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Oral Presentation

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  • C201. H.W. Chen, Y.C. Chan, J.W. Lee and J.G. Duh, “Oxidation behavior of Si-doped nanocomposite CrAlSiN coatings”, International Conference on Metallurgical Coating and Thin Films, Apr. 26-30, 2010, San Diego, CA, U.S.A.

  • C202. H.M Lin, J.G. Duh, R. Wei, C. Rincon and J.W. Lee, “The effect of microstructure and composition on mechanical properties in thick-layered nanocomposite Ti-Si-C-N”, International Conference on Metallurgical Coating and Thin Films, Apr. 26-30, 2010, San Diego, CA, U.S.A.

  • C203. Y.C. Chan and J.G. Duh, “Effects of microstructures on corrosion properties in TiAlN/SiNx multilayers”, 217th Meeting of The Electrochemical Society, Apr. 25-30, 2010, Vancouver, Canada.

  • C204. Y.R. Jhan and J.G. Duh, ''Synthesis of matrix structure of Sn/C-C (NG-MWCNTs) composite anode materials for lithium ion battery by carbothermal reduction'', 217th ECS Meeting, Apr. 25-30, 2010, Vancouver, Canada.

  • C205. C.Y. Lin and J.G. Duh, "Improved cyclic performance of LiNi0.5Mn1.5O4 cathode material by particle size reduction", 217th ECS Meeting, Apr. 25-30, 2010, Vancouver, Canada.

  • C206. Y.S. Lin and J.G. Duh, “Shell-by-Shell Synthesis of Carbon-Coated SnO2 Hollow Nanospheres and Their Applications in Lithium-Ion Battery”, 217th ECS Meeting, Apr. 25-30, 2010, Vancouver, Canada.

  • C207. C.Y. Lin, J.G. Duh, J.M. Chen and C.H. Hsu, "Development of Porous Microstructure of LiNi0.5Mn1.5O4 Cathode Material for Novel Lithium-Ion Battery to Improve Extended Cycling and Rate Ability of HEV", 15th International Meeting on Lithium Batteries, Jun. 27-Jul. 2, 2010, Montreal, Canada.

  • C208. Y.C. Chan and J.G. Duh, “Texture, microstructure and tribological behavior in TiAlN/SiNx multilayers”, Thin Films 2010, Jul. 11-14, 2010, Harbin, China.

  • C209. Y.M. Kuo and J.G. Duh, “Effect of nitrogen contents on the high-frequency characteristics and magnetic properties of FeHfN films”, 2nd International Symposium on Advanced Magnetic Materials and Applications 2010, Jul. 12-16, 2010, Sendai, Japan.

  • C211. Z.S. Wang, Y.T. Lai and J.G. Duh, "Thickness dependence of the magnetic properties on FeHfN thin film by DC sputtering", 2nd International Symposium on Advanced Magnetic Materials and Applications 2010, Jul. 12-16, 2010, Sendai, Japan.

  • C210. C. F. Tseng, J. G. Duh and S. Y. Tsai, “Solid State Reaction of Sn3.0Ag0.5Cu Solder with Cu(Mn) Under Bump Metallization”, 11th ICEPT-HDP 2010, Aug. 16-19, 2010, Xi’an, China.

  • C211. F. C. Tai, H.M. Lin and J. G. Duh, “Low Alkaline Solution to Deposit Electroless Ni-Zn-P Film on Al Pad”, 11th ICEPT-HDP 2010, Aug. 16-19, 2010, Xi’an, China.

  • C212. Y. Z. Tsai, Y. C. Chan and J. G. Duh, “Growth orientation and anti-wear behavior of CrAlSiN/W2N multilayered protective coatings”, 11th IUMRS International Conference in Asia, Sep. 25-28, 2010, Qingdao, China. (invited talk)

  • C213. Y.M. Kuo and J.G. Duh, “Application of nanocrystalline Fe-Hf-N soft magnetic films to power inductors”, International Conference of Asian Union of Magnetics Societies 2010, Dec. 5-8, 2010, Jeju island, Korea. (invited talk)

  • C214. C.Y. Yu and J.G. Duh, “Phase Evolution and Growth at the Interface of Sn/Cu-xZn under Liquid and Solid Reaction”, TMS 2011 140th Annual Meeting & Exhibition, Feb. 27- Mar. 3, 2011, San Diego, CA, U.S.A. (invited talk)

  • C215. C.Y. Yu, J.G. Duh, T.K. Lee, M. Tsaiand K.C. Liu, “Correlation between Elemental Distribution and Impact Resistance for Sn-3.0Ag-0.5Cu Solder Joints with BGA Component and PCB Assembly”, TMS 2011 140th Annual Meeting & Exhibition, Feb. 27- Mar. 3, 2011, San Diego, CA, U.S.A.

  • C216. K.J. Wang, C.Y. Yu and J.G. Duh, “Effect of the Cu Thickness in Ti/Ni(V)/Cu UBM on Interfacial Reaction and Mechanical Test of Sn3.0Ag0.5Cu Solder Joint”, TMS 2011 140th Annual Meeting & Exhibition, Feb. 27- Mar. 3, 2011, San Diego, CA, U.S.A. (invited talk)

  • C217. C.F. Tseng, T.K. Lee, G. Ramakrishna, K.C. Liu and J.G. Duh, “Probing Interfacial Reactions in Sn-3.0Ag-0.5Cu Solder Joint Attached to ENIG and ENEPIG Surface Finishes”, TMS 2011 140th Annual Meeting & Exhibition, Feb. 27- Mar. 3, 2011, San Diego, CA, U.S.A.

  • C218. I.T. Wang, J.G. Duh, C.Y. Cheng and J. Wang, ”Interfacial Reaction and Elemental Redistribution in Sn3.0Ag0.5Cu-xPd/ENIG Solder Joints after Aging”, TMS 2011 140th Annual Meeting & Exhibition, Feb. 27- Mar. 3, 2011, San Diego, CA, U.S.A.

  • C219. S.W. Huang, Y. T. Laiand J.G. Duh, “High Permeability Co-Hf-Ta Thin Films”, TMS 2011 140th Annual Meeting & Exhibition, Feb. 27- Mar. 3, 2011, San Diego, CA, U.S.A.

