A150. F.B. Wu and J.G. Duh, “Mechanical Properties of the Sputtered Nickel-Phosphorous-Based Hard Coatings under Thermal Annealing Process”, Surface & Coatings Technology, 188-89 (2004) 500.

A149. W.Y. Chen, S.K. Tien, F.B. Wu and J.G. Duh, “Crystallization Behaviors and Microhardness of Sputtered Ni-P, Ni-P-Cr and Ni-P-W Deposits on Tool Steel”, Surface and Coatings Technology, 182 (2004) 85.

A148. S.K. Tien, J.G. Duh and Y.I. Chen, “Structure, Thermal Stability and Mechanical Properties of Electroless Ni-P-W Alloy Coatings during Cycle Test”, Surface and Coating Technology, 177-178 (2004) 532.

A147. W.Y. Chen and J.G. Duh, “Thermal Stability of Sputtered Ni-P & Ni-P-Cr Coating during Cycling Test & Annealing Treatment”, Surface and Coating Technology, 177-178 (2004) 222.

A146. J.W. Lee and J. G. Duh, "Evaluation of Microstructures and Mechanical Properties of Chromized Steels with Different Carbon Contents ", Surface & Coatings Technology, 177-178C (2004) 525.

A145. C.S. Huang and J.G. Duh, "Interface Reactions and Phase Equilibrium between Ni/Cu Under-Bump Metalliztion and Eutectic SnPb Flip-Chip Solder Bumps", Journal of Materials Research, 18 (2003) 935.

A144. J.W. Lee and J.G. Duh, "High Temperature MgO-C-Al Refractories-Metal Reactions in High Aluminum Content Alloy Steels", Journal of Materials Research, 18 (2003) 1950.

A143. J.W. Lee, J.G. Duh and C.J. Wang, "NaCl-Induced Accelerated Oxidation of 304 Stainless Steel and Fe-Mn-Al Alloy at 900°C", Journal of Materials Science, 38 (2003) 3619.

A142. F.B. Wu and J.G. Duh, "Mechanical Characterization of Ni-P-based Ternary Coatings by RF Magnetron Sputtering", Thin Solid Films, 441 (2003) 165.

A141. B.L. Young, J.G. Duh and G.Y. Jang, "Compound Formation for Electroplated Ni and Electroless Ni in the Under Bump Metallurgy with Sn-58Bi Solder during Aging", Journal of Electronic Materials, 32 (2003) 1463.

A140. C.S. Huang, G.Y. Jang and J.G. Duh, "Interfacial Reactions and Compound Formation in the Edge of PbSn Flip Chip Solder Bumps on Ni/Cu Under Bump Metallization", Journal of Electronic Materials, 32 (2003) 1273.

A139. C.S. Huang, J.G. Duh and Y.M. Chen, "Metallurgical Reaction of Sn-3.5Ag Solder and Sn-37Pb Solder with Ni/Cu UBM in Flip Chip Package", Journal of Electronic Materials, 32 (2003) 1509.

A138. J.W. Lee, J.G. Duh and J.H. Wang, "Mechanical Property Evaluation of Cathodic Arc Plasma-Deposited CrN Thin Films on Fe–Mn–Al–C Alloys", Surface and Coating Technology, 168 (2003) 223.

A137. H.L. Lai and J.G. Duh, "Pb-free Sn-Ag and Sn-Ag-Bi Solder Powders Prepared by Mechanical Alloying", Journal of Electronic Materials, 32 (2003) 215.

A136. H.W. Chan, J.G. Duh and S.R. Sheen, "LiMn2O4 Cathode Doped with Excess Lithium and Synthesized By Co-Precipitation for Li-Ion Batteries", Journal of Power Sources, 115 (2003) 110.

A135. F.B. Wu, S.K. Tien, J.G. Duh and J.H. Wang, "Surface Characteristics of Electroless and Sputtered Ni-P-W Alloy Coatings", Surface and Coating Technology, 166 (2003) 60.

A134. C.S. Huang and J.G. Duh, "Effects of Ni Thickness and Reflow Times on Interfacial Reactions between Ni/Cu UBM and Eutectic Sn-Pb Solder in Flip Chip Technology", Journal of Electronic Materials, 32 (2003) 89.

A133. F.B. Wu, W.Y. Chen and J.G. Duh, "Ir-Base Multi-Component Coatings on Tungsten Carbide by RF Magnetron Sputtering Process", Surface and Coating Technology, 163-164 (2003) 227.

