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International Conference Presentation

1
  • C427. Z.Y. Wu, ''Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu TLP soldering by TCB process '',TMS 2022 Annual Meeting & Exhibition, Feb. 27–Mar. 3, 2022, Anaheim, California, USA

  • C426. J. G. Duh,"Development of Plasma Technology Apply in Semiconductor Industry Wastewater, Energy Storage Materials and Smart Agriculture ", 2020 MRST, Nov. 6. 2020, Taipei, Taiwan

  • C425. J. G. Duh,"Enhancing the Biocompatibility of Cardiovascular Materials and Producing the Nitrogen Fertilizers via Atmospheric Pressure Plasma"The 1st International Symposium on Applied Plasma Science and Engineering for Agro and Bio Industry, Feb. 3. 2020, Chiang Mai, Thailand

  • C424. J. G. Duh,"Mechanical and High Temperature Tribological Performance of High Entropy Nitride Coatings", 2019 Workshop on Structures and Properties of HEAs Program & Abstract,Oct. 25. 2019, Yanghzou, Jiangsu, China

  • C423. Collin Fleshman and J.G Duh, "The fractal nature analysis applied on grain formation SAC305/ OSP Cu and SAC305-0.05Ni/ OSP Cu solder joints", Advanced Ceramics and Application VIII, Sep. 22. 2019, Belgrade, Serbia

  • C422. J.G.Duh, "Modification and Construction of Cathode Materials for Advanced Li-ion Batteries (plenary talk)", Advanced Ceramics and Application VIII, Sep. 22. 2019, Belgrade, Serbia

  • C421. J.G. Duh, "Multi-functionality of Multi-component Zr-Cu-Ni-Al-N thin films for diffusion barrier, anti-bacteria and bio-compatibility", June. 12. 2019, Kanazawa, Japan

  • C420. Y.C. Lin and J. G. Duh, High Entropy Nitride Thin Film (CrAlNbSiV)N for Tribological Characteristics at High Temperature", ICMCTF 2019, May. 23. 2019, San Diego, California, USA

  • C419. W.L. Lo and J. G. Duh, Search of New (AlCrNbSiTiMo)N Coatings for Feasible Application at High Temperature", ICMCTF 2019, May. 23. 2019, San Diego, California, USA

  • C418. Y.C. Lin and J. G. Duh, "Influence of Mo Contents on Elevated Temperature Tribological Characteristics of CrAlMoSiN Nanocomposite Coating", ICMCTF 2019, May. 22. 2019, San Diego, California, USA

  • C417. W.L. Lo and J. G. Duh, "Improvement of CrMoN/ SiNx Multilayered Coatings on Mechanical and High
    Temperature Tribological Properties", ICMCTF 2019, May. 23. 2019, San Diego, California, USA

  • C416. J.G. Duh and J. G. Duh, "The Architecture Design and Novel Material Selection for Improved Reliability of Solder Interconnections in Microelectronic Packaging" (invited talk)",International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors VII, May. 19. 2019, Tokyo, Japan

  • C415. J. G. Duh, ''Surface modification of energy materials via atmosphere pressure plasma treatment for high performance lithium-ion batteries'', 第十三屆海峽兩岸工程材料研討會, Ping-tung, Taiwan

  • C414. H. Chen and J. G. Duh, "Effect of Ag on Mechanical Properties of Sn-Ag-Cu Micro-BGA Joints", TMS 2019, Mar. 12. 2019, San Antonio, Texas, USA

  • C413. C. Fleshman and J. G. Duh, "The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/Cu and SAC1205-0.1 Ni/Cu solder joint before and after aging",TMS 2019, Mar. 12. 2019, San Antonio, Texas, USA

  • C412. J.G. Duh,"Atmosphere pressure plasma treatment of anode materials for advanced lithium-ion batteries" (invited talk), APSE workshop, Jan. 27. 2019, Kuala Lumpur, Malaysia

  • C411. J.G. Duh,"Exploration of high voltage cathode and high energy/power anode materials for advanced LIB" , 2018中國新材料產業發展大會, Dec. 20. 2018, Nanjing, China,(invited talk)

  • C410. H. Tao, W.L Lo, J.W Lee and J.G Duh, " Influence of Mo contents on elevated temperature tribological characteristics of CrAlMoSiN nanocomposite coating", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan

