, ” Phase Transformation and Long-term Stabilization of New ENEPIG Surface Finish with Ultra-thin Ni(P) Deposit Solder Joints in Low Impedance Microelectronic Packaging”, TMS 2013 142th Annual Meeting & Exhibition, Mar. 3-7, 2013, San Antonio, Texas, U.S.A.

C269. H.M. Lin, C.Y. Ho, W.L. Chen, Y.H. Wu, D.H. Wang, T.X. Yong, J.R. Lin, Z.W. Lin and J.G. Duh, "Interfacial Reaction and Mechanical Evaluation in Pd-containing Solder Joints via Drop and High Speed Impact test", TMS 2013 142th Annual Meeting & Exhibition, Mar. 3-7, 2013, San Antonio, Texas, U.S.A.

C270. Y.H. Wu and J.G. Duh, "Fabrication of Nano-twinned Ni Films as Novel under Bump Metallization on Electronic Packaging via Sputter Coating", ICMCTF 2013 40th International Conference on Metallurgical Coatings and Thin Films, Apr. 29- May 3, 2013, San Diego, CA, U.S.A.

 C271. J.H. Chu, H.W. Chen, Y.C. Chan, M.L. Liou, J.W. Lee, J. S.C. Jangand J.G. Duh, "Mechanical and Antimicrobial Characteristics in Zr-based Thin Film Metallic Glass at Various Processing Temperature", International Conference on Metallurgical Coating and Thin Films, Apr. 29- May 3, 2013, San Diego, CA, U.S.A.

C274.  Y.C. Chan, J.H.Chu and J.G. Duh, "Mechanical and Antimicrobial Characteristics in Zr-based Thin Film Metallic Glass at various Processing Temperature", The 2nd Cross-strait conference on plasma science, technology and application, May 18-19, 2013, Xiamen, China.

C275.  Y.C. Chan and J.G. Duh, "Architecture, Component and Process Control in Nanocomposite and Multilayer Coatings via Bio-inspired Approach", The 2nd Cross-strait conference on plasma science, technology and application, May 18-19, 2013, Xiamen, China.

C276.  C.F. Tseng, C.Y. Yu, H.M. Lin, C.Y. Ho, Y.S. Wu and J.G. Duh, "Overview for Current Material Issue in Solder Joint Reliability", 5th Straits Forum on Advanced Packaging Material and Development Trends, Jun. 16-17, 2013, Xiamen, China.

C277.  Y.C. Chan, H.W. Chen, J.H. Chu and J.G. Duh, "Development of Multi-functional Coatings- Nanocomposite, Multilayer, Thin Film Metallic Glass, Functional Gradient and Bio-inspired Hybrid Coating", The 9th Asian-European International Conference on Plasma Surface Engineering (AEPSE2013), Aug. 25-30, 2013, Jeju, Korea.

C278.  W.Y. Chen, C.Y. Yuand J.G. Duh, "Improving the Impact Reliability of the Ni-doped Solder Joint by Applying Cu-Zn Under Bump Metallization", The 14th International Conference on Electronic Packaging Technology (ICEPT 2013), Aug. 11-14, 2013, Dalian, China.

C279.  C.Y. Ho and J.G. Duh " Optimal Ni(P) Thickness Selection in SnAgCu Lead Free Solder/Ultrathin-ENEPIG Law Impedance Surface Finish", The 15th International Conference on Electronic Materials and Packaging, Oct. 6-9, 2013, Seoul, Korea.

C280.  W.Y. Chen, C.Y. Yu and J.G. Duh, "Retarding Ag3Sn and Cu3Sn under Liquid-state Reaction by Adding Zn into Cu/Sn-3.5Ag/Cu-15Zn Microbump", Materials Science & Technology 2013, Oct. 27-31, 2013, Montreal, Quebec, Canada.