  • C220. G. Hirata, S. Payán, Y.C. Chan, P.Y. Chen. J.G. Duhand J. McKittrick, “Structure and Mechanical Properties of Bioinspired Inorganic/Polymer Multi-Layer Composites”, TMS 2011 140th Annual Meeting & Exhibition, Feb. 27- Mar. 3, 2011, San Diego, CA, U.S.A.

  • C221. Y.C. Chan, H.W. Chen, R.H. Wei, J.G. Duh and J.W. Lee, “Microstructure, scratch and wear behavior in thick TiSiCN and TiAlVSiCN nanocomposites”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2011, San Diego, CA, U.S.A.

  • C222. H.W. Chen, Y.C. Chan, J.W. Lee and J.G. Duh, “Oxidation resistance of nanocomposite CrAlSiN under long-time heat treatment”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2011, San Diego, CA, U.S.A.

  • C223. H.M. Lin and J.G. Duh, “Interfacial reaction between Sn-3.0Ag-0.5Cu liquid solder and Ni-xZn novel UBM layers”, International Conference on Metallurgical Coating and Thin Films, May 2-6, 2011, San Diego, CA, U.S.A.

  • C224. Y.S. Lin and J.G. Duh, “Facile Synthesis of Mesoporous Lithium Titanate Spheres for High Rate Lithium-ion Batteries”, E-MRS 2011 Spring & Bilateral Meeting, May 9-13, 2011, Nice, France.

  • C225. Y.C. Jin, C.Y. Lin and J.G. Duh, “The influence of different crystallographic structure on the cycling performance of LiNi0.5Mn1.5O4 cathode for lithium ion battery”, E-MRS 2011 Spring & Bilateral Meeting, May 9-13, 2011, Nice, France.

  • C226. Y.M. Kuo, S.D. Li and J.G. Duh, “Magnetic Multilayered FeHfN/SiNx films in Power Inductors”, E-MRS 2011 Spring & Bilateral Meeting, May 9-13, 2011, Nice, France.

  • C227. Y.C. Chan, H.W. Chen, P.S. Chao, J.G. Duh and J.W. Lee, “Microstructure control in TiAlN/SiNx multilayers with appropriate thickness ratios for improvement of hardness and anti-corrosion characteristics”, The 11th International Symposium on Sputtering & Plasma Processes, July 6-8, Kyoto, Japan.

  • C228. H.W. Chen, Y.C. Chan, J.G. Duh, J.W. Lee, “Tribological Behaviors of CrAlSixN Coatings Derived from RF Magnetron Sputtering”, The 11th International Symposium on Sputtering & Plasma Processes, July 6-8, 2011, Kyoto, Japan.

  • C229. H.M. Lin and J.G. Duh, “Interfacial reaction between Sn-3.0Ag-0.5Cu solder and a novel UBM Ni-xZn films in liquid state”, 12th ICEPT-HDP 2011, Aug. 8-11, 2011, Shanghai, China.

  • C230. Y.S. Lin and J.G. Duh, “Facile synthesis of mesoporous lithium titanate spheres for high rate lithium-ion batteries”, IUMRS-ICA 2011, September 19-22, 2011, TWTC Nangang, Taiwan.

  • C231. C.Y. Lin, C.K. Lan and J.G. Duh, “Improved capacity and rate capability of Ru-doped and carbon-coated Li4Ti5O12 anode material”, IUMRS-ICA 2011, September 19-22, 2011, TWTC Nangang, Taiwan.

  • C232. Y.R. Jhan and J.G. Duh, “High structure stability of ruthenium doped Li4Ti5O12 and its electrochemical characteristic as discharged to 0.001V”, IUMRS-ICA 2011, September 19-22, 2011, TWTC Nangang, Taiwan.(invited talk)

  • C233. Y.C. Jin, C.Y. Lin and J.G. Duh, “Crystallographic structures and cycling performance of LiNi0.5Mn1.5O4 cathode materials for lithium ion battery”, IUMRS-ICA 2011, September 19-22, 2011, TWTC Nangang, Taiwan.

  • C234. C.C. Hsieh, C.Y. Lin and J.G. Duh, “Improvement of the elevated temperature cycling of LiNi0.5Mn1.5O4 through carbon coated technique”, IUMRS-ICA 2011, September 19-22, 2011, TWTC Nangang, Taiwan.

  • C235. J.G. Duh, “Development of LiNi0.5Mn1.5O4 cathode and Li4Ti5O12, Sn/C anode material for lithium ion battery”, The energy and nano-technology between Hsinchu and Beijing Tsing Hua Universities, Oct. 9-15, 2011, Beijing, China.

  • C236. C.F. Tseng, J.G. Duhand S.Y. Tsai, “Phase Characterization and Elemental Redistribution in Solder Joints for Microelectronics Packaging by Utilizing FE-SEM and FE-EPMA“, Chinese Electron Microscopy Society, October 23-29, 2011, Chengdu, China.

  • C237. J.G. Duh, Y.C. Chan and H.W. Chen, “Recent Development in Multi-layer and Nanocomposite Coatings”, 6th Cross Strait Symposium on Engineering Materials, November 8-15, Nanjing, China.

  • C238. J.G. Duh, Y.C. Chan and H.W. Chen, “Quest for Multifunctional Coatings”, Nanjing University of Aeronautics & Astronautics, Nov. 10, Nanjing, China.

  • C239. J.G. Duh, “The Development and Challenge on High Working Voltage and Security of the Next Generation Lithium Ion Secondary Battery Electrode Materials”, The development conference of new material trend & fifth session new material development Symposium of Cross Strait, Nanjing University of Aeronautics & Astronautics, Nov.11-13, Nanjing, China.

  • C240. J.G. Duh, Y.C. Chan and H.W. Chen, “Quest for Multi-functional Coatings”, TACT 2011 International Conference, Nov. 20-23, Kenting, Taiwan. (plenary talk)

  • C241. Y.C. Chan, H.W. Chen, R.H. Wei, J.G. Duh and J.W. Lee, “Composition Gradient in Thick TiSiCN Nanocomposites with Plasma Enhanced Magnetron Sputtering for Mechanical Strengthening”, TACT 2011 International Conference, Nov. 20-23, Kenting, Taiwan.

  • C242. H.M. Lin and J.G. Duh, “Evolution of Reliability on Electroplated and Sputtered Ni-Zn Films for under Bump Metallization with Sn-3.0Ag-0.5Cu Solder attached during Liquid Reactions”, TACT 2011 International Conference, Nov. 20-23, Kenting, Taiwan.