  • C409. L.K Yeh-Liu, Y.C Lin, J.W Lee and J.G Duh, "Improvement of CrMoN/SiNx Coating on Mechanical and High Temperature Tribological Properties by Biomimetic", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan

  • C408. T.T Chou and J.G Duh, "Achieving collapse-free solder joints during reflow process via low melting point mixed solder bonding for 3D-IC application", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan

  • C407. Collin Fleshman and J.G Duh, "The variation of microstructure and the enhancement of shear strength in SAC1205-xNi/OSP Cu solder joint before and after aging", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan

  • C406. R.W Song and Jenq-Gong Duh, "Inhibition of Large Primary Ag3Sn in Cu/Sn-3.5 Ag/Ni-Au MicroBump by Pd Addition", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan

  • C405. H. Chen,T.T. Chou, Collin Fleshman, R.W Song and J.G Duh,"Effect of Ag on Mechanical Properties of Sn-Ag-Cu Flip Chip Solder Joints", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan

  • C404. R.C Chen, L.Y Hsiao, C.Y Wu and J.G Duh,"Enhanced Electrochemical Performance of Silicon Waste  via Rapid Thermal Process for Lithium-ion Battery Anode", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan(poster)

  • C403. C.Y Wu and J.G Duh,"A New Ionic Network of Aqueous Polymer Binder for Enhancing the Electrochemical Performance in Li-ion batteries", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan

  • C402. G.T Ye, P.Y Chen, S.Y Hsu and J.G Duh,"Improving the Cycle Stability of SiOx Anode Material by the Bio-inspired Design of SiOx-PI multilayer structure", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan

  • C401. H.H Lin, H. Yang, C.Y Wu, S.Y Hsu and J.G Duh, "Atmospheric Pressure Plasma Jet Irradiation of N Doped Carbon Decorated on Li4Ti5O12 Electrode as a High Rate Anode Material for Lithium Ion Batteries", 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan(poster)

  • C400. C.Y Wu, H. Yang, C.Y Wu, J.G. Duh ,"Structure Modification of SnS with N-doped Carbon by Polymer Additive Applied in Lithium ion battery, 2018 MRST, Nov. 16-17. 2018,Taichung, Taiwan(poster)

  • C399. J.G. Duh,"Application of multi component alloys thin films for diffusion barrier in microelectronic", 第十二屆中國表面工程大會, Nov. 10, 2018, Kunming, China.(plenary talk)

  • C398. R.W. Song and J.G. Duh,"Inhibiting the Large Primary Ag3Sn in Cu/Sn-Ag/ENIG Solder Joints with Additional Pd Depositery", MS&T 2018, Oct.14, 2018, Columbus, USA.

  • C397. T.T. Chou and J.G. Duh,"Improving ball shear strength of lead free solder joint via Ni-doped solder and Ni-based UBM", MS&T 2018, Oct.14, 2018, Columbus, USA.

  • C396. H. Tao, Y.T. Lai, W.L. Lo and J.G. Duh,"Improving the Hydrophilic Characteristic of Anti-fogging Glass by Atmospheric Pressure Plasma Surface Modification",TACT 2018, Oct. 12-13,2018,Taipei,Taiwan(poster)

  • C395. C.T. Ye, P.Y. Chen, S.Y. Hsu and J.G. Duh,"Investigation of Mechanical Properties of Bio-inspired SiOx/PI Multilayered Thin Film",TACT 2018, Oct. 12-13,2018,Taipei,Taiwan(poster)

  • C394. C.Y. Wu, and J.G. Duh,"Preparation and Characterization of Li(Ni0.5Mn0.3Co0.2)O2 Thin Film as Cathode Electrodes for Lithium Batteries",TACT 2018, Oct. 12-13,2018,Taipei,Taiwan(poster)

  • C393. L.K. Yeh-Liu, Y.T.Lai, Y.C. Lin and J.G. Duh,"Plasma Treated Water Synthesized by Multi-Tubular Dielectric Barrier Discharge System for Agricultural Applications",TACT 2018, Oct. 12-13,2018,Taipei,Taiwan(poster)