C281. Y. T. Liao and J.G. Duh, “The Morphology Variation of Intermetallic Compound between Sn-xAg-yCu Solder Joint and OSP Copper Substrate via Low Pressure Plasma Modification After Reflow”, ISPlasma2014, Mar. 2-6, 2014, Nagoya, Japan.

C282. S. I. Chuang and J.G. Duh, “Exploration of Surface Hydrophilic Properties Against after Reduced and Atmospheric Pressure Plasma Treatment on Stainless Steel and Silicon Wafer”, ISPlasma2014, Mar. 2-6, 2014, Nagoya, Japan.

C283. K.C. Hsu, J. Lee and J.G. Duh, “The Effect of Al and Ti Doping on Mechanical Properties of Newly-developed Cu-Zr-Al-Ti Thin Film Metallic Glass”, ISPlasma2014, Mar. 2-6, 2014, Nagoya, Japan.

C284. J. Lee, K.C. Hsu and J.G. Duh, “Modification of Property in Zr-Cu-Ni-Al Thin Film Metallic Glass by DC sputtering via Composition and Process Temperature Control”, ISPlasma 2014, Mar. 2-6, 2014, Nagoya, Japan.

C285. K.C. Hsu, J. Lee and J.G. Duh, “Corrosion Resistance and Antimicrobial Property of Cu-Zr-Al-Ag Thin Film Metallic Glass with Variation of Composition”, ICMCTF2014, April 28-May 2, 2014, San Diego, U.S.A.

C286. J. Lee, K.C. Hsu and J.G. Duh, “Composition Control in Zr-Cu-Ni-Al-N Thin Film Metallic Glass for Improvement of Mechanical and Thermal Properties”, 41st ICMCTF, International Conference on Metallurgical Coatings and Thin Films, Apr. 28-May 2, 2014, San Diego, U.S.A.

C287. Jenq-Gong Duh "Exploitation of Bio-inspired Thin Film Composites", ISPlasma2014, Mar. 4, 2014, Nagoya, Japan. (Invited Lecture)

C288. J. G. Duh, "From Nanocomposite Nitride to Novel Thin Film Metallic Glass", 5th International Symposium on Advanced Plasma Science and its Applications for Nitrides and Nanomaterials, January 28-Feb. 1, 2013, Nagoya, Japan. (invited talk)

C289. J.G. Duh, “Development of Zr-based Thin Film Metallic Glass for Multi-functionality via Composition Control”, The 47th Summer Annual Conference of the Korean Vacuum Society, August 18-20, 2014, Del Pino Resort, Korea.

 C290. J.G. Duh, “Recent activity on applied plasma in Taiwan”, AJC-APSE Workshop, Workshop on Applied Plasma Science and Engineering, Aug. 24, 2015, Fukuoka, Japan.

 C291. J.G. Duh, “In Pursuit of Multi-functional Nitride Coating via Nano-laminate and Nano-composite Design”, International Symposium on Materials for Enabling Nanodevices, Sep. 3-5, 2014, National Chen Kung University, Taiwan. (Plenary talk)

C292. J. G. Duh, “Development of thin film metallic glass”, 第十屆全國表面工程大會暨第六屆全國青年表面工程論壇, Oct. 28-31, 2014, 中國武漢. (Invited talk)

C293. J.G. Duh, “In pursuit of novel nano-composite and multi-layer coatings via amorphous/crystalline, organic/inorganic and bio-inspired approach”, 第九屆海峽兩岸薄膜科技研討會, November 7~8, 2014, 成功大學, 台灣. (Invited talk)

C294. J.G. Duh, “Pursuit of Next-generation Protective Coatings via Organic, Inorganic and Bio-inspired Hybrid Approach”, 第十屆全國表面工程大會暨第六屆全國青年表面工程論壇, Oct. 28-31, 2014, 中國武漢. (Plenary talk)

 C295. J.G. Duh, “Potential Alternatives for Advanced Energy Material Processing via Architecture Control and Atmospheric Pressure Plasma Treatment”, The 20th Workshop on Advanced Plasma Process and Diagnostics & The 7th Workshop for NU-SKKU Joint Institute for Plasma-Nano Material, Jan. 27-29, 2015, Hokkaido University, Sapporo, Japan. (Plenary talk)