  • C243. P.S. Chen, H.W. Chen, J.G. Duh, J.W. Lee and J.S.C. Jang, “Characterization of Mechanical Properties and Adhesion of Ta-Zr-Cu-Al-Ag Thin Film Metallic Glasses”, TACT 2011 International Conference, Nov. 20-23, Kenting, Taiwan.

  • C244. J. G. Duh, "Development of High-voltage Cathode and High-stability Anode Material in Li-battery", 14th International Workshop of Advanced Plasma Processing and Diagnostics, January 7-8, 2012, Kyushu, Japan. (invited talk)

  • C245. C. Y. Ho and J. G. Duh, “Wetting Behavior and Interfacial Reaction between New Electrolytic Ni-Pd Surface Finish/Sn-3.0Ag-0.5Cu Solder Joints”, TMS 2012 141th Annual Meeting & Exhibition, Mar. 11-15, 2012, Orlando, FL, U.S.A.

  • C246. H. C. Chuang and J. G. Duh, “Effects of Minor Pd Doping on Microstructural Evolution and Interfacial Reactions in Sn-3.0Ag-0.5Cu-xPd/Cu during Isothermal Aging”, TMS 2012 141th Annual Meeting & Exhibition, Mar. 11-15, 2012, Orlando, FL, U.S.A.

  • C247. C. F. Tseng, I. D. Wang, T. K. Lee, K. C. Liu, C. Y. Cheng, J. Wang and J. G. Duh, “The Impacts of Palladium Addition on Phase Formation, Microstructure Evolution and Mechanical Reliability in Sn-Ag-Cu/ENEPIG and Sn-Ag-Cu-Pd/ENIG Solder Joint”, TMS 2012 141th Annual Meeting & Exhibition, Mar. 11-15, 2012, Orlando, FL, U.S.A. (invited talk)

  • C248. J. G. Duh, “Ruthenium Doped Li4Ti5O12 Anode Material for the Enhancement of Rate Capability and Cyclic stability”, ACS Meeting Presentations for 243rd ACS National Meeting and Exposition, Mar. 25 - 29, 2012, San Diego, CA, U.S.A. (invited talk)

  • C249. Y. S. Lin and J.G. Duh, “Self-assembled Synthesis of Nanoflower-like Lithium Titanate Anodes for High-Rate Secondary Lithium-ion Batteries”, E-MRS 2012 Spring Meeting, May 14-18, 2012, Strasbourg, France.

  • C250. C. F. Tseng, J. G. Duh, “The Pd Influence on Growth Behavior of Quaternary (Cu, Ni, Pd)6Sn5 Compound in Sn-3.0Ag-0.5Cu/Au/Pd/Ni-P Solder Joint during Liquid State Reaction”, E-MRS 2012 Spring Meeting, May 14-18, 2012, Strasbourg, France.

  • C251. H. M. Lin and J.G. Duh, “Evolution of Morphology and Microstructure on Ameliorated Electroplated Ni-Zn and Ni-Fe Films for Under Bump Metallization Application”, E-MRS 2012 Spring Meeting, May 14-18, 2012, Strasbourg, France.

  • C252. C. K. Lan and J.G. Duh, “Transition Metal Doping Effect in Electrochemical Performance of Anode Material Li4Ti5O12”, E-MRS 2012 Spring Meeting, May 14-18, 2012, Strasbourg, France.

  • C253. P. S. Chen, H. W. Chen, J. G. Duh, J. W. Lee and J. S. C. Jang, “CNitrogen Doped Metallic Glass and Intensify Mechanism”, E-MRS 2012 Spring Meeting, May 14-18, 2012, Strasbourg, France.

  • C254. P. S. Chen, H. W. Chen, J. G. Duh, J. W. Lee and J. S. C. Jang, “Mechanical and Thermal Behaviors of Nitrogen & Ta Doped Zr-based TFMGs-an alternative class of thin film metallic glass”, Taiwan-Korea Workshop on Metallic Glasses, Jun. 4-5, 2012, NTUST, Taipei, Taiwan.

  • C255. Y. S. Lin, Y. R. Jhan and J.G. Duh, "Development of High-stability Spinel Li4Ti5O12 Anode Material for High-rate Lithium-ion Batteries", Aug.13-16, 2012, Xiamen, China.

  • C256. J. G. Duh, "A Route to Multi-functional Coating", International Symposium on Materials for Enabling Nanodevices, Aug. 27-29, 2012, UCLA, California, U.S.A.

  • C257. J. G. Duh, "Exploitation of Hybrid Coating with Multiple Functionalities", National Surface Engineering Conference, Oct. 26-28, 2012, Ningbo, China. (plenary talk)

  • C258. J. G. Duh, "Development of High-voltage Cathode Materials and High-rate Anode Materials in Li-ion Batteries", Nov. 8, 2012, Nanjing University, Nanjing, China.

  • C259. J. G. Duh, “Exploration of Thin Film Metallic Glass for Next Generation Application”, MRS-T 2012 Annual Meeting, Nov. 23-25, 2012, NFU, Yunlin, Taiwan. (invited talk)

  • C260. C. Y. Ho and J.G. Duh, "Feasibility and Reliability of ENEPIG Surface Finish with Ultrathin Ni(P) Deposit in Microelectronic packaging", Doctoral Forum of Advanced Functional Materials and Cross-Strait Doctoral Forum 2012, Dec. 14-16, 2012, Xiamen, China.

  • C261. J. G. Duh, "Material Issues in Microelectronic Package Reliability",  Doctoral Forum of Advanced Functional Materials and Cross-Strait Doctoral Forum 2012, December 14-16, 2012, Xiamen, China. (plenary talk)

  • C262. Y. C. Chan, H. W. Chen, C. H. Chu and J.G. Duh, "From Nanocomposite Nitride to Novel Thin Film Metallic Glass", 5th International Symposium on Advanced Plasma Science and its Applications for Nitrides and Nanomaterials, January 28-Feb. 1, 2013, Nagoya, Japan. (invited talk)

  • C263. Y. C. Chan, H. W. Chen, P. Y. Chen and J.G. Duh, "Exploration of Novel Bio-inspired Materials via Hybrid Multilayer and Gradient Nanocomposite Coatings", The Sixth International Workshop on Plasma Application & Hybrid Functionally Materials, Mar. 8-11, 2013, Kuala Lumpur, Malaysia. (invited talk)

  • C264. Y. H. Wu and J. G. Duh, ”Retardation of (Cu,Ni)6Sn5 spalling in Sn-Ag-Cu/Ni Solder Joints via Controlling the Grain Structure of Ni Metallization Layer”, TMS 2013 142th Annual Meeting & Exhibition, Mar. 3-7, 2013, San Antonio, Texas, U.S.A.