A132. C.L. Lo and J.G. Duh, "Low Temperature Sintering and Crystallization Behavior of Low Anorthite-Based Glass-Ceramics", Journal of Materials Science, 38 (2003) 693.

A131. J.W. Lee and J.G. Duh, "Mechanism of Fe-Mn-Al Alloy Steel Ingot Failure from MgO-C Refractory Corrosion", Journal of Materials Science, 38 (2003) 713.

A130. J.D. Lin and J.G. Duh, "Fracture Toughness and Hardness of Ceria–and Yttria-Doped Tetragonal Zirconia Ceramics", Material Chemistry and Physics, 78 (2003) 253.

A129. J.D. Lin and J.G Duh, "Correlation of Mechanical Properties and Composition in Tetragonal CeO2-Y2O3-ZrO2 Ceramics System", Materials Chemistry and Physics, 78 (2003) 246.

A128. J.D. Lin, J.G. Duh and C.L. Lo, "Mechanical Properties and Resistance to Hydrothermal Aging of Ceria- and Yttria-doped Tetragonal Zirconia Ceramics", Materials Chemistry and Physics, 77 (2003) 808.

A127. F.B. Wu and J.G. Duh, "Scratch Behavior and In Situ Acoustic Emission Analysis of PVD Chromium Nitride Coatings on Mild Steel with Electroless Nickel Interlayers", Surface and Coating Technology, 162 (2002) 106.

A126. K.H. Chung, J.G. Duh, D. Shin, D.R. Cagna and R. J. Cronin, Jr., "Characteristics and Porcelain Bond Strength of (Ti, Al)N Coating on Dental Alloys", Journal of Biomedical Materials Research, 63 (2002) 516.

A125. C.L. Lo, J.G. Duh, B.S. Chiou and W.H. Lee, "Microstructure Characteristics for Anorthite Composite Glass with Nucleating Agents of TiO2 under Non-isothermal Crystallization", Materials Research Bulletin, 37 (2002) 1949.

A124. C.L. Lo, J.G. Duh, B.S. Chiou and W.H. Lee, "Low Temperature Sintering and Microwave Dielectric Properties of Anorthite-based Glass-Ceramics", Journal of the American Ceramic Society, 85 (2002) 2230.

A123. C.S. Huang, J.H. Yeh, B.L. Young and J.G. Duh, "Phenomena of Electroless Ni-P(EN) and Intermetallic Compound Stripping and Dissolving in Sn-Bi and Sn-Pb Solder Joints with Au/EN/Cu  Metallization", Journal of The Electrochemical Society, 31 (2002) 1230.

A122. C.L. Lo, J.G. Duh and B.S. Chiou, "Low-voltage Cathodoluminescence Properties of the Y2O2S: Eu Red Light Emitting Phosphor Screen in Field-emission Environments", Journal of The Electrochemical Society, 149 (2002) H129.

A121. J.W. Lee, J.G. Duh and S.Y. Tsai, "Corrosion Resistance and Microstructural Evaluation of Chromized Coating Process in Dual Phase Fe-Mn-Al-C Alloy", Surface and Coatings Technology, 153 (2002) 59.

A120. J.S. Chen, J.G. Duh and F.B. Wu, "Microhardness and Corrosion Behavior in CrN/Electroless Ni/Mild Steel Complex Coating", Surface and Coatings Technology, 150 (2002) 239.

A119. F.B. Wu, Y.I. Chen, P.J. Peng, Y.Y. Tsai and J.G. Duh, "Fabrication, Thermal Stability and Microhardness of Sputtered Ni-P-W Coating", Surface and Coatings Technology, 150 (2002) 232.

A118. C.C. Young, J.G. Duh and C.S. Huang, "Improved Characteristics of Electroless Cu Deposition on Pt-Ag Metallized Al2O3 Substrates in Microelectronics Packaging", Surface and Coating Technology, 145 (2001) 215.

A117.  C.C. Young, J.G. Duh and S.Y. Tsai, "Microstructural Evoluation in the Sn-Cu-Ni and Pb-Sn Solder Joints with Cu and Pt-Ag Metallized Al2O3 Substrate", Journal of Electronic Materials, 30 (2001) 1241.

A116. Y.Y. Tsai, F.B. Wu, Y.I. Chen, P.J. Peng, J.G. Duh and S.Y. Tsai, "Thermal Stability and Mechanical Properties of Ni-W-P Electroless Deposits", Surface and Coating Technology, 146-147 (2001) 502.