  • C392. J.G. Duh,"Development of Li(Ni0.5Mn0.3Co0.2)O2 and LiMn0.8Fe0.2PO4 Thin Film Electrodes for Next Generation Li-ion Batteries", PSE 2018, Sept.17-21, 2018, Garmisch-Partenkirchen, Germany.(poster)

  • C391. J.G. Duh,"Exploration of novel anode and cathode materials for advanced Lithium ion battery", FMS 2018, Aug. 17, 2018, Xiamen, China.(invited talk)

  • C390. J.G. Duh,"Applying SEM, EPMA and EBSD Analytic Techniques on Solder Joint for Microelectronic Package Development", Microscopy and Microanalysis 2018, Aug. 7, 2018, Baltimore,MD, USA.

  • C389. H.H. Lin and J.G. Duh,"One-step C and N co-doped on Li4Ti5O12 electrode by atmospheric pressure plasma treatment",IMLB 2018, Jun.17-22,2018,Kyoto,Japan(poster)

  • C388. C.Y. Wu and J.G. Duh,Flower-like structure of SnS with N-doped carbon via polymer additive for lithium-ion battery and sodium-ion battery"",IMLB 2018, Jun.17-22,2018,Kyoto,Japan(poster)

  • C387. C.Y. Wu and J.G. Duh,"Polymer composites of micro-structured Li2Ni2TeO6 as separator for
    all solid-state lithium battery",IMLB 2018, Jun.17-22,2018,Kyoto,Japan(poster)

  • C386. R.C. Chen, C.Y. Wu and J.G. Duh,"Facile synthesis of micro-sized silicon/carbon composites via
    rapid thermal process for lithium-ion battery anode",IMLB 2018, Jun.17-22,2018,Kyoto,Japan(poster)

  • C385. J.G. Duh,"Pursuit of multilayer thin films for multiple function via crystalline/amorphous, organic/inorganic hybrid and bio-inspired approach", LFM 2018, May. 15, 2018, Taipei,Taiwan.(keynote speech)

  • C384. J.G. Duh,"Exploitation of Surface Modification and Architecture Control for Multi-Functional Coatings via Nano-Composite, Multilayer, Hybrid Organic/Inorganic, and Bio-Inspired Approach", ICMCTF 2018, Apr. 25, 2018,San Diego, California, USA.(invited talk)

  • C383. J.G. Duh,"Exploration of Zr-Cu Based Thin Film Metallic Glass for Mechanical Strength, Thermal Stability, Bio-antimicrobial Ability and Diffusion Barrier", ICMSNT 2018, Mar. 30, 2018, Chengdu, China.(keynote speaker)

  • C382. L.K. Yeh-Liu, H.W.Chen and J.G. Duh,"Improvement on Mechanical and High Temperature Tribological Properties of CrMoN/SiNx by multilayered Architecture ", TACT 2017,Oct. 15-18, 2017,Hualien, Taiwan.(poster)

  • C381. H. Tao, H.W.Chen and J.G. Duh,"The Improvement on High-Temperature Tribological Properties of CrAlSiN Nanocomposite Coating by Mo Doping", TACT 2017,Oct. 15-18, 2017,Hualien, Taiwan.(poster)

  • C380. G.T. Ye, H.W.Chen and J.G. Duh,"Investigation of Electrochemical Properties of Bio-inspired SiOx/PI Multilayered Thin Film Anode for Lithium Ion Batteries", TACT 2017,Oct. 15-18, 2017,Hualien, Taiwan.(poster)

  • C379. H. Tao, H.W.Chen and J.G. Duh,"Newly-developed CrAlMoSiN Nanocomposite Coating for Enhanced High-temperature Tribological Properties", AEPSE 2017,Sept. 11-15, 2017,jeju island, Korea.

  • C378. L.K. Yeh-Liu, H.W.Chen and J.G. Duh,"Improvement of CrMoN/SiNx Coatings on Mechanical and High Temperature Tribological Properties by Multilayered Architecture Design", AEPSE 2017,Sept. 11-15, 2017,jeju island, Korea.