  • C265. C. F. Tseng and J. G. Duh, "Correlation between Microstructure Evolution and Mechanical Strength in Sn-3.0Ag-0.5Cu/ENEPIG Solder Joint", TMS 2013 142th Annual Meeting & Exhibition, Mar. 3-7, 2013, San Antonio, Texas, U.S.A.

  • C266. W.L Chen and J.G. Duh "The Relationship Between ENEPIG Solder Joints and High Speed Impact Reliability ",TMS 2013 142th Annual Meeting & Exhibition, Mar. 03-07, 2013, San Antonio, Texas, USA.

  • C267. Yi-Chun Jin and Jenq-Gong Duh, "Nanostructured LiNi0.5Mn1.5O4 Cathode Material with Improved Rate Capability for Lithium Ion Battery" TMS 2013 142th Annual Meeting & Exhibition, Mar. 3-7, 2013, San Antonio, Texas, U.S.A.

  • C268. C. Y. Ho and J. G. Duh, ” Phase Transformation and Long-term Stabilization of New ENEPIG Surface Finish with Ultra-thin Ni(P) Deposit Solder Joints in Low Impedance Microelectronic Packaging”, TMS 2013 142th Annual Meeting & Exhibition, Mar. 3-7, 2013, San Antonio, Texas, U.S.A.

  • C269. H.M. Lin, C.Y. Ho, W.L. Chen, Y.H. Wu, D.H. Wang, T.X. Yong, J.R. Lin, Z.W. Lin and J.G. Duh, "Interfacial Reaction and Mechanical Evaluation in Pd-containing Solder Joints via Drop and High Speed Impact test", TMS 2013 142th Annual Meeting & Exhibition, Mar. 3-7, 2013, San Antonio, Texas, U.S.A.

  • C270. Y.H. Wu and J.G. Duh, "Fabrication of Nano-twinned Ni Films as Novel under Bump Metallization on Electronic Packaging via Sputter Coating", ICMCTF 2013 40th International Conference on Metallurgical Coatings and Thin Films, Apr. 29- May 3, 2013, San Diego, CA, U.S.A.

  • C271. J.H. Chu, H.W. Chen, Y.C. Chan, M.L. Liou, J.W. Lee, J. S.C. Jangand J.G. Duh, "Mechanical and Antimicrobial Characteristics in Zr-based Thin Film Metallic Glass at Various Processing Temperature", International Conference on Metallurgical Coating and Thin Films, Apr. 29- May 3, 2013, San Diego, CA, U.S.A.

  • C274.  Y.C. Chan, J.H.Chu and J.G. Duh, "Mechanical and Antimicrobial Characteristics in Zr-based Thin Film Metallic Glass at various Processing Temperature", The 2nd Cross-strait conference on plasma science, technology and application, May 18-19, 2013, Xiamen, China.

  • C275.  Y.C. Chan and J.G. Duh, "Architecture, Component and Process Control in Nanocomposite and Multilayer Coatings via Bio-inspired Approach", The 2nd Cross-strait conference on plasma science, technology and application, May 18-19, 2013, Xiamen, China.

  • C276.  C.F. Tseng, C.Y. Yu, H.M. Lin, C.Y. Ho, Y.S. Wu and J.G. Duh, "Overview for Current Material Issue in Solder Joint Reliability", 5th Straits Forum on Advanced Packaging Material and Development Trends, Jun. 16-17, 2013, Xiamen, China.

  • C277.  Y.C. Chan, H.W. Chen, J.H. Chu and J.G. Duh, "Development of Multi-functional Coatings- Nanocomposite, Multilayer, Thin Film Metallic Glass, Functional Gradient and Bio-inspired Hybrid Coating", The 9th Asian-European International Conference on Plasma Surface Engineering (AEPSE2013), Aug. 25-30, 2013, Jeju, Korea.

  • C278.  W.Y. Chen, C.Y. Yuand J.G. Duh, "Improving the Impact Reliability of the Ni-doped Solder Joint by Applying Cu-Zn Under Bump Metallization", The 14th International Conference on Electronic Packaging Technology (ICEPT 2013), Aug. 11-14, 2013, Dalian, China.

  • C279.  C.Y. Ho and J.G. Duh " Optimal Ni(P) Thickness Selection in SnAgCu Lead Free Solder/Ultrathin-ENEPIG Law Impedance Surface Finish", The 15th International Conference on Electronic Materials and Packaging, Oct. 6-9, 2013, Seoul, Korea.

  • C280.  W.Y. Chen, C.Y. Yu and J.G. Duh, "Retarding Ag3Sn and Cu3Sn under Liquid-state Reaction by Adding Zn into Cu/Sn-3.5Ag/Cu-15Zn Microbump", Materials Science & Technology 2013, Oct. 27-31, 2013, Montreal, Quebec, Canada.

  • C281. Y. T. Liao and J.G. Duh, “The Morphology Variation of Intermetallic Compound between Sn-xAg-yCu Solder Joint and OSP Copper Substrate via Low Pressure Plasma Modification After Reflow”, ISPlasma2014, Mar. 2-6, 2014, Nagoya, Japan.

  • C282. S. I. Chuang and J.G. Duh, “Exploration of Surface Hydrophilic Properties Against after Reduced and Atmospheric Pressure Plasma Treatment on Stainless Steel and Silicon Wafer”, ISPlasma2014, Mar. 2-6, 2014, Nagoya, Japan.

  • C283. K.C. Hsu, J. Lee and J.G. Duh, “The Effect of Al and Ti Doping on Mechanical Properties of Newly-developed Cu-Zr-Al-Ti Thin Film Metallic Glass”, ISPlasma2014, Mar. 2-6, 2014, Nagoya, Japan.

  • C284. J. Lee, K.C. Hsu and J.G. Duh, “Modification of Property in Zr-Cu-Ni-Al Thin Film Metallic Glass by DC sputtering via Composition and Process Temperature Control”, ISPlasma 2014, Mar. 2-6, 2014, Nagoya, Japan.