A115. B.L. Young and J.G. Duh, "Interfacial Reaction and Microstructural Evolution for Electroplated Ni and Electroless Ni in the Under Bump Metallurgy with 42Sn-58Bi Solder during Annealing", Journal of Electronic Materials, 30 (2001) 878.

A114. Y.Y. Chen, J.G. Duh, B.S. Chiou and C.G. Peng, "Luminescent Mechanisms of ZnS:Cu:Cl and ZnS:Cu:Al Phosphors", Thin Solid Films, 392 (2001) 50.

A113. B.L. Young, J.G. Duh, and B.S. Chiou, "Wettibility of Electroless Ni in the Under Bump Metallurgy with Lead Free Solder", Journal of Electronic Materials, 30 (2001) 543.

A112. Y.C. Chang, J.G. Duh and Y.I. Chen, "Fabrication and Crystallization Behaviors of Sputtered Ni-Cu-P Films on Tool Steel", Surface and Coating Technology, 139 (2001) 233.

A111. J.S. Chen and J.G. Duh, "Indentation Behavior and Young’s Modulus Evaluation in Electroless Ni Modified CrN Coating on Mild Steel", Surface and Coating Technology, 139 (2001) 6.

A110. H.W. Miao and J.G. Duh, "Microstructure Evolution in Sn-Bi and Sn-Bi-Cu Solder Joints under Thermal Aging", Materials Chemistry and Physics, 71 (2001) 255.

A109. C.L. Lo, J.G. Duh, B.S. Chiou, C.C. Peng and L. Ozawa, "Synthesis of Eu3+-Activated Yttrium Oxysulfide Red Phosphor by Flux Fusion Method", Materials Chemistry and Physics, 71 (2001)179.

A108. J.D. Lin, J.G. Duh and B.S. Chiou, "The Influence of Washing and Calcination Condition on Ultra-Derived Ceria-Yttria Doped Tetragonal Zirconia Powder", Materials Chemistry and Physics, 68 (2001) 42.

A107. H.W. Miao, J.G. Duh and B.S. Chiou, "Thermal Cycling Test in Sn-Bi and Sn-Bi-Cu Solder Joints", Journal of Materials Science: Materials in Electronics, 11 (2000) 609.

A106. T.Y. Lin, J.G. Duh, C.K. Chung and H. Niu, "Fabrication of Low-Stress Plasma Enhanced Chemical Vapor Deposition Silicon Carbide Films", Japanese Journal of Applied Physics, 39 (2000) 6663.

A105. J.N. Tu, J.G. Duh and S.Y. Tsai, "Morphology, Mechanical Properties and Oxidation Behavior of Reactively Sputtered Cr-N Films", Surface and Coating Technology, 133-134 (2000) 181.

A104. F.B. Wu, J.J. Li and J.G. Duh, "Evaluation of the Mechanical Properties and Tribological Behavior of the CrN Coating Deposited on Mild Steel Modified with Electroless Ni Interlayer", Thin Solid Films, 377-378 (2000) 354.

A103. Y.Y. Chen, J.G. Duh and B.S. Chiou, "The Effect of Substrate Surface Roughness on Wettability of Sn-Bi Solders", Journal of Materials Science: Materials in Electronics, 11 (2000) 279.

A102. Y.G. Lee and J.G. Duh, "Interfacial Morphology and Concentration Profile in the Unleaded Solder/Cu Joint Assembly", Journal of Materials Science: Materials in Electronics, 10 (1999) 33.

A101. Y.G. Lee and J.G. Duh, "Phase Analysis in the Solder Joint of Sn-Cu Solder/IMC/Cu Substrate", Materials Characterization, 42 (1999) 143.

A100. Y.G. Lee and J.G. Duh, "Characterizing the Formation and Growth of Intermetallic Compound In the Solder Joint", Journal of Materials Science, 33 (1998) 5569.

A99. T.R. Tan, J.R. Cheng, J.H. Wang, J.G. Duh and H.C. Shih, "Morphology and Characterization of Anodic Coating on Galvanized Steels Prepared by Alternating Currents", Surface and Coating Technology, 110 (1998) 194.

A98. C.D. Young and J.G. Duh, "Bonding Mechanism of Electroless Ni-P Film with AlN Substrate and Cu Foil", IEEE Transition on Components, Packaging, and Manufacturing Technology, Part A, 21 (1998) 330.