  • C377. Y.T. Liao, H.W.Chen, J.Lee and J.G. Duh,"Enhancing the Biocompatibility of PET and ETFE via Atmospheric Dielectric Barrier Discharge Surface Modifaction", AEPSE 2017,Sept. 11-15, 2017,jeju island, Korea.(poster)

  • C376. G.T. Ye, H.W.Chen and J.G. Duh,"Investigation of Electrochemical Properties of Bio-inspired SiOx/PI Multilayered Thin Film Anode for Lithium Ion Batteries", AEPSE 2017,Sept. 11-15, 2017,jeju island, Korea.(poster)

  • C375. Y.C. Lu and J.G. Duh ,"Exploration of High Temperature Tribological Characteristics of CrMoSiN Nanocomposite via Silicon doping", AEPSE 2017,Sept. 11-15, 2017,jeju island, Korea.(poster)

  • C374. J.Lee and J.G. Duh, "Taguchi Design of Experiment Method and Its Application on Process Optimization of Zr-Cu-Ni-Al-N TFMG Coating in Pursuit of Enhanced Mechanical properties", AEPSE 2017,Sept. 11-15, 2017,jeju island, Korea.(poster)

  • C373. W.T.Tsou, C.Y. Wu and J.G. Duh, Enhanced Electrochemical Properties of Nb-TiO2/Sulfur Dual Layered Structure Applied to Lithium-Sulfur Batteries, 68th ISE,Oct. 27- Nov. 1, 2017, Rhode Island, USA(poster)

  • ​​C372. H. Yang, J.G. Duh, The electrochemical studies of new substituted olivine LiMn1-xVOxPO4 as a cathode material in LIBs, 68th ISE,Oct. 27- Nov. 1, 2017, Rhode Island, USA

  • ​​C371. C.Y. Wu, J.G. Duh, A New Ionic Network for Aqueous Polymer Binder for Enhancing the Electrochemical Performance of Li-Ion Batteries, 68th ISE,Oct. 27- Nov. 1, 2017, Rhode Island, USA

  • C370. Y.J. Chen, Metal Industries R&D Centre (MIRDC) and J.G. DUH, The Development of Ultrathin Zr-Cu-Ni-Al-N Thin Film Metallic Glass as a Diffusion Barrier for Cu-Si Interconnect, ICMCTF 2017, Aprl. 24 - 28, 2017, San Diego, California, USA.

  • C369. Y.C. Lu and J.G. Duh, The Mechanical and Tribological Properties of Nanocomposite CrMoSixN Coatings, ICMCTF 2017, Aprl. 24 - 28, 2017, San Diego, California, USA.

  • C368. Tzu-Ting Chou, Cheng-Ying Ho, Wei-Yu Chen and Jenq-Gong Duh, "Thermocycling Stress Induced Slip Band Sliding in Ultra-thin ENEPIG Joints", The Minerals, Metals & Materials Society 2017, Feb. 26 - Mar. 2, 2017, San Diego, California, USA.

  • C367. C. Fleshman and J. G. Duh, "The Variation of Grain Structure and the Enhancement of Shear Strength in SAC305-0.1Ni/Cu Solder Joint before and after Aging", The Minerals, Metals & Materials Society 2017, Feb. 26 - Mar. 2, 2017, San Diego, California, USA.

  • C366. Rui-Wen Song and Jenq-Gong Duh, "Controlling Interfacial IMC Phase via Modifying Bi Composition in Low Temperature Bi-33In/Cu Solder Joint", The Minerals, Metals & Materials Society 2017, Feb. 26 - Mar. 2, 2017, San Diego, California, USA.

  • C365. Y. C. Lu, C. C. Chang and J. G. Duh ''Investigating tribological properties of nanocomposite  CrMoSixN coatings at elevated temperature'', 2016 MRST, Nov. 19-20, 2016, ITRI, Hisnchu, Taiwan.(poster)

  • C364. R. W. Song, W. Y. Chen and J. G. Duh, "Grain structure modification of Cu-Sn IMCs by applying Cu-Zn UBM on transient liquid-phase bonding in novel 3D-IC Technologies", 2016 MRST, Nov. 19-20, 2016, ITRI, Hisnchu, Taiwan.(poster)

  • C363. C. Fleshman, W. Y. Chen, T. T. Chou and J. G. Duh, "The variation of grain structure and the enhancement of shear strength in SAC305-0.1Ni/OSP Cu solder joint", 2016 MRST, Nov. 19-20, 2016, ITRI, Hisnchu, Taiwan.(poster)