  • C285. K.C. Hsu, J. Lee and J.G. Duh, “Corrosion Resistance and Antimicrobial Property of Cu-Zr-Al-Ag Thin Film Metallic Glass with Variation of Composition”, ICMCTF2014, April 28-May 2, 2014, San Diego, U.S.A.

  • C286. J. Lee, K.C. Hsu and J.G. Duh, “Composition Control in Zr-Cu-Ni-Al-N Thin Film Metallic Glass for Improvement of Mechanical and Thermal Properties”, 41st ICMCTF, International Conference on Metallurgical Coatings and Thin Films, Apr. 28-May 2, 2014, San Diego, U.S.A.

  • C287. Jenq-Gong Duh "Exploitation of Bio-inspired Thin Film Composites", ISPlasma2014, Mar. 4, 2014, Nagoya, Japan. (Invited Lecture)

  • C288. J. G. Duh, "From Nanocomposite Nitride to Novel Thin Film Metallic Glass", 5th International Symposium on Advanced Plasma Science and its Applications for Nitrides and Nanomaterials, January 28-Feb. 1, 2013, Nagoya, Japan. (invited talk)

  • C289. J.G. Duh, “Development of Zr-based Thin Film Metallic Glass for Multi-functionality via Composition Control”, The 47th Summer Annual Conference of the Korean Vacuum Society, August 18-20, 2014, Del Pino Resort, Korea.

  • C290. J.G. Duh, “Recent activity on applied plasma in Taiwan”, AJC-APSE Workshop, Workshop on Applied Plasma Science and Engineering, Aug. 24, 2015, Fukuoka, Japan.

  • C291. J.G. Duh, “In Pursuit of Multi-functional Nitride Coating via Nano-laminate and Nano-composite Design”, International Symposium on Materials for Enabling Nanodevices, Sep. 3-5, 2014, National Chen Kung University, Taiwan. (Plenary talk)

  • C292. J. G. Duh, “Development of thin film metallic glass”, 第十屆全國表面工程大會暨第六屆全國青年表面工程論壇, Oct. 28-31, 2014, 中國武漢. (Invited talk)

  • C293. J.G. Duh, “In pursuit of novel nano-composite and multi-layer coatings via amorphous/crystalline, organic/inorganic and bio-inspired approach”, 第九屆海峽兩岸薄膜科技研討會, November 7~8, 2014, 成功大學, 台灣. (Invited talk)

  • C294. J.G. Duh, “Pursuit of Next-generation Protective Coatings via Organic, Inorganic and Bio-inspired Hybrid Approach”, 第十屆全國表面工程大會暨第六屆全國青年表面工程論壇, Oct. 28-31, 2014, 中國武漢. (Plenary talk)

  •  C295. J.G. Duh, “Potential Alternatives for Advanced Energy Material Processing via Architecture Control and Atmospheric Pressure Plasma Treatment”, The 20th Workshop on Advanced Plasma Process and Diagnostics & The 7th Workshop for NU-SKKU Joint Institute for Plasma-Nano Material, Jan. 27-29, 2015, Hokkaido University, Sapporo, Japan. (Plenary talk)

  • C297. H.M. Lin, C.Y. Ho, W.L. Chen, Y.H. Wu, D.H. Wang, J.R. Lin, Y.H. Wu, H.C. Hong, Z.W.Lin and J.G. Duh, “Drop Response and Evaluation for Multi-level Assembly Joints with Slightly Significant Pd or Ni(P) Layer Deposit Under Thermal Aging”, TMS 2014 143th Annual Meeting & Exhibition, Feb. 16-20, 2014, San Diego, CA, U.S.A.

  •  C298. C.Y. Ho, M.T. Tsai, H.M. Lin and J.G. Duh, “Bump Height Confinement Governed Solder Alloy Hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni Joint Assemblies”, TMS 2014 143th Annual Meeting & Exhibition, Feb. 16-20, 2014, San Diego, CA, U.S.A.

  •  C299. C.K. Lan, B.H. Chen, H. Yang and J.G. Duh, “High Electrochemical Performance Li4Ti5−x-yNbxCryO12 (0≤x+y≤0.075) as an Anode Material for Lithium-ion Battery”, TMS 2014 143th Annual Meeting & Exhibition, Feb. 16-20, 2014, San Diego, CA, U.S.A.

  •  C300. B.H. Chen, C.K. Lan and J.G. Duh, “High Performance Silicon Based Lithium Battery from Recycled Cutting Wastes via Carbon Assisted Method”, TMS 2014 143th Annual Meeting & Exhibition, Feb. 16-20, 2014, San Diego, CA, U.S.A.

  •  C301. H. Yang, Ch.K. Lan, B.H. Chen and J.G. Duh, “Tunable Architectures of Niobium-doped Anatase TiO2 for Lithium-ion Batteries”, TMS 2014 143th Annual Meeting & Exhibition, Feb. 16-20, 2014, San Diego, CA, U.S.A.

  •  C302.  S. I. Chuang and J.G. Duh, “Exploration of Surface Sydrophilic Properties Against after Reduced and Atmospheric Pressure Plasma Treatment on Stainless Steel and Silicon Wafer”, ISPlasma2014, Mar. 2-6, 2014, Nagoya, Japan.

  •  C303. Y. T. Liao and J.G. Duh, “The Morphology Variation of Intermetallic Compound between Sn-xAg-yCu Solder Joint and OSP Copper Substrate via Low Pressure Plasma Modification After Reflow”, ISPlasma2014, Mar. 2-6, 2014, Nagoya, Japan.

  • C304. J. Lee, K.C. Hsu and J.G. Duh, “Modification of Property in Zr-Cu-Ni-Al Thin Film Metallic Glass via Composition and Process Temperature Control”, ISPlasma 2014, Mar. 2- 6, 2014, Nagoya, Japan.

  • C305. J. Leeand J.G. Duh, “Applying Composition Control to Enhance the Mechanical and Thermal Properties of Zr-Cu-Ni-Al-N Thin Film Metallic Glass”, ICMCTF 2014, Apr. 28- May 2, San Diego, U.S.A.