A97. Y.Y. Wei and J.G. Duh, "Effect of Thermal Aging on (Sn-Ag, Sn-Ag-Zn)/Pt-Ag, Cu/Al2O3 Solder Joints", Journal of Materials Science: Materials in Electronics, 9 (1998) 373.

A96. J.D. Lin and J.G. Duh, "Crystalline Size and Microstrain of Thermally Aged Low Ceria- and Yttria- Doped Zirconia", Journal of the American Ceramic Society, 81 (1998) 853.

A95. J.D. Lin and J.G. Duh, "The Use of X-ray Line Profile Analysis in the Tetragonal to Monoclinic Phase Transformation of Ball Milled, As-sintered and Thermally Aged Zirconia Powders", Journal of Materials Science, 32 (1997) 4901.

A94. C.D. Young and J.G. Duh, "Adhesion Strength and Microstructural Evaluation in Electroless Ni-P Metallized AlN Substrate", IEEE Transition on Components, Packaging, and Manufacturing Technology, Part A, 20 (1997) 342.

A93. J.D. Lin and J.G. Duh, "The Use of X-ray Line Profile Analysis to Investigate Crystallite Size and Microstrain for Zirconia Powders", Journal of Materials Science, 32 (1997) 5779.

A92. J.D. Lin and J.G. Duh, "The Effect of Dopants and Organic Washing on Crystallization Temperature of Yttria- and Ceria-doped Zirconia Gels", Journal of Materials Science Letters, 16 (1997) 843.

A91. J.D. Lin and J.G. Duh, "Coprecipitation and Hydrothermal Synthesis of Ultrafine 5.5 mol% - 2 mol% YO1.5-ZrO2Powders Prepared by Coprecipitation", Journal of the American Ceramic Society, 80 (1997) 92.

A90. C.T. Huang and J.G. Duh, "Microhardness of (TiAl)N Films Deposited by Reactive R. F. Magnetron Sputtering", Journal of Materials Science Letters, 16 (1997) 59.

A89. K. Chung and J.G. Duh, "Property of Glass-Ceramic Materials for Fixed Partial Denture Construction", Journal of Oral Rehabilitation, 23 (1996) 590.

A88. C.J. Lin and J.G. Duh, "Mechanical Characteristics of Colored Film on Stainless Steel by Current Pulse Method", Thin Solid Film, 287 (1996) 80.

A87. C.J. Lin and J.G. Duh, "Elemental Redistributions in the Colored Film on SUS 304 Stainless Steel Producted by Current Pulse Method", Surface and Coatings Technology, 85 (1996) 175.

A86. C.T. Huang and J.G. Duh, "Stress and Oxidation Behaviors of R.F. Sputtered (Ti, Al)N Films", Surface and Coatings Technology, 81 (1996) 164.

A85. J.H. Wang and J.G. Duh, "Corrosion Characteristics of Coloured Films on Stainless Steel Formed by Chemical, INCO and Alternating Current Process", Surface and Coatings Technology, 78 (1996) 248.

A84. B.S. Chiou, J.H. Chang and J.G. Duh, "Metallurgical Reactions at the Interface of Sn/Pb Solder and Electroless Copper-plated AlN Substrate", IEEE Transition on Components, Packaging, and Manufacturing Technology, Part B, 18 (1995) 537.

A83. C.T. Huang and J.G. Duh, "Nitrogen Implantation of Ti and Ti+Al Films Deposited on Tool Steel", Vacuum, 46 (1995) 1465.

A82. B.S. Chiou, J.H. Chang and J.G. Duh, "Temperature Cycling Effects Between Sn/Pb Solder and Electroless Copper Plated AlN Substrate", Journal of Materials Science: Materials in Electronics, 6 (1995) 375.

A81. J.H. Wang and J.G. Duh, "Colour Tone and Chromaticity in a Coloured Film on Stainless Steel by Alternating Current Electrolysis Method", Surface and Coatings Technology, 73 (1995) 46.

A80. C.J. Lin and J.G. Duh, "Fretting and Scratch Wear Characteristics of Coloured Film on Stainless Steel by Current Pulse Method", Surface and Coatings Technology, 73 (1995) 52.

A79. C.T. Huang and J.G. Duh, "Deposition of (Ti,Al)N Films onto A2 Tool Steel by Reactive r.f. Magnetron Sputtering", Surface and Coatings Technology, 71 (1995) 259.

A78. B.S. Chiou, C.D. Young and J.G. Duh, "Liquid Phase Bonding of Yttria Stabilized Zirconia with CaO-TiO2-SiO2 Glass", Journal of Materials Science, 30 (1995) 1295.