  • C362. H. Yang and J. G. Duh, "Fabricating TiO2 nanoplates with uniform mesopores for high-rate Sodium-ion battery", 2016 MRST, Nov. 19-20, 2016, ITRI, Hisnchu, Taiwan.(poster)

  • C361. J. Lee and J. G. Duh ''The development of ultrathin Zr-Cu-Ni-Al-N thin film metallic glass as a diffusion barrier in Cu-Si interconnect'', Nov. 19-20 2016, ITRI, Taiwan.(poster)

  • J. G. Duh, "回首四十年材料路", Nov. 19-20 2016, ITRI, Taiwan. (Invited talk)

  • C360. Y. C. Lu, C. C. Chang and J. G. Duh ''Investigating tribological properties of nanocomposite  CrMoSixN coatings at elevated temperature'', TACT2016, Nov. 11-12 2016, National Pingtung University of Science and Technology, Taiwan.(poster)

  • C359. J. Lee and J. G. Duh ''The development of ultrathin Zr-Cu-Ni-Al-N thin film metallic glass as a diffusion barrier in Cu-Si interconnect'', TACT2016, Nov. 11-12 2016, National Pingtung University of Science and Technology, Taiwan.(poster)

  • C358. R. W. Song and J. G. Duh, "Characterization of Bi-33In Low Temperature Solder with Cu UBM", Materials Science and Technology 2016, Oct. 23-27, 2016, Salt Lake City, USA.

  • C357. T. T. Chou and J. G. Duh, "The Role of Ultrathin-Ni(P) layer of ENEPIG Metallization in ENEPIG/SAC305/OSP Cu Solder Joints under Thermocycling Test for Automotive Electronics", Materials Science and Technology 2016, Oct. 23-27, 2016, Salt Lake City, USA.

  • C356. C. K. Lan and J. G. Duh, "Improvement of Li4Ti5O12 anode materials via atmosphere pressure irradiation and carbon passivation layer approach for stable high rate lithium-ion batteries", 12th Cross-strait Seminar on thin film Science and Technology, Oct. 22-25, 2016, Chengdu, China.

  • C355. J. G. Duh, "Surface modification of energy materials (Si, Li4Ti5O12, graphene and TiO2) via atmosphere pressure plasma treatment for high performance lithium-ion batteries", 7th International Conference on Surface Engineering, Oct. 22-25, 2016, Chengdu, China. (Prof. Duh Invited talk)

  • C354. H. Yang and J. G. Duh, "Constructing Titania nanoplates with uniform particle arrays for Lithium-ion and Sodium-ion battery", Advanced Energy Materials, Sep. 12-14, 2016, University of Surrey, Guildford, England. (poster)

  • C353. C. Y. Wu, W. E. Chang, Y. G. Sun, J. M. Wu and J. G. Duh, "Creating MoS2 @ α-Fe2O3 nanoclusters with three dimensional binary composite as lithium ion battery anodes for enhanced electrochemical performance", Advanced Energy Materials, Sep. 12-14, 2016, University of Surrey, Guildford, England. (poster)

  • C352. J. Lee and J. G. Duh, "The Development of a Zr-Cu-Al-Ag-N TFMG Coating in Pursuit of Improved Mechanical, Thermal, and Antimicrobial Property for Bio-medical Application", 15th International Conference on Plasma Surface Engineering, Sep. 12-16, 2016, Garmisch-Partenkirchen, Germany.

  • C351. B. H. Chen, S. I. Chuang and J. G. Duh, "The multiple surface modifications via plasma jet and carbon evaporation to revive the recycled waste from solar industry for Si-based anode materials in lithium ion batteries", Energy Future Conference 2016, Jul. 4-6 2016, University of New South Wales, Sydney, Australia

  • C350. Y. Wang, J. W. Lee and J. G. Duh, ''Microstructure Control in Self-lubricating CrAlN/VN Multilayer Coatings for Improved Mechanical Response and High-temperature Tribological Characteristics'', ICMCTF 2016, Apr 25-29,
    San Diego, U.S.A.