  • C306.  C. C. Chang, H. W. Chen, J. W. Lee and J. G. Duh, “Influence of Si Contents on Tribological Characteristics of CrAlSiN Nanocomposite Coatings”, The International Conference on Technological Advances of Thin Films & Surface Coatings, Jul. 16-18, 2014, Chongqing City, China..

  • C307.  Y.H. Huang and J.G. Duh,"Novel Design of Coral-like and N-doped CNTs Frameworks from In-spaced Polymerization with Si Nanoparticles for High Performance LIBs Anode", E-MRS 2014 Fall Meeting, Sep.15-19, 2014, Warsaw, Poland.

  • C308. Y.C. Jin, C.Z. Lu, S.C. Liao and J.G. Duh, "The Synthesis of Spinel-layer Hybrid Manganese Cathode Material and it Application for Rechargeable Lithium Battery", E-MRS 2014 Fall Meeting, Sep.15-19, 2014, Warsaw, Poland.

  • C309. W.Y. Chen and J.G. Duh, "Retarding the Cu-Sn and Ag-Sn Intermetallic Compounds in the Cu/Sn/Cu-15Zn Microbump in 3D-IC Technology", E-MRS 2014 Fall Meeting, Sep.15-19, 2014, Warsaw, Poland.

  • C310. W.Y. Chou, Y.C. Jin and J.G. Duh, "The Effect of Different Binders in Water-based LiNi0.5Mn1.5O4 and Their Electrochemical Properties at Elevated Temperatures", E-MRS 2014 Fall Meeting, Sep.15-19, 2014, Warsaw, Poland.

  • C311. W. Tu, W.Y. Chen and J.G. Duh, "Growth Orientation of Cu-Sn IMC in Cu/Sn-3.5Ag/Cu-xZn Microbumps and Zn-doped Solder Joints", E-MRS 2014 Fall Meeting, Sep.15-19, 2014, Warsaw, Poland.

  • C312. T.T. Chou, W.Y. Chen, C.Y. Ho, H.M. Lin and J.G. Duh, "Effects of Ni-based Substrates and Cu-based Substrates on Grain Structure of Beta-tin in Pb-free Solder Joints", E-MRS 2014 Fall Meeting, Sep.15-19, 2014, Warsaw, Poland.

  • C313. S. I. Chuang, B. H. Cen, H. W. Chen and J. G. Duh, “Achieving Nitrogen-doping on Surfaces of Si and SiC Particles via Atmospheric Dielectric Barrier Discharge Treatment”, 14th International Conference on Plasma Surface Engineering, Sep. 15-19, 2014, Garmisch-Partenkirchen, Germany.

  • C314. B.H. Chen, S.I Chuang, W.R. Liu and J. G. Duh, " Atmospheric Pressure Plasma Jet Enhanced Recycled Wastes for High Performance Si-based Lithium Ion Battery Anode", The 55th Battery Symposium, Oct. 20-24, 2014, Kyoto, Japan.

  • C315. B.H. Chen, S.I Chuang, W.R. Liu and J.G. Duh, "The Revival of Waste, Atmospheric Pressure Nitrogen Plasma Enhanced Jumbo Silicon Based Lithium Ion Battery", 42nd International Conference on Metallurgical Coatings and Thin Films, Apr. 20-24, 2015, San Diego, U.S.A.

  • C316. Y. T. Liao, Y. C. Chen, S. I. Chuang, H.W. Chen and J.G. Duh, “Controllable Surface Antifouling Property of Poly(ethylene terephthalate) via Atmospheric Pressure Plasma Surface Grafting”, 2nd International Workshop on Plasma for Cancer Treatment (IWPCT-2), Mar. 16-17, 2015, Nagoya, Japan.

  • C317. S. I. Chuang, H. Yang, H. W. Chen and J. G. Duh, “Modification of TiO2 Powder via Atmospheric Dielectric Barrier Discharge Treatment for High Performance Lithium-ion Battery Anodes”, 42nd International Conference on Metallurgical Coatings and Thin Films, Apr. 20-24, 2015, San Diego, U.S.A.

  • C318. C. C. Chang, H. W. Chen, J. W. Lee and J. G. Duh, “Development of Si-modified CrAlSiN Nanocomposite Coating for Anti-wear Application in Extreme Environment”, 42nd International Conference on Metallurgical Coatings and Thin Films, Apr. 20-24, 2015, San Diego, U.S.A.

  • C319. J. Lee, C. C. Chang, S. I. Chuang, C. Liu and J. G. Duh,  AJC-APESE Workshop on July.19, 2015 .Taiwan.

  • C320. P.W.Chen and J.G.Duh, "Achieving Bio-inspired Tough Titanium Dioxide /Polyimide Multilayer Coatings via Hybrid Coating System", 10th Anniversary AEPSE Conference, Sep. 20-24, 2015, Korea. 

  • C321. C.C.Chang and J.G.Duh, "Ultra-High Temperature Tribological Characteristics in Si Modified CrAlSiN Nanocomposite Coatings", 10th Anniversary AEPSE Conference, Sep. 20-24, 2015, Korea.

  • C322. C. Fleshman, W. Y. Chen, T. T. Chou, T. K. Lee, Tae Kyu Lee and J. G. Duh, National Tsing Hua University; Cisco Systems Inc, ''The Variation of Grain Structure and the Enhancement of Shear Strength in SAC305-0.1Ni/OSP Cu Solder Joint'', Materials Science and Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

  • C323. W. Tu, W. Y. Chen, T. Chou, J. G. Duh, ''The Microstructure Evolution in Cu/Sn-3.5Ag/ENIG(wt%) Microbumps'', 
    Materials Science and Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

  • C324. W. Y. Chen, C. Fleshman, W. Tu and J. G. Duh, ''Mis-orientation between the Grains of Cu-Sn IMC from Cu and Cu-Zn Sides in Cu/Sn-3.5Ag/Cu-xZn Microbumps'', Materials Science and Technology2015, Oct. 4-8, 2015, Columbus, Ohio USA.