A77. C.D. Young and J.G. Duh, "Corrosion of Aluminium Nitride Substrate in Acid, Alkaline Solutions and Water", Journal of Materials Science, 30 (1995) 185.

A76. J.H. Wang, J.G. Duh and H.C. Shih, "Corrosion Monitoring of Colored Film on Stainless Steel Formed by Alternating Current Electrolysis Method", Journal of Materials Science Letters, 14 (1995) 53.

A75. C.D. Young and J.G. Duh, "Indirect Bonding of Ni-Electroless Plated AlN and Cu by Hot Pressing Method", IEEE Transactions on Components, Packaging and Manufacturing Technology, 17 (1994) 644.

A74. C.C. Chen, N.T. Liang, W.S. Tse, I.Y. Chen and J.G. Duh, "Raman Spectra of Titanium Nitride Thin Films ", Chinese Journal of Physics, 32 (1994) 205.

A73. K.M. Ching, W.D. Chang, T.S. Chin, J.G. Duh and H.C. Ku, "Anomalous Perpendicular Magnetoanisotropy in Mn4N Films on Si(100)", Journal of Applied Physics, 76 (1994) 6582.

A72. C.J. Lin and J.G. Duh, "The Predominant Operation Parameters and Alternative Controllability in the Square-wave Current Pulse Process for Coloring SUS304 Stainless Steel", Surface and Coating Technology, 70 (1994) 79.

A71. J.H. Chang, J.G. Duh and B.S. Chiou, "Morphology and Adhesion Strength in Electroless Cu Metallized AlN Substrate", IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16 (1993) 112.

A70. J.G. Duh, K.C. Liu and B.S. Chiou, "Microstructural Evaluation of Sn-Pb Solder and Pd-Ag Thick-Film Conductor Metallization under Thermal Cycling and Aging Conditions", in "Thermal Stress and Strain in Microelectronics Packaging", Ed. J.H. Lau, Van Nostrand Reinhold, New York (1993) 532.

A69. J.C. Doong, J.G. Duh, S.Y. Tsai, J.H. Wang and B.S. Chiou, "Corrosion Behaviour in Electroless Nickel Plating Modified TiN Coating", Surface and Coating Technology, 58 (1993) 157.

A68. J.C. Doong, J.G. Duh and S.Y. Tsai, "Wear Behaviour in Electroless Ni Interlayer Modified TiN Coating on Mild Steel", Surface and Coating Technology, 58 (1993) 151.

A67. B.S. Chiou, J.M. Tzeng and J.G. Duh, "Fabrication and Properties of Alumino-Boro-Silicate Glass Ceramic Systems", Journal of Materials Science: Materials in Electronics, 4 (1993) 301.

A66. J.M. Tzeng, J.G. Duh, K.H. Chung and C.C. Chan, "Al2O3 and ZrO2 Modified Dental Glass Ceramics", Journal of Materials Science, 28 (1993) 6127.

A65. C.J. Lin, M.T. Liao and J.G. Duh, "Effect of Surface Treatment on the Spot Weldability of Fe-Mn-Al-Cr Alloys", Journal of Materials Science, 28 (1993) 6007.

A64. J.G. Duh and S.C. Lin, "Nitriding Behaviour in Fe-Al-Mn-Cr-C Alloys at 1000-1100℃", Journal of Materials Science, 28 (1993) 5975.

A63. J.C. Doong, and J.G. Duh, "Effects of pH Values in Electroless Ni Plating on Mild Steel with TiN Coating", Surface and Coating Technology, 58 (1993) 19.

A62. J.G. Duh and S.C. Lin, "Morphological Evolution of α/γ Interface in Fe-Mn-Al Alloy", Journal of Materials Science, 28 (1993) 5355.

A61. J.G. Duh and J.C. Doong, "Structure, Hardness and Adhesion in Electroless Nickel Interlayer Modified TiN Coating on Mild Steel", Surface and Coating Technology, 56 (1993) 257.

A60. C.J. Lin, J.G. Duh, and M.T. Liao, "Influence of Weld Parameters on the Mechanical Properties of Spot Welded Fe-Mn-Al-Cr Alloy", Journal of Materials Science, 28 (1993) 4767.

A59. J.U. Wan and J.G. Duh, "Effects of pH values and Compact Pressure on Co-precipitated Y2O3-CeO2-ZrO2", Journal of Materials Science Letters, 12 (1993) 575.