  • C349. S. I. Chuang, H. Yang, H. W. Chen and J. G. Duh, ''Modification of TiO2 powder via atmospheric dielectric barrier discharge treatment for high performance lithium-ion battery anodes'', ISPlasma2016/IC-PLANTS2016, Mar 6-10, 2016,Nagoya University, Nagoya Japan.

  • C348. T. C. Yang, Y. H. Huang and J. G. Duh , "Novel Lamellar MCMB Supported Sulfur Cones with Carbon Overlayer Coating as Shuttle-effect Barrier for Lithium Sulfur Batteries Cathode", TACT 2015 International Thin Films Conference, 
    Nov 15-18, 2015, Tainan, Taiwan.

  • C347. J. G. Duh, ''A Revival of Waste:Atmospheric Pressure Nitrogen Plasma Jet Enhanced Jumbo Silicon/Silicon Carbide Composite in Lithium Ion Batteries'', APSPT-9th/SPSM-28th, Dec 12-15, 2015, Nagasaki University, Bunkyo-Campus, Japan. (plenary talk)

  • C346. H. Yang and J. G. Duh, ''Constructing Titania nanoplates with uniform particle arrays for high-rate capabilities of Lithium-ion and Sodium-ion battery'', Material Research Society Fall Meeting and Exhibit, Nov 24- Dec 4, 2015, Massachusetts, Boston, USA. (Poster)

  • C345. C. Y. Wu, C. C. Chang and J. G. Duh, ''Enhanced Cycling Efficiency and Rate Capability of Silicon nitride coated Silicon on Copper Cones for Thin Film Lithium-Ion Battery'', Material Research Society Fall Meeting and Exhibit, Nov 24- Dec 4, 2015, Massachusetts, Boston, USA. (Poster)

  • C344. T. H. Gee, Y. H. Huang and J. G. Duh, "Well Dispersive Nano-Si/Carbon matrix via In-spaced Carbonization as High Performance Lithium Ion Battery Anodes", Material Research Society Fall Meeting and Exhibit, Nov 24- Dec 4, 2015, Massachusetts, Boston, USA. (Poster)

  • C343. W. Tu, W. Y. Chen, T. T. Chou and J. G. Duh, "The microstructure evolution in Cu/Sn-3.5Ag/ENIG (wt %) microbumps", 中國材料科學學會年會, Nov 20-22, 2015, Kaohsiung, Taiwan.(Poster)

  • C342. C. C. Chang, H. W.  Chen, J. W. Lee, J. G. Duh, "Development of Si-modified CrAlSiN Nanocomposite Coating for Anti-wear Application in Extreme Environment", 中國材料科學學會年會, Nov 20-22, 2015, Kaohsiung, Taiwan.(Poster)

  • C341. C. Lee, W. Y. Chen, T. T. Chou, T. K. Lee, and J. G. Duh,”The investigation of interfacial and crystallographic observation in the Ni(V)/ SAC/OSP Cu solder joints with high and low silver content during thermal cycling”, 中國材料科學學會年會, Nov 20-22, 2015, Kaohsiung, Taiwan.(Poster)

  • C340. C. Liu, S. I. Chuang, W. T. Wong and J. G. Duh "Nitrogen-doping of ZnCo2O4 Anode via Atomospheric Pressure Plasma Treatment for Enhanced Electrochemical Performances", TACT 2015 International Thin Films Connference, Nov 15-18, 2015, Tainan, Taiwan. (Poster)

  • C339. T. H. Gee, W. Y. Chou and J. G. Duh, "Enhanced Rate Capability of Spinel LiNi0.5Mn1.5O4 Cathodes with Carbon Overlayer Coating", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan. (Poster)

  • C338. P. W. Chen, H. W. Chen, P. Y. Chen and Jenq-Gong Duh, "Characteristics of Hybrid Titanium Dioxide /Polyimide Multilayered Thin Films", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan. (Poster)

  • C337. J. Lee and Jenq-Gong Duh, "Modification of property in Zr-Cu-Ni-Al-N thin film metallic glass via composition control", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

  • C336. H. Yang, S. I. Chuang, H. W. Chen and J. G. Duh, ''Modification of TiO2 powder via atmospheric dielectric barrier discharge treatment for high performance lithium-ion battery anodes'', TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