  • C325. T. T. Chou, W. Y. Chen, C. Fleshman, W. Tu,  C. Lee and J. G. Duh, ''Investigatig the Stability of Hexagonal-(Cu,Ni)6Sn5 Phase with Doping Ni in Pb-Free Solder Joints via First Principle Simulation'', Materials Science and 
    Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

  • C326. Y. Wang, J. W. Lee and J. G. Duh, ''High Temperature Tribological Properties in CrAlSiN/VN Multilayer Coatings'', Materials Science and Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

  • C327. C. Lee, W. Y. Chen, T. T. Chou, Tae Kyu Lee and J. G. Duh, Cisco Systems Inc,
    ''The Investigation of Crack Initiation and Propagation in the Ni(V)/SAC/OSP Cu Solder Joints with High and Low Silver Content during Thermal Cycling Test'', Materials Science and Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

  • C328. J. G. Duh, ''Exploration of Nanocomposite and Nanomultilayer Coating via Hybrid Organic/Inorganic and Bio-inspired Approach'', Materials Science and Technology 2015, C. M. Li Symposium on Nanomechanical Behavior of Material, in Honor of Prof. C. M. Li's 90th Birthday, Oct. 4-8, 2015, Columbus, Ohio USA. (invited talk)

  • C329. S. I. Chuang, C. K. Lan, H. Yang, H. W. Chen and J. G. Duh, "Potential Alternatives for Advanced Energy Material Processing in High Performance Li-ion Batteries via Atmospheric Pressure Plasma Treatment", 9th International Conference on Reactive Plasmas, Oct 12-16, 2015, Honolulu, Hawaii.

  • C330. J. Lee, and J. G. Duh "Applying Composition Control to Enhance the Mechanical an Thermal Properties of Zr-Cu-Ni-Al-N Thin Film Metallic Glass", 9th International Conference on Reactive Plasmas, Oct 12-16, 2015, Honolulu, Hawaii.

  • C331. C. Y. Wu, C. C. Chang and J. G. Duh, ”Silicon nitride coated silicon thin film on three dimensions current collector for lithium ion battery anode“, TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan .

  • C332. C. C. Chang, H. W. Chen, J. W. Lee and J. G. Duh, "Development of Si-modified CrAlSiN Nanocomposite Coating for Anti-wear Application in Extreme Environment", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

  • C333. B. H. Chen, C. K. Lan and J. G. Duh, "The Pitch Free Proceeding of Recycled waste for Si-based lithium ion batteries via C assisted method", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

  • C334. Y. Wang, J. W. Lee and J. G. Duh, "High-temperature Tribological Characteristics in CrAlN/VN Multilayer Coatings", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

  • C335. C. K. Lan and J. G. Duh, "Stable high-rate performance of N-doped carbon overlayer-coated Li4Ti5O12 electrodes prepared by Argon/Nitrgen binary plasma jet irradiation", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

  • C336. H. Yang, S. I. Chuang, H. W. Chen and J. G. Duh, ''Modification of TiO2 powder via atmospheric dielectric barrier discharge treatment for high performance lithium-ion battery anodes'', TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

  • C337. J. Lee and J. G. Duh, "Modification of property in Zr-Cu-Ni-Al-N thin film metallic glass via composition control", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

  • C338. J. G. Duh, ''A Revival of Waste:Atmospheric Pressure Nitrogen Plasma Jet Enhanced Jumbo Silicon/Silicon Carbide Composite in Lithium Ion Batteries'', APSPT-9th/SPSM-28th, Dec 12-15, 2015, Nagasaki University, Bunkyo-Campus, Japan. (plenary talk)

  • C339. T. C. Yang, Y. H. Huang and J. G. Duh , "Novel Lamellar MCMB Supported Sulfur Cones with Carbon Overlayer Coating as Shuttle-effect Barrier for Lithium Sulfur Batteries Cathode", TACT 2015 International Thin Films Conference, 
    Nov 15-18, 2015, Tainan, Taiwan.

  • C340. S. I. Chuang, H. Yang, H. W. Chen and J. G. Duh, ''Modification of TiO2 powder via atmospheric dielectric barrier discharge treatment for high performance lithium-ion battery anodes'', ISPlasma2016/IC-PLANTS2016, Mar 6-10, 2016,
    Nagoya University, Nagoya Japan.

  • C341. Y. Wang, J. W. Lee and J. G. Duh, ''Microstructure Control in Self-lubricating CrAlN/VN Multilayer Coatings for Improved Mechanical Response and High-temperature Tribological Characteristics'', ICMCTF 2016, Apr 25-29,
    San Diego, U.S.A.

  • C342. B. H. Chen, S. I. Chuang and J. G. Duh, "The multiple surface modifications via plasma jet and carbon evaporation to revive the recycled waste from solar industry for Si-based anode materials in lithium ion batteries", Energy Future Conference 2016, Jul. 4-6 2016, University of New South Wales, Sydney, Australia

  • C343. J. Lee and J. G. Duh, "The Development of a Zr-Cu-Al-Ag-N TFMG Coating in Pursuit of Improved Mechanical, Thermal, and Antimicrobial Property for Bio-medical Application", 15th International Conference on Plasma Surface Engineering, Sep. 12-16, 2016, Garmisch-Partenkirchen, Germany.

  • C344. J. G. Duh, "Surface modification of energy materials (Si, Li4Ti5O12, graphene and TiO2) via atmosphere pressure plasma treatment for high performance lithium-ion batteries", 7th International Conference on Surface Engineering, Oct. 22-25, 2016, Chengdu, China. (Prof. Duh Invited talk)

  • C345. C. K. Lan and J. G. Duh, "Improvement of Li4Ti5O12 anode materials via atmosphere pressure irradiation and carbon passivation layer approach for stable high rate lithium-ion batteries", 12th Cross-strait Seminar on thin film Science and Technology, Oct. 22-25, 2016, Chengdu, China.

  • C346. T. T. Chou and J. G. Duh, "The Role of Ultrathin-Ni(P) layer of ENEPIG Metallization in ENEPIG/SAC305/OSP Cu Solder Joints under Thermocycling Test for Automotive Electronics", Materials Science and Technology 2016, Oct. 23-27, 2016, Salt Lake City, USA.

  • C347. R. W. Song and J. G. Duh, "Characterization of Bi-33In Low Temperature Solder with Cu UBM", Materials Science and Technology 2016, Oct. 23-27, 2016, Salt Lake City, USA.

  • C348. Tzu-Ting Chou, Cheng-Ying Ho, Wei-Yu Chen and Jenq-Gong Duh, "Thermocycling Stress Induced Slip Band Sliding in Ultra-thin ENEPIG Joints", The Minerals, Metals & Materials Society 2017, Feb. 26 - Mar. 2, 2017, San Diego, California, USA.