A58. J.G. Duh and J.U. Wan, "Liquid Infiltration in ZrO2 Ceramics", Journal of Materials Science Letters, 12 (1993) 73.

A57. B.S. Chiou, G.H. Chang and J.G. Duh, "Metallization of AlN Substrates by Electroless Cu Plating", Plating and Surface Finishing, 80 (1993) 65.

A56. J.G. Duh and C.T. Huang, "Mechanical Properties and Oxidation-Corrosion Behavior in AlN Coated Fe-Al-Mn Alloys", Surface and Coating Technolgy, 56 (1992) 61.

A55. C.T. Huang and J.G. Duh, "Deposition of AlN Films onto Fe-Al-Mn Alloys by Reactive R.F. Magnetron Sputtering", Surface and Coating Technology, 56 (1992) 51.

A54. Y.I. Chen and J.G. Duh, "Knoop Hardness and Adhesion Strength in Ti Interlayer Modified TiN Coating on 1008 Carbon Steel", Materials Chemistry and Physics, 32 (1992) 352.

A53. J.G. Duh and J.U. Wan, "Developments in Highly Toughened CeO2-Y2O3-ZrO2 Ceramics System", Journal of Materials Science, 27 (1992) 6197.

A52. B.S. Chiou, W.Y. Hsu, and J.G. Duh, "The Effect of Applied Frequencies and Multiple Firing on the Resistance of Thick Film Resistors", IEEE Transctions on Components, Hybrids and Manufacturing Technolgy, 15 (1992) 93.

A51. Y.I. Chen, J.G. Duh, B.S. Chiou and T.J. Yang, "A Salt Spray Test on Interlayer Modified TiN Coating", Journal of Materials Science Letters, 11 (1992) 810.

A50. K.C. Liu and J.G. Duh, "Microstructural Evolution in Sn/Pb Solder and Pd/Ag Thick Film Conductor Metallization", IEEE Transactions on Components, Hybrids and Manufacturing Technology, 14 (1991) 703.

A49. Y.I. Chen and J.G. Duh, "TiN Coating on Mild Steel Substrate with Electroless Nickel as an Interlayer", Surface and Coating Technology, 48 (1991) 163.

A48. B.S. Chiou, K.C. Liu, J.G. Duh and M.C. Chung, "Development of Temperature-Stable Thick-Film Dielectrics: III. Role of Glass on the Microstructure Evolution of a Thick Film Dielectric", IEEE Transactions on Components, Hybrids and Manufacturing Technology, 14 (1991) 645.

A47. Y.I. Chen, and J.G. Duh, "Deposition of TiN Films with Titanium Interlayer on Low Carbon Steel by Reactive R.F. Magnetron Sputtering", Surface and Coating Technology, 46 (1991) 371.

A46. J.G. Duh and Y.S. Wu, "Residual Stress Effects and t→m Transformationin in Ion Implanted Yttria Stabilized Zirconia", Journal of Materials Science, 26 (1991) 6522.

A45. B.S. Chiou, T.Y. Lin, and J.G. Duh, "Sintering Behavior and Dielectric Characteristics of LiTaO3 with the Addition of (MgO+TiO2)", Materials Chemistry and Physics, 28 (1991) 51.

A44. B.S. Chiou, K.C. Liu, J.G. Duh and P.S. Palanisamy, "Temperature Cycling Effects Between Sn/Pb Solder and Thick Film Pd/Ag Conductor Metallization", IEEE Transactions on Components, Hybrids and Manufacturing Technology, 14 (1991) 233.

A43. J.G. Duh and Y.S. Wu, "Ageing Behavior in Y2O3-CeO2-ZrO2 Ceramics", Journal of Materials Science Letters, 10 (1991) 1003.

A42. Y.I. Chen and J.G. Duh, "Conductive and Transparent Al-doped ZnO Thin Film Prepared by RF Magnetron Sputtering", Materials Chemistry and Physics, 27 (1991) 427.

A41. B.S. Chiou, T.C. Chen, J.J. Li and J.G. Duh, "Thermal and Electrical Stability of ZnO Varistors with Glass Additives", Journal of Electronic Materials, 19 (1990) 1339.

A40. J.G. Duh, Y.S. Wu and B.S. Chiou, "Rutherfold Backscattering Spectroscopy Analysis of Ar+ Implanted Yttria Stabilized Zirconia", Journal of Materials Science Letters, 9 (1990) 916.