C297. H.M. Lin, C.Y. Ho, W.L. Chen, Y.H. Wu, D.H. Wang, J.R. Lin, Y.H. Wu, H.C. Hong, Z.W.Lin and J.G. Duh, “Drop Response and Evaluation for Multi-level Assembly Joints with Slightly Significant Pd or Ni(P) Layer Deposit Under Thermal Aging”, TMS 2014 143th Annual Meeting & Exhibition, Feb. 16-20, 2014, San Diego, CA, U.S.A.

 C298. C.Y. Ho, M.T. Tsai, H.M. Lin and J.G. Duh, “Bump Height Confinement Governed Solder Alloy Hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni Joint Assemblies”, TMS 2014 143th Annual Meeting & Exhibition, Feb. 16-20, 2014, San Diego, CA, U.S.A.

 C299. C.K. Lan, B.H. Chen, H. Yang and J.G. Duh, “High Electrochemical Performance Li4Ti5−x-yNbxCryO12 (0≤x+y≤0.075) as an Anode Material for Lithium-ion Battery”, TMS 2014 143th Annual Meeting & Exhibition, Feb. 16-20, 2014, San Diego, CA, U.S.A.

 C300. B.H. Chen, C.K. Lan and J.G. Duh, “High Performance Silicon Based Lithium Battery from Recycled Cutting Wastes via Carbon Assisted Method”, TMS 2014 143th Annual Meeting & Exhibition, Feb. 16-20, 2014, San Diego, CA, U.S.A.

 C301. H. Yang, Ch.K. Lan, B.H. Chen and J.G. Duh, “Tunable Architectures of Niobium-doped Anatase TiO2 for Lithium-ion Batteries”, TMS 2014 143th Annual Meeting & Exhibition, Feb. 16-20, 2014, San Diego, CA, U.S.A.

 C302.  S. I. Chuang and J.G. Duh, “Exploration of Surface Sydrophilic Properties Against after Reduced and Atmospheric Pressure Plasma Treatment on Stainless Steel and Silicon Wafer”, ISPlasma2014, Mar. 2-6, 2014, Nagoya, Japan.

 C303. Y. T. Liao and J.G. Duh, “The Morphology Variation of Intermetallic Compound between Sn-xAg-yCu Solder Joint and OSP Copper Substrate via Low Pressure Plasma Modification After Reflow”, ISPlasma2014, Mar. 2-6, 2014, Nagoya, Japan.

C304. J. Lee, K.C. Hsu and J.G. Duh, “Modification of Property in Zr-Cu-Ni-Al Thin Film Metallic Glass via Composition and Process Temperature Control”, ISPlasma 2014, Mar. 2- 6, 2014, Nagoya, Japan.

C305. J. Leeand J.G. Duh, “Applying Composition Control to Enhance the Mechanical and Thermal Properties of Zr-Cu-Ni-Al-N Thin Film Metallic Glass”, ICMCTF 2014, Apr. 28- May 2, San Diego, U.S.A.

C306.  C. C. Chang, H. W. Chen, J. W. Lee and J. G. Duh, “Influence of Si Contents on Tribological Characteristics of CrAlSiN Nanocomposite Coatings”, The International Conference on Technological Advances of Thin Films & Surface Coatings, Jul. 16-18, 2014, Chongqing City, China..

C307.  Y.H. Huang and J.G. Duh,"Novel Design of Coral-like and N-doped CNTs Frameworks from In-spaced Polymerization with Si Nanoparticles for High Performance LIBs Anode", E-MRS 2014 Fall Meeting, Sep.15-19, 2014, Warsaw, Poland.

C308. Y.C. Jin, C.Z. Lu, S.C. Liao and J.G. Duh, "The Synthesis of Spinel-layer Hybrid Manganese Cathode Material and it Application for Rechargeable Lithium Battery", E-MRS 2014 Fall Meeting, Sep.15-19, 2014, Warsaw, Poland.