  • C349. C. Fleshman and J. G. Duh, "The Variation of Grain Structure and the Enhancement of Shear Strength in SAC305-0.1Ni/Cu Solder Joint before and after Aging", The Minerals, Metals & Materials Society 2017, Feb. 26 - Mar. 2, 2017, San Diego, California, USA.

  • C350. Rui-Wen Song and Jenq-Gong Duh, "Controlling Interfacial IMC Phase via Modifying Bi Composition in Low Temperature Bi-33In/Cu Solder Joint", The Minerals, Metals & Materials Society 2017, Feb. 26 - Mar. 2, 2017, San Diego, California, USA.

  • C351. Y.J. Chen, Metal Industries R&D Centre (MIRDC) and J.G. DUH, The Development of Ultrathin Zr-Cu-Ni-Al-N Thin Film Metallic Glass as a Diffusion Barrier for Cu-Si Interconnect, ICMCTF 2017, Aprl. 24 - 28, 2017, San Diego, California, USA.

  • C352. Y.C. Lu and J.G. Duh, The Mechanical and Tribological Properties of Nanocomposite CrMoSixN Coatings, ICMCTF 2017, Aprl. 24 - 28, 2017, San Diego, California, USA.

  • C353. C.Y. Wu, J.G. Duh, A New Ionic Network for Aqueous Polymer Binder for Enhancing the Electrochemical Performance of Li-Ion Batteries, 68th ISE,Oct. 27- Nov. 1, 2017, Rhode Island, USA.

  • C354.  H. Yang, J.G. Duh, The electrochemical studies of new substituted olivine LiMn1-xVOxPO4 as a cathode material in LIBs, 68th ISE,Oct. 27- Nov. 1, 2017, Rhode Island, USA.

  • C355. H. Tao, H.W.Chen and J.G. Duh,"Newly-developed CrAlMoSiN Nanocomposite Coating for Enhanced High-temperature Tribological Properties", AEPSE 2017,Sept. 11-15, 2017,jeju island, Korea.

  • C356. L.K. Yeh-Liu, H.W.Chen and J.G. Duh,"Improvement of CrMoN/SiNx Coatings on Mechanical and High Temperature Tribological Properties by Multilayered Architecture Design", AEPSE 2017,Sept. 11-15, 2017,jeju island, Korea.

  • C357. J.G. Duh,"Exploration of Zr-Cu Based Thin Film Metallic Glass for Mechanical Strength, Thermal Stability, Bio-antimicrobial Ability and Diffusion Barrier", ICMSNT 2018, Mar. 30, 2018, Chengdu, China.(keynote speaker)

  • C358. J.G. Duh,"Exploitation of Surface Modification and Architecture Control for Multi-Functional Coatings via Nano-Composite, Multilayer, Hybrid Organic/Inorganic, and Bio-Inspired Approach", ICMCTF 2018, Apr. 25, 2018,San Diego, California, USA.(invited talk)

  • C359 J.G. Duh,"Pursuit of multilayer thin films for multiple function via crystalline/amorphous, organic/inorganic hybrid and bio-inspired approach", LFM 2018, May. 15, 2018, Taipei,Taiwan.(keynote speech)

  • C360 J.G. Duh,"The Joy of Scanning Electron Microscopy", Microscopy and Microanalysis 2018, August. 7, 2018, Baltimore,MD, USA.

  • C361. J.G. Duh,"Exploration of novel anode and cathode materials for advanced Lithium ion battery", FMS 2018, August. 17, 2018, Xiamen, China.(invited talk)

  • C362. R.W. Song and J.G. Duh,"Inhibiting the Large Primary Ag3Sn in Cu/Sn-Ag/ENIG Solder Joints with Additional Pd Depositery", MS&T 2018, Oct.14, 2018, Columbus, USA.

  • C363. T.T. Chou and J.G. Duh,"Improving ball shear strength of lead free solder joint via Ni-doped solder and Ni-based UBM", MS&T 2018, Oct.14, 2018, Columbus, USA.

  • C364. J.G. Duh,"Application of multi component alloys thin films for diffusion barrier in microelectronic", 第十二屆中國表面工程大會, Nov. 10, 2018, Kunming, China.(plenary talk)

  • C365 J.G. Duh,"Exploration of high voltage cathode and high energy/power anode materials for advanced LIB" (invited talk), 2018中國新材料產業發展大會, Dec. 20. 2018, Nanjing, China,(invited talk)

  • C366. J.G. Duh,"Atmosphere pressure plasma treatment of anode materials for advanced lithium-ion batteries" (invited talk), APSE workshop, Jan. 27. 2019, Kuala Lumpur, Malaysia

  • C367. C. Fleshman and J. G. Duh, "The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/Cu and SAC1205-0.1 Ni/Cu solder joint before and after aging",TMS 2019, Mar. 12. 2019, San Antonio, Texas, USA

  • C368. H. Chen and J. G. Duh, "Effect of Ag on Mechanical Properties of Sn-Ag-Cu Micro-BGA Joints", TMS 2019, Mar. 12. 2019, San Antonio, Texas, USA

  • C369. J. G. Duh, ''Surface modification of energy materials via atmosphere pressure plasma treatment for high performance lithium-ion batteries'', 第十三屆海峽兩岸工程材料研討會, Ping-tung, Taiwan​

  • C370 J. G. Duh, The Architecture Design and Novel Material Selection for Improved Reliability of Solder Interconnections in Microelectronic Packaging" (invited talk), International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors VII

  • C370. W.L. Lo, "Improvement of CrMoN/ SiNx Multilayered Coatings on Mechanical and High
    Temperature Tribological Properties", ICMCTF 2019, May. 23. 2019, San Diego, California, USA

  • C371, Y.C. Lin, "Influence of Mo Contents on Elevated Temperature Tribological Characteristics of CrAlMoSiN Nanocomposite Coating", ICMCTF 2019, May. 22. 2019, San Diego, California, USA

  • C372. J.G. Duh, "Multi-functionality of Multi-component Zr-Cu-Ni-Al-N thin films for diffusion barrier, anti-bacteria and bio-compatibility", June. 12. 2019, Kanazawa, Japan

  • C373. J.G.Duh, "Modification and Construction of Cathode Materials for Advanced Li-ion Batteries (plenary talk)", Advanced Ceramics and Application VIII, Sep. 22. 2019, Belgrade, Serbia

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