A39. J.G. Duh, M.Y. Lee and B.S. Chiou, "Thermal Characterization of Synthesized Y2O3-CeO2-ZrO2", Materials Chemistry and Physics, 24 (1990) 511.

A38. Y.C. Wu and J.G. Duh, "Eutectic Bonding of Nickel to Yttria Stabilized Zirconia", Journal of Materials Science Letters, 9 (1990) 583.

A37. B.S. Chiou, K.C. Liu, J.G. Duh and P.S. Palanisamy, "Intermetallic Formation on the Fracture of Sn/Pb Solder and Pd/Ag Conductor Interfaces", IEEE Transactions on Components, Hybrids and Manufacturing Technology, 13 (1990) 267.

A36. J.G. Duh, Y.C. Wu and B.S. Chiou, "Morpholgy, Strength and Pre-coating Effect in YSZ/NI Bonding", Journal of Materials Science, 25 (1990) 2626.

A35. B.S. Chiou, T.Y. Lin and J.G. Duh, "Fabrication and Electrical Behavior of Sol-Precipitate LiNbO3 Ceramics with the Addition of (LiF+MgF2)", Materials Chemistry and Physics, 24 (1990) 413.

A34. B.S. Chiou, H.T. Dai and J.G. Duh, "Electrical Behavior of Ceria Stabilized Zirconia with Rare-Earth Oxide Additives", Journal of American Ceramic Society, 73 (1990) 866.

A33.  J.G. Duh and C.J. Wang, "Nitriding Kinetics of Fe-Al-Mn-Cr-C Alloys at 1000℃", Journal of Materials Science, 25 (1990) 2615.

A32. B.S. Chiou, S.T. Lin and J.G. Duh, "EPR Evidence for Compensating Defect in BaTiO3 Grain Boundary Barrier Layer Capacitors", Materials Chemistry and Physics, 24 (1990) 239.

A31. J.G. Duh and C.J. Wang, "Formation and Growth Morphology of Oxidation-induced Ferrite Layer in Fe-Mn-Al-Cr-C Alloys", Journal of Materials Science, 25 (1990) 2063.

A30. J.G. Duh and W.S. Chien, "Microstructural Characteristics in Ni/Zirconia Bonding", Journal of Materials Science, 25 (1990) 1529.

A29. J.G. Duh, and C.J. Wang, "High Temperature Oxidation of Fe-31Mn-9Al-xCr-0.87C Alloys (x=0, 3 and 6)", Journal of Materials Science, 25 (1990) 268.

A28. S.K. Chen, J.G. Duh, H.C. Ku and W.C. Chang, "Magnetic and Crystallographic Properties of the Permanent Magnet System Nd2(Co1-xMx)14B (M=Ni, Cu, Ga, Ge)", Journal of Magnetism and Magnetic Materials, 82 (1989) 2.

A27. J.G. Duh and M.Y. Lee, "Fabrication and Sinterability in Y2O3-CeO2-ZrO2", Journal of Materials Science, 24 (1989) 4467.

A26. B.S. Chiou, S.T. Lin, J.G. Duh and P.H. Chang, "Equivalent Circuit Model in the Grain Boundary Barrier Layer Capacitors", Journal of the American Ceramic Society, 72 (1989) 1967.

A25. J.G. Duh, J.W. Jou and B.S. Chiou, "Catalytic and Gas Sensing Characteristics in Pd Doped SnO2", Journal of Electrochemical Society, 136 (1989) 2740.

A24. B.S. Chiou, T.C. Chen and J.G. Duh, "A ZnO Varistor Derived from Metal Oxide Diffusion", Journal of Physics D: Applied Physics, 22 (1989) 844.

A23. J.G. Duh, W.S. Chien and B.S. Chiou, "Wettability in ZrO2/Ni and ZrO2/Cu Bonding", Journal of Materials Science Letters, 8 (1989) 405.

A22. J.G. Duh, W.S. Chien and B.S. Chiou, "Interfacial Morphology and Pre-oxidation Effect in Dental Alloy/Opaque Bonding", Journal of Materials Science Letters, 8 (1989) 355.

A21. J.G. Duh, and J.W. Lee, "Diffusion-Related Kinetics in the Oxidation Induced Phase Transformation of Fe-9Al-3Cr-31Mn Alloys", Journal of Electrochemical Society, 136 (1989) 847.