C309. W.Y. Chen and J.G. Duh, "Retarding the Cu-Sn and Ag-Sn Intermetallic Compounds in the Cu/Sn/Cu-15Zn Microbump in 3D-IC Technology", E-MRS 2014 Fall Meeting, Sep.15-19, 2014, Warsaw, Poland.

C310. W.Y. Chou, Y.C. Jin and J.G. Duh, "The Effect of Different Binders in Water-based LiNi0.5Mn1.5O4 and Their Electrochemical Properties at Elevated Temperatures", E-MRS 2014 Fall Meeting, Sep.15-19, 2014, Warsaw, Poland.

C311. W. Tu, W.Y. Chen and J.G. Duh, "Growth Orientation of Cu-Sn IMC in Cu/Sn-3.5Ag/Cu-xZn Microbumps and Zn-doped Solder Joints", E-MRS 2014 Fall Meeting, Sep.15-19, 2014, Warsaw, Poland.

C312. T.T. Chou, W.Y. Chen, C.Y. Ho, H.M. Lin and J.G. Duh, "Effects of Ni-based Substrates and Cu-based Substrates on Grain Structure of Beta-tin in Pb-free Solder Joints", E-MRS 2014 Fall Meeting, Sep.15-19, 2014, Warsaw, Poland.

C313. S. I. Chuang, B. H. Cen, H. W. Chen and J. G. Duh, “Achieving Nitrogen-doping on Surfaces of Si and SiC Particles via Atmospheric Dielectric Barrier Discharge Treatment”, 14th International Conference on Plasma Surface Engineering, Sep. 15-19, 2014, Garmisch-Partenkirchen, Germany.

C314. B.H. Chen, S.I Chuang, W.R. Liu and J. G. Duh, " Atmospheric Pressure Plasma Jet Enhanced Recycled Wastes for High Performance Si-based Lithium Ion Battery Anode", The 55th Battery Symposium, Oct. 20-24, 2014, Kyoto, Japan.

C315. B.H. Chen, S.I Chuang, W.R. Liu and J.G. Duh, "The Revival of Waste, Atmospheric Pressure Nitrogen Plasma Enhanced Jumbo Silicon Based Lithium Ion Battery", 42nd International Conference on Metallurgical Coatings and Thin Films, Apr. 20-24, 2015, San Diego, U.S.A.

C316. Y. T. Liao, Y. C. Chen, S. I. Chuang, H.W. Chen and J.G. Duh, “Controllable Surface Antifouling Property of Poly(ethylene terephthalate) via Atmospheric Pressure Plasma Surface Grafting”, 2nd International Workshop on Plasma for Cancer Treatment (IWPCT-2), Mar. 16-17, 2015, Nagoya, Japan.

C317. S. I. Chuang, H. Yang, H. W. Chen and J. G. Duh, “Modification of TiO2 Powder via Atmospheric Dielectric Barrier Discharge Treatment for High Performance Lithium-ion Battery Anodes”, 42nd International Conference on Metallurgical Coatings and Thin Films, Apr. 20-24, 2015, San Diego, U.S.A.

C318. C. C. Chang, H. W. Chen, J. W. Lee and J. G. Duh, “Development of Si-modified CrAlSiN Nanocomposite Coating for Anti-wear Application in Extreme Environment”, 42nd International Conference on Metallurgical Coatings and Thin Films, Apr. 20-24, 2015, San Diego, U.S.A.

C319. J. Lee, C. C. Chang, S. I. Chuang, C. Liu and J. G. Duh,  AJC-APESE Workshop on July.19, 2015 .Taiwan.

C320. P.W.Chen and J.G.Duh, "Achieving Bio-inspired Tough Titanium Dioxide /Polyimide Multilayer Coatings via Hybrid Coating System", 10th Anniversary AEPSE Conference, Sep. 20-24, 2015, Korea.