  • C335. C. K. Lan and Jenq-Gong Duh, "Stable high-rate performance of N-doped carbon overlayer-coated Li4Ti5O12 electrodes prepared by Argon/Nitrgen binary plasma jet irradiation", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

  • C334. Y. Wang, J. W. Lee and Jenq-Gong Duh, "High-temperature Tribological Characteristics in CrAlN/VN Multilayer Coatings", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

  • C333. B. H. Chen, C. K. Lan and J. G. Duh, "The Pitch Free Proceeding of Recycled waste for Si-based lithium ion batteries via C assisted method", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

  • C332. C. C. Chang, H. W. Chen, J. W. Lee and J. G. Duh, "Development of Si-modified CrAlSiN Nanocomposite Coating for Anti-wear Application in Extreme Environment", TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan.

  • C331. C. Y. Wu, C. C. Chang and J. G. Duh, ”Silicon nitride coated silicon thin film on three dimensions current collector for lithium ion battery anode“, TACT 2015 International Thin Films Conference, Nov 15-18, 2015, Tainan, Taiwan .

  • C330. J. Lee, and J. G. Duh "Applying Composition Control to Enhance the Mechanical an Thermal Properties of Zr-Cu-Ni-Al-N Thin Film Metallic Glass", 9th International Conference on Reactive Plasmas, Oct 12-16, 2015, Honolulu, Hawaii.

  • C329. S. I. Chuang, C. K. Lan, H. Yang, H. W. Chen and J. G. Duh, "Potential Alternatives for Advanced Energy Material Processing in High Performance Li-ion Batteries via Atmospheric Pressure Plasma Treatment", 9th International Conference on Reactive Plasmas, Oct 12-16, 2015, Honolulu, Hawaii.

  • C328. J. G. Duh, ''Exploration of Nanocomposite and Nanomultilayer Coating via Hybrid Organic/Inorganic and Bio-inspired Approach'', Materials Science and Technology 2015, C. M. Li Symposium on Nanomechanical Behavior of Material, in Honor of Prof. C. M. Li's 90th Birthday, Oct. 4-8, 2015, Columbus, Ohio USA. (invited talk)

  • C327. C. Lee, W. Y. Chen, T. T. Chou, Tae Kyu Lee and J. G. Duh, Cisco Systems Inc,''The Investigation of Crack Initiation and Propagation in the Ni(V)/SAC/OSP Cu Solder Joints with High and Low Silver Content during Thermal Cycling Test'', Materials Science and Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

  • C326. Y. Wang, J. W. Lee and J. G. Duh, ''High Temperature Tribological Properties in CrAlSiN/VN Multilayer Coatings'', Materials Science and Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

  • C325. T. T. Chou, W. Y. Chen, C. Fleshman, W. Tu,  C. Lee and J. G. Duh, ''Investigatig the Stability of Hexagonal-(Cu,Ni)6Sn5 Phase with Doping Ni in Pb-Free Solder Joints via First Principle Simulation'', Materials Science and Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

  • C324. W. Y. Chen, C. Fleshman, W. Tu and J. G. Duh, ''Mis-orientation between the Grains of Cu-Sn IMC from Cu and Cu-Zn Sides in Cu/Sn-3.5Ag/Cu-xZn Microbumps'', Materials Science and Technology2015, Oct. 4-8, 2015, Columbus, Ohio USA.

  • C323. W. Tu, W. Y. Chen, T. Chou, J. G. Duh, ''The Microstructure Evolution in Cu/Sn-3.5Ag/ENIG(wt%) Microbumps'', Materials Science and Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

  • C322. C. Fleshman, W. Y. Chen, T. T. Chou, T. K. Lee, Tae Kyu Lee and J. G. Duh, National Tsing Hua University; Cisco Systems Inc, ''The Variation of Grain Structure and the Enhancement of Shear Strength in SAC305-0.1Ni/OSP Cu Solder Joint'', Materials Science and Technology 2015, Oct. 4-8, 2015, Columbus, Ohio USA.

  • C321. C.C.Chang and J.G.Duh, "Ultra-High Temperature Tribological Characteristics in Si Modified CrAlSiN Nanocomposite Coatings", 10th Anniversary AEPSE Conference, Sep. 20-24, 2015, Korea.

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