A20. S.K. Chen, J.G. Duh, and H.C. Ku, "Magnetic and Crystallographic Properties of the Permanent Magnet Systems (R1-xScx)2Fe14B (R=Y, Nd, Dy, Er, Lu)", Journal of Applied Physics, 64 (1988) 5546.

A19. B.S. Chiou, J.J. Li, and J.G. Duh, "Characteristics of PdCl2-doped Tin Oxide Ceramics in Response to CO Gas", Journal of Electronic Materials, 17 (1988) 485.

A18. B.S. Chiou, S.T. Lin and J.G. Duh, "Dielectric Characteristics of LiF-doped BaTiO3 with Nb2O5 and Dy2O3 Addition", Materials Chemistry and Physics, 20 (1988) 431.

A17. J.G. Duh and J.J. Hwung, "Synthesis and Sintering Behavior of MgO-doped Yttria-Stabilized Tetragonal Zirconia Polycrystal (Y-TZP)", Materials Chemistry and Physics, 20 (1988) 409.

A16. J.G. Duh, H.T. Dai and B.S. Chiou, "Sintering, Microstructure, Hardness and Fracture Toughness Behaviour of Y2O3-CeO2-ZrO2", Journal of the American Ceramic Society, 71 (1988) 813.

A15. B.S. Chiou, Y.J. Tsai and J.G. Duh, "Thermal Evolution in Synthesized ZnO Varistors by Urea Process", Journal of Materials Science Letters, 7 (1988) 785.

A14. B.S. Chiou, S.T. Lin and J.G. Duh, "The Effect of Sintering Conditions on the Grain Growth of the BaTiO3-based GBBL Capacitors", Journal of Materials Science, 23 (1988) 3889.

A13. C.J. Wang and J.G. Duh, "The Effect of Carbon on the High Temperature Oxidation of Fe-31Mn-9Al-0.87C Alloy", Journal of Materials Science, 23 (1988) 3447.

A12. S.K. Chen, J.G. Duh and H.C. Ku, "Structural and Magnetic Properties of Pseudoternary Nd2(Fe1-xCux)14B Compounds", Journal of Applied Physics, 63 (1988) 2739.

A11. C.J. Wang and J.G. Duh, "The Effect of Gaseous Atmosphere and Pretreatment on the Oxidation-Nitridation of Fe-31Mn-9Al-6Cr-0.87C Alloy at 1000℃", Journal of Materials Science, 23 (1988) 2913.

A10. J.G. Duh, H.T. Dai and W.Y. Hsu, "Synthesis and Sintering Behaviour in CeO2-ZrO2 Ceramics", Journal of Materials Science, 23 (1988) 2786.

A09. J.G. Duh, J.W. Lee and C.J. Wang, "Microstructural Development in the Oxidation Induced Phase Transformation of Fe-Al-Cr-Mn-C Alloys", Journal of Materials Science, 23 (1988) 2649.

A08. C.J. Wang, and J.G. Duh, "Nitriding in the High Temperature Oxidation of Fe-31Mn-9Al-6Cr Alloy", Journal of Materials Science, 23 (1988) 769.

A07. B.S. Chiou, W.Y. Hsu and J.G. Duh, "Fabrication and Electrical Behavior of Liquid Phase Sintered Zirconia", Ceramics International, 14 (1988) 7.

A06. B.S. Chiou, C.M. Koh. and J.G. Duh, "The Influence of Firing Profile and Additives on the PTCR Effect and Microstructure of BaTiO3 Ceramics", Journal of Materials Science, 22 (1987) 3893.

A05. B.S. Chiou, H.L. Rau, P.H. Chang and J.G. Duh, "Microstructure and Properties of Multilayer-Derived Tungsten Siliside", Journal of  Electrionic Materials, 16 (1987) 251.

A04.  B.S. Chiou, W.Y. Hsu and J.G. Duh, "Dehydration of Synthesized Calcia-Stabilized Zirconia from a Coprecipitation Process", Journal of Materials Science Letters, 5 (1986) 931.

A03. J.G. Duh and M.A. Dayananda, "Interdiffusion in Fe-Ni-Cr Alloys at 1100℃", Diffusion and Defect Data, 39 (1985) 1.

A02. J.G. Duh, "A Quantitative Analysis Procedure for Energy Dispersive X-ray Microanalysis", Chinese Journal of Materials Science, 16B (1984) 14.

A01. J.G. Duh, S.H. Huarng and C.M. Wan, “Phase Transformations in Fe-Al-Mn-Si-C Alloys”, Chinese Journal of Materials Science, 16A (1984) 14.